JP2006162641A - Plasma display apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display apparatus capable of efficiently dissipating heat generated in the plasma display apparatus to a rear space formed by a rear case and radiating the heat to outside. <P>SOLUTION: A frame chassis 8 which is heated by conduction heat from a plasma display panel (PDP) 10 and a circuit substrate 16 for driving and controlling the PDP 10 are connected by a support post 18 having a high heat conductive and heat dissipating structure 20. The heat generated from it is concentrated to the support post 18 and efficiently dissipated to the rear space 7 formed by the rear case 6 through the heat dissipating structure 20. Thereby, the plasma display apparatus 2 in which the heat generated from the PDP 10 and the heat of the circuit substrate 16 are efficiently radiated through air intake holes 24 and air exhaust holes 28 prepared in the rear case, is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plasma display device that efficiently dissipates heat generated in the plasma display device to the outside.

  In recent years, display devices using plasma display panels are being put into practical use as digital televisions, information display devices, and the like as large-screen, thin, and lightweight display devices. In this plasma display panel (PDP), a discharge gas is sealed between two glass substrates, a plurality of matrix-like micro discharge spaces provided with phosphors are arranged, and generated by gas discharge in the micro discharge space. The phosphor is excited by the ultraviolet rays to be used, and the visible light generated thereby is used for displaying information.

  Due to this gas discharge, the PDP is heated to a considerably high temperature. When it is severe, problems such as damage to the PDP and shortening of the service life occur. In addition, when a large current is passed through an electric circuit that drives and controls the PDP, heat is generated from various electronic components such as transistors mounted on the circuit board, and the temperature inside the plasma display device is significantly increased. . Various studies have been made to prevent this.

  For example, in a state where the base part supporting the PDP and the component mounting surface of the circuit part that drives the PDP are opposed to each other in the casing, the circuit part is supported by the base part with a predetermined interval. It has been proposed to efficiently cool the heat generated from the base and the electronic component by the passing air (see, for example, Patent Document 1).

  The above-described Patent Document 1 will be specifically described with reference to a cross-sectional configuration diagram of the plasma display device shown in FIG.

  The plasma display device 800 includes a housing 818, a PDP 802, a circuit unit 810, a base unit 812, and a front panel 814 made of transparent glass or synthetic resin. A PDP 802 that displays information has a discharge cell structure 804 between a front plate 806 and a back plate 808 made of transparent glass. The discharge cell structure portion 804 includes a large number of fine cells separated by barrier ribs, a sealed gas filled in the cells, a phosphor layer coated on the inner surface of the cell, an electrode for plasma discharge, and the like. Further, on the opposing surface of the front plate 806 and the back plate 808, linear electrodes composed of a large number of transparent electrode bodies arranged in a direction intersecting with each other are also arranged. The PDP 802 is supported on the base part 812 via a heat conductive sheet (not shown).

Thereby, the heat generated in the PDP 802 can be transmitted to the base part 812 via the heat conductive sheet, and the heat of the base part 812 can be dissipated to the outside. The circuit unit 810 includes a circuit board 815 and a large number of electronic components 816 mounted on the surface of the circuit board 815, and a control circuit for driving and controlling the PDP is incorporated therein. The circuit portion 810 is attached by screwing a set screw into the base portion 812 from the surface of the circuit board 815 through a cylindrical column at a predetermined interval with the surface on which the electronic component 816 is attached facing the base portion 812. Inside the housing 818, heat generated from the PDP 802 is transmitted to the base unit 812 via the heat conductive sheet, and heat is also generated from the circuit unit 810 that drives the PDP 802. Air passes through the interval between the electronic components 816 arranged in a complicated manner over a long time and distance while being in contact with the base part 812, the electronic component 816, and the circuit board 815, so that heat is effectively applied to the air passing through the interval. Can be communicated to. The housing 818 is provided with a ventilation portion 820 such as a ventilation hole or a ventilation slit, and air is circulated inside and outside the housing 818 as indicated by an arrow 822 so that heat of the base portion 812 and the circuit portion 810 is transferred. It is configured to facilitate release to the outside.
Japanese Patent Laid-Open No. 2001-22281

  However, in the above-described conventional example, the support column is interposed between the base portion (hereinafter referred to as the frame chassis) and the circuit board having the mounting surface of the electronic component facing the frame chassis in a state where the heat conduction between the base plate and the circuit board is blocked. Use the interval. The heat generated from the PDP is transmitted through the heat conduction sheet, and the heat generated from the circuit board such as the drive / control circuit disposed on the back of the frame chassis passes through the gap. In addition, the heat is dissipated to the air in contact with the frame chassis, the electronic component, and the circuit board. Accordingly, since a large number of electronic components having different heights are mounted, turbulent flow is generated in the process in which air passes between a large number of electronic components arranged within this interval and in the vicinity of the electronic components, so that the air becomes electronic components. There is a problem that a larger surface area is required to obtain a sufficient cooling effect because the thermal conductivity from the frame chassis to the air is lower than that of metal or the like, and the thermal conductivity from the frame chassis to the air is low.

