KR100669795B1 - Plasma display apparatus - Google Patents

Abstract

The present invention provides a structure in which an air flow path member is installed on a lower side of a heat dissipation plate installed for heat dissipation of an integrated circuit chip controlling a driving of a plasma display panel and rapid cooling is performed by forcibly flowing air through a fan, and the heat dissipation performance is increased. In order to achieve the above object, the present invention provides a plasma display device having a plasma display module for implementing an image using gas discharge; A case accommodating the plasma display module; At least one fan disposed in the case to introduce air; And an air flow passage member disposed at the rear of the plasma display module to flow air introduced by the fan toward the plasma display module, wherein the case comprises a front case and a rear case having at least one opening. Is coupled to the air flow path member has an inlet for introducing air, a passage defining a flow passage of the air and an outlet for outflow of the air, the inlet is disposed to face the fan, the outflow The unit has at least one outlet and is disposed to face the plasma display module.

Description

Plasma display apparatus

1 is a schematic cross-sectional view showing a portion of a conventional plasma display device.

2 is an exploded perspective view of the plasma display device according to the first embodiment of the present invention.

3 is a cross-sectional view taken along line III-III of FIG. 2.

4 is a cross-sectional view taken along the line IV-IV of FIG. 2.

5 is a perspective view of the air flow passage member shown in FIG. 2.

6 is a right side view of the air flow passage member shown in FIG. 2.

7 is an exploded perspective view of a plasma display device according to a second embodiment of the present invention.

8 is a cross-sectional view taken along the line VII-VII of FIG. 7.

9 is a cross-sectional view taken along the line VII-VII of FIG. 7.

FIG. 10 is a perspective view of the air passage member shown in FIG. 7.

<Explanation of symbols for the main parts of the drawings>

1, 100: plasma display device

10, 110: plasma display module

20, 120: plasma display panel 30, 130: chassis

40, 140: driving circuit board 50, 150: signal transmission means

60, 160: heat dissipation plate 70, 170: case

180, 280: air flow path member 181, 281: inlet

182, 282: passage portion 182a: diffusion portion

182b: guide section 183, 283: outlet section

190: fan

The present invention relates to a plasma display device, and more particularly, an air flow path member is installed below a heat dissipation plate installed for heat dissipation of an integrated circuit chip controlling a driving of a plasma display panel, and forced air flows through a fan. The present invention relates to a plasma display device having a structure in which rapid cooling is possible and heat dissipation performance is increased.

BACKGROUND ART In general, a plasma display device is a flat panel display device that displays an image by using a gas discharge phenomenon, and has been spotlighted as a next-generation flat panel display device because it can be thinned and can realize a large screen having a wide viewing angle.

1 is a cross-sectional view of a portion of a conventional plasma display device. Referring to the drawings, the plasma display apparatus 1 includes a plasma display panel 20 which is formed by combining the front panel 21 and the rear panel 22 and displays an image using plasma discharge, and the plasma display panel. A plasma display module having a chassis 30 supporting the plasma display panel at a rear of the 21 and a driving circuit board 40 disposed at the rear of the chassis and generating an electrical signal applied to the plasma display panel. 10) and a case 70 for accommodating the same.

In addition, the plasma display panel 20 and the driving circuit board 40 is further provided with a signal transmission means 50, the signal transmission means 50 is a connection called a tape carrier package (TCP) As the cable 51, the integrated circuit chip 52 is mounted in this connecting cable 51. As shown in FIG.

When the plasma display device is driven, since a large amount of heat is generated in the integrated circuit chip 52 that applies a signal to the plasma display panel 20, it is necessary to radiate it smoothly. As shown in FIG. 1, conventionally, a predetermined portion of the connection cable 51 on which the integrated circuit chip 52 is located is covered with a heat dissipation plate 60, and the integrated circuit chip 52 and the heat dissipation plate are provided. Thermal grease was interposed between 60 to dissipate heat transferred to the heat dissipation plate 60 by natural convection.

However, this type of HD plasma display device employing a single scan driving method generates a large amount of heat from an integrated circuit chip. In this case, the heat collecting circuit chip cannot heat more quickly. There was a problem of malfunction due to stress.

The present invention has been made to solve the above problems, by installing an air flow path member on the lower side of the heat dissipation plate installed for heat dissipation of the integrated circuit chip that controls the driving of the plasma display panel by forcing the flow of air by the fan It is an object of the present invention to provide a plasma display device having a structure capable of rapid cooling and increased heat dissipation performance.

