JPH06104587A - Package mounting device - Google Patents

Abstract

PURPOSE:To provide a package mounting device which can dissipate heat efficiently from a plurality of units without causing increase in price or installation space. CONSTITUTION:Vents 4, 12, 13 are made through the opposite side faces 2, 3 and the upper and lower faces 10, 11 of a device. Guides 6 for fixing a package 5 in an inclining state so that the air introduced through the vent 4 in one side face 2 will convect are further provided on the opposite insides of the device. Consequently, heat generated from the device can be discharged from the other side face 3 of the device without requiring any special means for dissipating heat.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package mounting apparatus for mounting a communication device, a computer or the like as a package in a unit, and more particularly, to dissipate heat generated from a mounted component to the outside of the apparatus by convection induction.

[0002]

2. Description of the Related Art Communication devices, computers, etc. are often mounted as packages. The shape of the electric parts held in this package tends to be smaller year by year, and the mounting density in the unit is increasing. As the density increases, it is necessary to take measures to dissipate the heat generated from the electric components held. As a measure for heat dissipation, it has been widely practiced to install a convection guide plate on the unit.

FIG. 3 is a perspective view of the unit 20. An inclined plate 21 for guiding convection is provided on the upper portion, and side plates 22 are provided on both sides of the inclined plate 21. The package 24 holding the electric components is fixed in the unit 20 through package insertion grooves formed on the upper and lower surfaces of the unit 20. Ventilation holes 25 for heat dissipation are formed between the package insertion grooves. A back wire board (not shown) for connecting the individual packages 24 is mounted on the rear surface of the unit 20. With this configuration, the package 2 can be installed in the unit 20.
When 4 is inserted and fixed, the side surface and the rear surface of the unit 20 are hermetically sealed, and the upper and lower surfaces and the front surface serve as convection passages.

FIG. 4 is a sectional view showing a state in which the units 20a to 20n are stacked. As shown in the figure, the inclined plates 21a to 21n inclined from the lower part of the package insertion surface side of the upper part of the units 20a to 20n toward the upper part of the rear surface are
They are aligned vertically. Note that 26a to 26n
Is a back wire board. Bottom unit 20
The cool air (indicated by broken lines) sucked through the ventilation holes formed on the package insertion surface side and the lower surface of the
0a, the side plate 22a passes through the ventilation hole formed on the upper surface.
Then, the heat generated from the package 24 is guided to the rear surface side while being guided by the inclined plate 21a, and is discharged from the rear surface side.

Unit 2 above the lowermost unit 20a
As for 0b, the cold air is sucked into the unit 20b as indicated by a broken line and discharged from the rear surface side from the package insertion surface side and the ventilation holes formed on the lower surface of the unit by being guided by the inclined plate 21a of the unit 20a. . The same applies to each unit above the unit 20b.

[0006]

However, in the conventional package mounting apparatus, since the side plate 22 and the inclined plate 21 are provided for convection to dissipate the heat generated in the unit, the size of the apparatus becomes large and the apparatus becomes large. There was a problem that it caused the price increase of. On the other hand, if the side plate 22 and the inclined plate 21 are not provided in order to reduce the cost, the plurality of units cannot be stacked and must be arranged side by side in the horizontal direction.
Then, there arises a problem that the installation space is increased.

The present invention is proposed to solve the above-mentioned problems, and the heat generated in a plurality of units can be efficiently dissipated without increasing the price or increasing the installation space. It is intended to provide a mounting device.

[0008]

In order to achieve the above-mentioned object, the present invention has ventilation holes formed on both side surfaces and upper and lower surfaces of the apparatus body, and the ventilation holes on one side surface of the apparatus body are provided inside both side surfaces of the apparatus body. A package mounting apparatus is provided in which a guide for placing the package in an inclined state is provided so as to guide convection of the air introduced from the apparatus, and heat generated in the apparatus is discharged from the other side surface of the apparatus body.

[0009]

As described above, since the package is mounted so that the air sucked into the unit can be convected, it is not necessary to provide any means for dissipating the heat generated in the unit. Allows stacking of units.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the unit 1.
Ventilation holes 4 are formed on both side surfaces 2 and 3 of the unit 1, and guides 6 for mounting a package 5 are provided inside the side surfaces. It should be noted that the package 5 holds electrical components. The guides 6 have a step difference between the guides 6 facing each other so that the mounted package 5 is placed with a constant inclination angle from one side surface 2 to the other side surface 3 of the unit 1.

The front surface 8 of the unit 1, which is the insertion side of the package 5, is designed to be closed by a sheet metal or the like after all the predetermined packages 5 are mounted in the unit 1. The rear surface 9 of the unit 1 is provided with a back wire board for interconnection between the packages 5.
The upper and lower surfaces 10 and 11 of the unit 1 respectively have ventilation holes 1
Even if the units 1 and 2 are formed and the units 1 are stacked, ventilation is possible between the units 1.

FIG. 2 is a sectional view showing a state in which the units 1 are stacked. The operation of this embodiment will be described with reference to FIG. In the stacked units 1a to 1n, all the packages 5 mounted in each unit 1
a to 1n from one side surface 2a to 2n to the other side surface 3a to
It is placed with a constant inclination angle over 3n.
Since the front surface and the rear surface of the unit are hermetically sealed, the cold air outside the unit is one side surface 2a-2 of the unit 1a-1n.
n is taken into the unit and the other side surfaces 3a to 3n
Is discharged from.

The broken line display shows the above-mentioned convection state. The cold air flows on one side surface 2 of the units 1a to 1n.
Ventilation holes formed in a to 2n (not shown)
The heat is discharged to the outside of the unit while being guided to the other side surfaces 3a to 3n while being guided to the surfaces of the packages 5a to 5n mounted in the units 1a to 1n. In this case, convection between the joined units is performed through ventilation holes (not shown) formed on the upper and lower surfaces of the units.

[0014]

As described above, according to the present invention, the package is mounted so that the air sucked into the unit can be convected. Therefore, the package itself serves as an air guiding means to dissipate the heat generated in the unit. There is no need to provide it. Therefore, it is possible to realize cost reduction and prevent expansion of the unit installation area due to stacking of a plurality of units.

[Brief description of drawings]

FIG. 1 is a perspective view of a unit according to the present invention.

FIG. 2 is a sectional view showing a state of convection in stacked units.

FIG. 3 is a perspective view of a unit according to a conventional example.

FIG. 4 is a sectional view showing a state of convection in stacked units.

[Explanation of symbols]

 1 unit 2 side surface 3 side surface 4 ventilation hole 5 package 6 guide 7 electric component 8 front surface 9 rear surface 10 upper surface 11 lower surface 12 ventilation hole 13 ventilation hole

Claims (1)

[Claims] 1. Ventilation holes are formed on both side surfaces and upper and lower surfaces of the apparatus body, and the package is installed in an inclined state inside both side surfaces of the apparatus body so as to convect the air introduced from the ventilation holes on one side surface of the apparatus body. A package mounting device, characterized in that a guide is provided so that heat generated in the device is discharged from the other side surface of the device body.