  The present invention can dissipate the heat generated in the plasma display device to the outside through the exhaust hole disposed above the rear case by efficiently radiating the heat to the back space formed by the rear case of the housing, It is another object of the present invention to provide a plasma display device that can conduct heat to a thermally conductive rear case and dissipate heat to the outside of the rear case.

  In order to solve the above-described problems, a plasma display device according to the present invention includes a casing including a front case and a rear case, a plasma display panel that displays a signal on the front surface of the casing, and the plasma display panel. A frame chassis mounted on the back surface via a heat conductive material, a circuit board electrically connected to the plasma display panel, and a fan disposed above the rear case to discharge the air in the back space to the outside The frame chassis and the circuit board are coupled by a column made of a heat conductive material and having a heat dissipation structure at least in part, and the air flowing into the back space formed by the rear case, The heat generated from the frame chassis and the circuit board is dissipated from the heat dissipation structure, and the heat is dissipated from the back space to the outside.

  According to such a configuration, the heat from the frame chassis and the circuit board is concentrated on the support column having the heat dissipation structure, and the heat dissipation structure is efficiently dissipated to the back space formed by the rear case. It is possible to supply a plasma display device having an excellent heat dissipation effect that is effectively discharged to the outside through the exhaust hole.

  The circuit board and the frame chassis are spaced apart from each other so that the surface of the circuit board on which the electronic components are mounted faces the frame chassis surface and the heat dissipation structure of the support is sandwiched between the rear case and the frame chassis. It may be configured so as to be larger than the distance between the circuit board and the heat passing through the distance between the circuit board and the frame chassis to dissipate heat from the circuit board and the frame chassis.

  According to such a configuration, the air flowing from the outside can be substantially narrowed to the interval between the circuit board and the frame chassis. The air contacts the surface of the frame chassis, the circuit board, and the surface of the electronic component mounted on the circuit board to absorb heat, and the heat of the circuit board and the frame chassis is concentrated on the column having the heat dissipation structure. Thus, it is possible to realize a plasma display device that efficiently dissipates air from the heat dissipating structure and effectively discharges it from the exhaust hole of the rear case through the fan.

  Further, the surface of the circuit board on which the electronic components are mounted is opposed to the side opposite to the frame chassis surface, and the distance between the rear case and the circuit board is larger than the distance between the circuit board and the frame chassis. The heat dissipating structure of the support column is disposed between the circuit board and the rear case, and the heat of the circuit board and the frame chassis is transferred to the air passing through the space between the rear case and the circuit board. May be configured to dissipate heat.

  According to such a configuration, the air flowing from the outside can be substantially narrowed to the interval between the circuit board and the rear case. The heat of the circuit board and the frame chassis is concentrated on the support column having the heat dissipation structure, and the heat dissipation structure is efficiently dissipated into the air, and is effectively released to the outside through the fan through the exhaust holes of the rear case. In addition, in the process, it is possible to realize a plasma display device in which the air contacts the side surface of the highly thermally conductive rear case to transmit heat to the rear case and to dissipate heat to the outside.

  The plasma display device of the present invention is mounted on a housing including a front case and a rear case, a plasma display panel for displaying signals on the front surface of the housing, and a heat conductive material on the back surface of the plasma display panel. A frame chassis that is electrically connected to the plasma display panel, and an exhaust hole that is disposed above the rear case and discharges air in the back space formed by the rear case to the outside. The frame chassis and the rear case are coupled by a post made of a heat conductive material and having a heat dissipation structure at least partially, and heat generated from the frame chassis is transferred from the heat dissipation structure to the rear case. It dissipates into the air flowing into the rear space that constitutes it, releases it to the outside through the exhaust hole, and conducts to the rear case through the column. It is configured to heat radiation to the outside through the rear case allowed.