In order to achieve the above object and other objects, the present invention, a plasma display module for implementing an image using a gas discharge; A case accommodating the plasma display module; At least one fan disposed in the case to introduce air; And an air flow passage member disposed at the rear of the plasma display module to flow air introduced by the fan toward the plasma display module, wherein the case comprises a front case and a rear case having at least one opening. Is coupled to the air flow path member has an inlet for introducing air, a passage defining a flow passage of the air and an outlet for outflow of the air, the inlet is disposed to face the fan, the outflow The unit has at least one outlet and is disposed to face the plasma display module.

Therefore, the plasma display device has a structure in which rapid cooling is possible and the heat dissipation performance is increased by forcibly flowing air by the fan and guiding the air to a desired position through the air flow path member to cool the heat dissipation plate by impingement cooling. Can be provided.

The plasma display module may include a plasma display panel configured to display an image using plasma discharge; A chassis supporting the plasma display panel behind the plasma display panel; A driving circuit board disposed behind the chassis and generating an electrical signal applied to the plasma display panel; A signal transfer means mounted with an integrated circuit chip for applying an electrical signal to the plasma display panel and electrically connecting the plasma display panel and the driving circuit board; And at least one heat dissipation plate disposed at the rear of the plasma display module and covering the signal transfer means portion on which the integrated circuit chip is mounted.

In this case, the outlet is preferably formed to face the heat dissipation plate and have an opening area exceeding the area of the heat dissipation plate.

In addition, the fan is disposed on the lower wall of the rear case, the air flow path member is preferably disposed on the lower wall of the case so that the inlet is opposed to the fan.

Here, the passage portion of the air flow path member is preferably provided with a diffusion portion in which the introduced air is diffused and a guide portion formed in succession to the diffusion portion to guide the diffused air toward the outlet portion. In this case, it is more preferable that the diffusion portion is curved to be convex toward the inside of the air flow path member, and the guide portion is more preferably curved such that a cross-sectional shape perpendicular to the longitudinal direction is convex toward the outside of the air flow path member.

On the other hand, the fan is disposed below the rear wall of the rear case, the air flow path member is preferably disposed on the rear wall lower side of the rear case so that the inlet is opposed to the fan.

Here, the passage portion of the air passage member is preferably curved to be convex toward the inside of the air passage member.

In addition, the plasma display apparatus preferably employs a single scan method for applying an address signal.

Hereinafter, a plasma display device according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is an exploded perspective view of the plasma display device according to the first embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2, and FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 2. to be.

2 and 3, the plasma display device according to the first embodiment of the present invention includes a plasma display module 110 and a case 170.

The plasma display module 110 is disposed on a plasma display panel 120 displaying an image using plasma discharge, a chassis 130 supporting the plasma display panel behind the plasma display panel, and a rear of the chassis. And a driving circuit board 140 for generating an electrical signal applied to the plasma display panel, and signal transmission means 150 for electrically connecting the plasma display panel 120 and the driving circuit board 140 to each other. In addition, the case 170 accommodating the plasma display module 120 includes a front case such as a front cabinet 171 disposed at the front of the module 110 and a back cover disposed at the rear of the module 110. A rear case such as 172 may be provided.

The plasma display panel 120 is formed by combining the front panel 121 and the rear panel 122. As the structure of the plasma display panel 120, various structures such as a three-electrode surface discharge structure or a two-electrode counter discharge structure may be employed, and the present invention is not limited to the structure of any one of the plasma display panels. The structure and driving method of the plasma display panel 120 will be apparent to those skilled in the art and thus will not be described in detail herein.

The chassis 130 may be manufactured by casting or press working, and supports the plasma display panel 120 and the driving circuit board 140 from the front and the rear, respectively. The chassis 130 may be formed using a metal having high thermal conductivity such as aluminum to effectively dissipate heat transferred from the plasma display panel 120. In detail, the chassis 130 may prevent the deformation of the base portion 131 supporting the plasma display panel 120 and the driving circuit board 140 and the bending or bending of the chassis 130. A bend portion 132 is provided to impart rigidity to 130. The bent portion 132 is bent backward from one side end of the chassis 130 and serves as a support portion on which the signal transmission means 150 is seated, and the shape of the bent portion 132 is It is not limited and may be made of other types of structures. The chassis 130 is responsible for supporting the plasma display panel 120 and the driving circuit board 140 and for discharging heat transferred from the plasma display panel 120. Preferably, the plasma display panel 120 and the chassis 130 are bonded to each other through a double-sided tape 125, and heat generated in the panel 120 is interposed between the plasma display panel 120 and a thermal conductive sheet 126 therebetween. It is desirable to allow this to be delivered.