  According to such a configuration, the heat from the frame chassis is concentrated on the support column having the heat dissipation structure, and is efficiently dissipated from the heat dissipation structure to the back space formed by the rear case, and the heat is released from the exhaust hole of the rear case to the outside. In addition, it is possible to supply a plasma display device having a further excellent heat radiation effect, in which heat from the frame chassis is conducted to the rear case through the support column and effectively radiated to the outside through the rear case.

  In addition, the plasma display device of the present invention is mounted on a housing composed of a front case and a rear case, a plasma display panel for displaying a signal on the front surface of the housing, and a heat conductive material on the back surface of the plasma display panel. A frame chassis, a circuit board electrically connected to the plasma display panel, and an exhaust hole that is disposed above the rear case and discharges air in a back space formed by the rear case to the outside. The frame chassis, the circuit board, and the rear case are coupled by a post made of a heat conductive material and having a heat dissipation structure at least in part, and heat generated from the frame chassis and the circuit board is Dissipate from the heat dissipating structure to the air flowing into the back space formed by the rear case, and release it from the exhaust hole to the outside. It is configured to heat radiation to the outside through the rear case is conducted to the rear case through the serial strut.

  According to such a configuration, the heat from the frame chassis and the circuit board is concentrated on the support column having the heat dissipation structure, and is efficiently dissipated from the heat dissipation structure to the back space formed by the rear case. Effectively radiates to the outside from the hole, conducts heat from the frame chassis and circuit board from the support to the rear case, and effectively dissipates to the outside through the rear case, realizing a plasma display device with excellent heat dissipation effect it can.

  The circuit board and the frame chassis are spaced apart from each other so that the surface of the circuit board on which the electronic components are mounted faces the frame chassis surface and the heat dissipation structure of the support is sandwiched between the rear case and the frame chassis. And configured to be larger than the distance between the circuit board, the heat of the circuit board and the frame chassis is radiated to the air passing through the distance between the circuit board and the frame chassis, and discharged to the outside through the exhaust hole, and It may be configured to conduct to the rear case through a support and to dissipate heat to the outside through the rear case.

  According to such a configuration, the air flowing from the outside can be substantially narrowed to the interval between the circuit board and the frame chassis. The air contacts the surface of the frame chassis, the circuit board, and the surface of the electronic component mounted on the circuit board to absorb heat, and the heat of the circuit board and the frame chassis is concentrated on the column having the heat dissipation structure. The heat dissipation structure can efficiently dissipate into the air, and can be effectively discharged to the outside from the exhaust holes of the rear case. At the same time, it is possible to realize a plasma display device having an excellent heat radiation effect in which heat from the frame chassis and the circuit board is conducted to the rear case through the above-described support and is effectively radiated to the outside through the rear case.

  Also, the surface of the circuit board on which the electronic components are mounted is opposed to the side opposite to the frame chassis surface, and the distance between the rear case and the circuit board is larger than the distance between the circuit board and the frame chassis. The heat dissipating structure of the support is disposed between the circuit board and the rear case, and heat of the circuit board and the frame chassis is transferred to the air passing through the space between the rear case and the circuit board. A configuration may be adopted in which heat is radiated and discharged to the outside through the exhaust hole, and is conducted to the rear case through the support and is radiated to the outside through the rear case.

  According to such a configuration, the air flowing from the outside can be substantially narrowed to the interval between the circuit board and the rear case. The heat of the circuit board and the frame chassis is concentrated on the support column having the heat dissipation structure, and the heat dissipation structure is efficiently dissipated into the air, and is effectively released to the outside from the exhaust holes of the rear case. be able to. At the same time, in the process, the air can contact the side surface of the rear case with high thermal conductivity to conduct heat to the rear case and release it to the outside. At the same time, it is possible to realize a plasma display device having an excellent heat radiation effect in which heat from the frame chassis and the circuit board is conducted from the support to the rear case and effectively radiated to the outside through the rear case.

  Furthermore, the structure which couple | bonds the said support | pillar and the said rear case via a heat conductive elastic body may be sufficient.

  According to such a configuration, it is possible to realize a plasma display device that is resistant to mechanical vibration and shock. In addition, by using a heat conductive elastic body with a larger area than the area of the end face of the column, heat is diffused and transmitted from the column to the rear case over a wide area, so that heat is concentrated on the local part of the rear case. Can be prevented.