The driving circuit board 140 is responsible for applying a power source and an electrical signal for generating a gas discharge so that the plasma display panel 120 can implement a predetermined image. A plurality of devices for applying an electrical signal to the plasma display panel 120 may be disposed on the upper sphere driving circuit board 140.

In addition, the signal transmission means 150 includes a connection cable 151 and an integrated circuit chip 152. As the signal transmission means 150, a tape carrier package (TCP), a chip on film (COF), or the like may be employed. In the first and second embodiments of the present invention, a tape-type connection cable 151 is provided. At least one device 152, for example, an integrated circuit chip mounted TCP is employed as will be described below. In the connecting cable 151, a plurality of conductive wires extend in the longitudinal direction of the signal transmitting means 150, and at least some of the conductive wires are mounted on the signal transmitting means 150. ) Is connected.

In front of the plasma display module 110, a filter 123 made of a transparent material and having an electromagnetic shielding layer is preferably disposed. The filter 123 may be installed to block reflection of electromagnetic waves, infrared rays, neon light emission, or external light generated from the plasma display panel 120. Although not shown in FIG. 2, the filter 123 may be in close contact with the front cabinet 171 by a filter holder (not shown).

The front cabinet 171 may have a substantially rectangular frame structure in which a window is formed in the center. A plurality of openings 172a may be formed in the back cover 172 so that air is communicated between the inside and the outside of the plasma display device. The opening 172a may be formed over a portion of the upper surface of the back cover 172 and the upper surface of the rear surface, and may have various other arrangement structures for improving the exhaust performance of the plasma display apparatus.

Although the upper and rear surfaces of the back cover 172 are bent at right angles to each other, it is shown in FIG. 2, but the present invention is not limited thereto. Preferably, the back cover 172 is the back cover. The front surface may be formed between the upper surface and the rear surface of 172, that is, the upper cross section of the back cover 172 may have a cross-sectional structure having a trapezoidal shape, and also between the lower surface and the rear surface of the back cover 172. The front surface may be formed, that is, the lower cross section of the back cover 172 may be formed to have a cross-sectional structure having a trapezoidal shape, or may be formed to have a similar or other various cross-sectional shapes.

In the plasma display apparatus of the present invention having the structure as described above, in order to implement a predetermined image in the plasma display panel 120, a signal applied from the integrated circuit chip 152 is applied along the connection cable 151. It is applied to electrodes (not shown) disposed in the plasma display panel 121. In addition, a discharge is generated in the plasma display panel by a potential applied to the electrode, thereby realizing an image.

On the other hand, since the integrated circuit chip 152 has to process a large amount of signals for a short time in order to control the driving of the plasma display panel in response to an external image signal, a large number of switching operations are required, and due to this excessive switching operation Heat is generated. However, since the integrated circuit chip 152 is formed of a semiconductor device, its electrical characteristics are very sensitive to heat. Therefore, when the heat dissipation of the integrated circuit chip 152 is insufficient, the integrated circuit chip 152 may malfunction, and the plasma display panel 120 may not implement an image corresponding to an external image signal. Or a distorted image. In addition, if the problem due to high heat lasts for a long time, the integrated circuit chip 152 loses its function and the product life of the plasma display device is reduced.

On the other hand, the heat dissipation problem of the integrated circuit chip may be a greater problem in the HD-class plasma display device that implements high quality. That is, since HD class plasma display device has to implement more detailed images than conventional SD class, the amount of information to be processed in a short time increases, and thus, switching operation of integrated circuit chips must be performed more frequently and faster. There is a need to do it. In the HD-class plasma display device employing a single scan driving method, a large amount of heat is generated in the integrated circuit chip 152, and when the integrated circuit chip 152 is not quickly dissipated, the integrated circuit chip 152 Thermal stress can cause malfunctions.

In order to solve the heat dissipation problem of the integrated circuit chip, the heat dissipation plate 160 may be provided. As shown in FIG. 3, the heat dissipation effect may be increased by covering a predetermined portion of the connection cable 151 where the integrated circuit chip 152 is located with the heat dissipation plate 160 having the device seating groove 161. .

This will be described in more detail. The heat dissipation plate 160 may be installed on the base 131 of the chassis 130. The heat dissipation plate 160 includes a device seating groove 161 on which the integrated circuit chip 152 may be seated. Heat generated in the integrated circuit chip 152 is transferred to the heat dissipation plate 160, and is radiated by heat exchange with surrounding air on the surface of the heat dissipation plate 160. The air heated by absorbing heat from the heat radiating plate 160 flows in a natural convection manner and is exhausted to the outside of the plasma display apparatus through an opening that may be formed on the back cover 172, and the bag Cold air may be continuously introduced again through an opening that may be formed under the cover 170 to allow cooling of this natural convection method.

In addition, since the integrated circuit chip 152 and the element seating groove 161 of the heat dissipation plate 160 are not able to make a substantially physical airtight contact, the integrated circuit chip 152 and the heat dissipation plate 160 The thermally conductive resin 165 is interposed between the device seating grooves 161 of the device to secure an airtight contact relationship between the thermally conductive resin 165 and the heat dissipation plate 160 to more reliably route the heat transfer. do. In this case, the thermally conductive resin 165 has a function of more reliably holding the integrated circuit chip 152 in the device seating groove 161 due to the characteristics of the material and the integrated circuit chip 152 and the connection cable. It is also in charge of the function of preventing foreign matter from entering between 151. The thermally conductive resin 165 may be a liquid or gel-type thermally conductive resin such as thermal grease.

However, the heat dissipation method of the integrated circuit chip 152 by the natural convection method as described above, in the HD-class plasma display device, the integrated circuit chip can not quickly dissipate when the temperature rises rapidly due to a number of switching operations. There is a problem.

In the plasma display device according to the first exemplary embodiment of the present invention, as shown in FIGS. 3 and 4, the lower wall cooling fan 190 of the back cover 172 of the case 170 is provided. In addition, the air flow path member 180 for guiding the air introduced by the fan 190 to the respective heat radiation plates 160 in the left and right directions of the rear lower side of the plasma display module 110 in detail. do. Air collected by the fan 190 forcibly introduced into the air flow path member 180 is guided by the air flow path member 180 and collides with the heat dissipation plate 160, thereby directly cooling the heat dissipation plate 160, and thus to natural convection. Compared with the heat dissipation method, a more rapid and effective heat dissipation effect can be seen. In addition, heat is also generated in the plasma display panel 120, and the heat is radiated from the chassis 130 via the thermal conductive sheet 126. In this case, heat dissipation is performed by natural convection, and the air guided by the air flow path member 180 reaches and cools the chassis 130 in addition to the heat dissipation plate 160, thereby cooling the existing natural convection. Compared with the cooling method, a heat dissipation structure that is faster, more efficient, and capable of wider heat dissipation can be obtained.

3 to 6, the air flow path member 180 of the plasma display apparatus according to the first embodiment of the present invention will be described.

4 is a cross-sectional view taken along line IV-IV of FIG. 2, FIG. 5 is a perspective view of the air flow path member 180, and FIG. 6 is a right side view thereof.

As shown in FIG. 5, the air passage member 180 includes an inlet 181 through which the outside air focused by the fan 190 flows, and a flow passage of air passing through the air passage member 180. It includes a passage portion 182 and an outlet portion 183 through which the air passing through the air flow path member 180 flows out. 4 and 5, the air flow path member 180 fastens the air flow path member 180 on a lower wall of the back cover 172 of the case 170. It can be provided with a fixing portion 184 for fixing by. The fixing part 184 may be provided with a through hole 184a through which a screw or the like is fastened.

The inlet 181 may be formed to face the fan 190. In addition, it is more preferable to form the inlet part 181 and arrange the air flow path member 180 such that the center of the fan 190 is located on the center line of the cross section of the inlet part 181.

The passage part 182 includes a diffusion part 182a through which the introduced air is diffused, and a guide part 182b which is formed in succession to the diffusion part 182a and guides the diffused air toward the outlet part 183. It is preferable. 4 and 5, the diffusion portion 182a is more preferably curved to convex toward the inside of the air flow path member 180.

The air introduced through the inlet 181 diffuses in the longitudinal direction of the air passage member 180 while passing through the diffusion 182a. This air flow is shown by the arrows in FIG. 4. Since the introduced air is diffused in the left and right directions of the air flow path member 182a while passing through the diffusion part 182a, the heat dissipation is performed in detail in the left and right directions at the rear and bottom of the plasma display module 110, respectively. It may flow into the plate 160. In addition, as shown in FIG. 4, since the diffusion part 182a is curved to be convex toward the inside of the air flow path member 180, the inflowed air hoveres around the inlet part 182 or stagnates. Without this, it can be smoothly diffused along the curved surface of the diffusion portion 182a.

3 and 5, the passage portion 182 has a guide portion 182b for guiding diffused air toward the outlet portion 183. As shown in FIG. The guide part 182b is formed to be curved such that a cross-sectional shape perpendicular to the longitudinal direction is convex toward the outside of the air flow path member 180. Diffused air is guided toward the outlet portion 183 while passing through the guide portion 182b. Therefore, the air diffused by the diffusion part 182a and guided by the guide part 182b extends in the left and right directions below the rear of the plasma display module 120, and in detail, each of the heat radiation plates 160. Can be flowed toward

As shown in FIG. 3, the outlet 183 is disposed at a predetermined interval to face the heat radiating plate 160. The outlet 183 also has at least one outlet 183a for the air flow to be discharged and directed to the desired location. As clearly shown in FIGS. 4 and 5, the outlets 183a are formed in a line on the outlet 183, preferably in a number corresponding to the number of the heat radiating plates 160. In addition, the opening area of the outlet 183a is preferably formed to exceed the area of the heat radiation plate 160. As a result, the air passing through the diffusion part 182a and the guide part 182b flows through the outlet 183a to each of the heat dissipation plates 160 to achieve impingement cooling.

Here, although the heat dissipation plate 160 is illustrated as being arranged in a line in Fig. 2 and 4, the present invention is not limited to this, the heat dissipation plate 160 and the connection cable 151 If the number thereof varies according to the configuration of the integrated circuit chip 152, the number may be provided in a corresponding number. Similarly, although the outlets 183a are illustrated in FIG. 4 and FIG. 5, eight outlets 183a are formed in a line on the outlet unit 183, but the present invention is not limited thereto. 183a may be formed to correspond to the number of the heat radiation plates 160.

4 to 6, the air passage member 180 may include a fixing portion 184 formed in the inlet portion 181. The fixing part 184 is formed on the lower wall of the back cover 172 of the case 170 by a fastening means such as a screw fastened through at least one through hole 184a formed in the fixing part 184. The air passage member 180 may be fixed at a predetermined position in the plasma display apparatus 100. 4 to 6, although the fixing part 184 is formed in the inlet part 181, the air flow path member 180 is illustrated as being fixed on the lower wall of the back cover 172. In addition, the fixing part 184 may be formed in the passage part 182 so that the air passage member 180 may be fixed on the lower side of the rear wall of the back cover 172.

The cooling structure of the plasma display device according to the first embodiment of the present invention as described above will be described in detail.

The outside air focused by the fan 190 is introduced into the air passage member 180 through the inlet 181. Inflowed air flows through the passage part 182 to the outlet part 183. While the introduced air passes through the passage part 182, the diffusion part 182a diffuses in the left and right directions of the air flow path member 180 and the outlet part 183 is caused by the guide part 182b. You are guided to. Since the outlet 183 is disposed to face the heat dissipation plate 160 and formed to correspond to a predetermined number of the heat dissipation plates 160, the outlet 183a is formed to pass through the outlet 183a. One air flow reaches each heat dissipation plate 160 corresponding to the outlet 183a. The air flow reaching the heat dissipation plate 160 dissipates heat transferred from the integrated circuit chip 152 to the heat dissipation plate 160 by impingement cooling. Since the opening area of the outlet 183a is larger than the area of the heat radiating plate 160, the flow of air flows out and collides with the front surface of the heat radiating plate 160, thereby cooling the fan 190 and the air flow path member. The impingement cooling method by the forced flow using the 180 may enable faster cooling and have an increased heat dissipation effect than the natural convection method. In addition, since the extra air passing through the space between the outlet 183a and the heat dissipation plate 160 collides with the base 131 of the chassis 130, the base 131 is also cooled, thereby the plasma display apparatus. The overall heat dissipation performance of 100 can be improved.

7 to 10, a plasma display apparatus according to a second embodiment of the present invention will be described. 7 is an exploded perspective view of a plasma display device according to a second embodiment of the present invention, FIG. 8 is a cross-sectional view taken along the line VII-VII of FIG. 7, and FIG. 9 is a sectional view taken along the line VII-VII of FIG. 7. 10 is a perspective view of the air passage member shown in FIG. 7. The same reference numerals as used in the drawings shown above refer to the same members.

The present embodiment differs from the first embodiment in that the fan 190 is disposed below the rear wall of the back cover 172 of the case 170, and the passage portion of the air flow path member 280 of the present embodiment. Reference numeral 282 includes only a portion where air is diffused from the air passage member 180 of the first embodiment so that the air flow in the air passage member 280 of the present embodiment becomes substantially straight. Therefore, the fan 190, the air flow path member 280 and the heat dissipation plate 160 are arranged in a substantially straight line, the air flow through the air flow path member 280 is the air flow path member ( Unlike the air flow in the form of a curve in 180), it shows a linear flow.

As shown in FIGS. 8 to 10, the air passage member 280 has an inlet portion 281 through which the outside air focused by the fan 190 flows, and air passing through the air passage member 280. And a passage portion 282 defining a flow passage of the outlet portion 282 and an outlet portion 283 through which the air passing through the air passage member 280 flows out. 9 and 10, the air flow path member 280 fastens the air flow path member 280 with a screw or the like on the lower side of the rear wall of the back cover 172 of the case 170. A fixing part 284 for fixing by means can be provided. The fixing part 284 may be provided with a through hole 284a through which a screw or the like is fastened.

As shown in FIG. 8, the inlet portion 281 is formed to face the fan 190, and the outlet portion 283 is disposed to face the heat dissipation plate 160 at a predetermined interval. It is preferably formed to. The function, structure, and arrangement of the inlet portion 281 and the outlet portion 283 are the same as those of the air passage member 180 of the first embodiment, and thus a detailed description thereof will be omitted.

9 and 10, the passage part 282 is curved to be convex toward the inside of the air flow path member 280. Thus, the introduced air can be smoothly diffused along the curved surface of the passage portion 282 without hovering or stagnation around the inlet portion 281. The air introduced through the inlet portion 281 is diffused in the left and right directions of the air passage member 280 while passing through the passage portion 282. This air flow is shown by arrows in FIG. 9. Since the introduced air diffuses in the left and right directions of the air flow path member 280 while passing through the passage part 282, the heat dissipation in detail in each of the heat radiating in the left and right directions of the rear lower side of the plasma display module 120. It may flow into the plate 160.

In addition, as illustrated in FIGS. 9 and 10, the air passage member 280 may include a fixing portion 284 formed in the inlet portion 281. The fixing part 284 is a lower side of the rear wall of the back cover 172 of the case 170 by a fastening means such as a screw fastened through at least one through hole 284a formed on the fixing part 284. The air flow path member 280 may be fixed at a predetermined position in the plasma display apparatus 100. 9 and 10, the fixing part 284 is formed in the inlet part 281, and the air flow path member 280 is shown fixed on the lower side of the rear wall of the back cover 172. However, the fixing part 284 may be formed in the passage part 282 so that the air passage member 280 may be fixed on the lower wall of the back cover 172.

The cooling structure of the plasma display device according to the second embodiment of the present invention as described above will be described in detail.

The outside air focused by the fan 190 is introduced into the air passage member 280 through the inlet portion 281. Inflowed air flows through the passage portion 282 to the outlet portion 283. The introduced air is diffused in the left and right directions of the air passage member 280 by the passage portion 282 and guided to the outlet portion 283 while passing through the passage portion 282. Since the outlet 283a is disposed to face the heat dissipation plate 160 and formed to correspond to a predetermined number of the heat dissipation plates 160, the outlet 283a is formed to pass through the outlet 283a. One air flow reaches each heat dissipation plate 160 corresponding to the outlet 283a. The air flow reaching the heat dissipation plate 160 dissipates heat transferred from the integrated circuit chip 152 to the heat dissipation plate 160 by impingement cooling. Since the opening area of the outlet 283a is larger than that of the heat dissipation plate 160, the leaked air collides with all areas of the heat dissipation plate 160 to dissipate heat, and thus, the fan 190 and the air flow path member. Impingement cooling by forced flow using 280 may have a faster and increased heat dissipation effect than the method by natural convection. In addition, since the extra air passing through the space between the outlet 283a and the heat dissipation plate 160 collides with the base portion 131 of the chassis 130, the base portion 131 is further cooled, and thus, the plasma display apparatus. The overall heat dissipation performance of 100 can be improved. In addition, since the flow of air passing through the air flow path member 280 has a substantially straight shape, it is possible to reach the heat dissipation plate 160 more smoothly without loss due to flow resistance, thereby performing desired cooling.

As described above, the plasma display apparatus 100 according to the first and second embodiments of the present invention includes a fan 190 for concentrating external air and introducing the same into the plasma display apparatus 100. Forced air flows by the air flow path members 180 and 280 that flow the introduced air over the lower, lower, left, and right directions of the plasma display module 120 to each of the heat radiation plates 160. By reaching the desired position and impingement cooling, faster cooling is possible and the heat dissipation performance can be increased as compared with the conventional natural convection cooling system. In addition, the cooling method has a great effect when the plasma display apparatus 100 adopts a single scan driving method as a driving method for applying an address signal to the plasma display panel 120.

3, 4, 8, and 9, the fan 190 is illustrated as being schematically disposed on the back cover 172, but the fan 190 is the fan 190. It is preferably formed in the back cover 172 in the form of a unit integrally formed with the drive means for driving the drive unit and a predetermined frame for supporting the drive means and the fan 190.

In addition, although not shown in the drawings, in order to remove dust or foreign matter in the air introduced during the operation of the fan 190, it is preferable to install a dust removing means of the reticular form in the rear of the fan 190.

The present invention provides a structure in which an air flow path member is installed on a lower side of a heat dissipation plate installed for heat dissipation of an integrated circuit chip controlling a driving of a plasma display panel and rapid cooling is performed by forcibly flowing air through a fan, and the heat dissipation performance is increased. It is possible to provide a plasma display device having a.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (10)

A plasma display module for implementing an image using gas discharge; A case accommodating the plasma display module; At least one fan disposed in the case to introduce air; And A plasma display device comprising an air flow passage member disposed behind the plasma display module to flow air introduced by the fan toward the plasma display module. The case is formed by combining a front case and a rear case having at least one opening, wherein the air flow path member has an inlet portion through which air is introduced, a passage portion defining a flow passage of air, and an outlet portion through which air flows out; The inflow portion is disposed to face the fan, the outlet portion has at least one outlet and is disposed to face the plasma display module, And the fan is disposed on a lower wall of the rear case, and the air flow path member is disposed on a lower wall of the rear case so that the inflow portion faces the fan. The method of claim 1, The plasma display module includes a plasma display panel for displaying an image; A chassis supporting the plasma display panel behind the plasma display panel; A driving circuit board disposed behind the chassis and generating an electrical signal applied to the plasma display panel; A signal transfer means mounted with an integrated circuit chip for applying an electrical signal to the plasma display panel and electrically connecting the plasma display panel and the driving circuit board; And And at least one heat dissipation plate disposed behind the plasma display module and covering the portion of the signal transmission means on which the integrated circuit chip is mounted. The method of claim 2, And the outlet is disposed to face the heat dissipation plate, and the opening area of the outlet is larger than the area of the heat dissipation plate. delete The method of claim 1, And a passage portion of the air passage member includes a diffusion portion through which the introduced air is diffused, and a guide portion formed in succession to the diffusion portion and guiding the diffused air toward the outlet portion. The method of claim 5, And the diffusion portion is curved to be convex toward the inside of the air passage member. The method of claim 5, And the guide portion is curved such that a cross-sectional shape perpendicular to the longitudinal direction is convex toward the outside of the air flow passage member. The method of claim 1, And the fan is disposed below the rear wall of the rear case, and the air flow path member is disposed below the rear wall of the rear case such that the inflow portion is opposed to the fan. The method of claim 8, And the passage portion of the air passage member is curved to be convex toward the inside of the air passage member. The method according to any one of claims 1 to 3 and 5 to 9, And the plasma display device adopts a single scan driving method for applying an address signal.

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