  In addition, the plasma display device of the present invention is mounted on a housing composed of a front case and a rear case, a plasma display panel for displaying a signal on the front surface of the housing, and a heat conductive material on the back surface of the plasma display panel. A frame chassis, a plurality of circuit boards electrically connected to the plasma display panel, and a plurality of thermally conductive ribs extending in a vertical direction of the frame chassis, the plurality of the plurality of circuit boards being interposed between the plurality of ribs. Each of the circuit boards may be disposed, and one end of the rib may be disposed in close contact with the surface of the rear case.

  According to such a configuration, the heat from the frame chassis is transmitted to the rear case by the ribs, and the temperature in the housing can be greatly reduced. In addition, the ribs act as a partition plate between the ribs, so that heat radiation from a block with large heat generation to a block with low heat generation is prevented, and the radiant heat is absorbed by each rib and conducted to the rear case. And dissipate heat to the outside. In addition, since air effectively flows from below to above due to the chimney effect, it is possible to realize a plasma display device that further improves the heat dissipation effect.

  Furthermore, the structure which couple | bonded the edge part of the said rib and the said rear case via the heat conductive elastic body may be sufficient.

  According to such a configuration, it is possible to provide a plasma display device that is resistant to mechanical vibration and impact and has an excellent heat dissipation effect.

  According to the plasma display device of the present invention, the frame chassis heated by the heat conducted from the PDP and the circuit board for driving and controlling the PDP are coupled by the support column having high thermal conductivity and having a heat dissipation structure, The heat generated from them can be concentrated on the support column and can be efficiently dissipated in the back space formed by the rear case through the heat dissipation structure of the support column. Therefore, the heat of the frame chassis and the heat of the circuit board are effectively released through the intake holes and the exhaust holes provided in the rear case, and further, one end of the column is coupled to the rear case to be transmitted to the rear case, A plasma display device having an excellent heat dissipation effect that radiates heat to the outside through the case can be realized.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a side sectional view of a plasma display device according to the present invention, and FIG. 2 is a sectional view of a main part for explaining a coupling state and a heat dissipation state of an aluminum chassis that radiates heat generated in a PDP and a circuit board. FIG. The plasma display device according to the first embodiment will be described in detail with reference to FIGS.

  In the plasma display device 2 according to the first embodiment of the present invention, a front case 4 made of an organic resin and a rear case 6 made of a metal having a high thermal conductivity such as aluminum (Al) are fixed to a peripheral end surface portion of a frame chassis 8 made of aluminum die casting. Thus, the housing 5 is configured. A front panel 9 is disposed on the front side of the PDP 10. As the front panel 9, a multifunctional filter made of glass or resin that prevents electromagnetic waves or infrared rays and improves contrast is used. Further, the back side of the PDP 10 is attached to the frame chassis 8 via a thermally conductive sheet 12 such as silicon in which metal powder is dispersed, and heat generated by gas discharge of the PDP 10 is conducted to the frame chassis 8.

  On the other hand, various circuit boards 16 such as a drive / control circuit, a tuner circuit, and a power supply circuit that are electrically coupled to the PDP 10 by a flexible wiring portion (not shown) to control light emission include a heat dissipation structure such as a heat sink. Dispersed and fixed at predetermined positions on the frame chassis 8 through support posts 18 having 20. On these circuit boards 16, a large number of electronic components 22, such as transistors that pass a large current, are mounted, and heat is generated by these electronic components 22.

  In the first embodiment, the circuit board 16 is sandwiched between the circuit board 16 and the frame chassis 8 with the surface of the circuit board 16 on which the electronic component 22 is mounted facing the frame chassis 8 side. 16 is fixed to the frame chassis 8 by a column 18.

  As a material of the support column 18, a metal having high thermal conductivity such as Al and copper (Cu) is effective. Further, as the structure of the support column 18, a method in which the support column 18 is screwed into the frame chassis 8 with a screw 14, or a cylindrical support column 18 is pressed into a boss formed in advance in an aluminum die-cast frame chassis 8 and fixed with the screw 14. The method to do is effective.

  The direction of the fins of the heat radiating plate which is the heat radiating structure 20 is formed so as to be substantially parallel to the surfaces of the circuit board 16 and the frame chassis 8 and is configured not to obstruct air passing therethrough. The heat dissipating structure 20 is preferably constructed integrally with the support column 18, but it is also effective to attach it closely to a part of the support column 18.

  With this configuration, the heat generated from the PDP 10 as shown in FIG. 2 is transmitted to the above-described support 18 through the frame chassis 8 as indicated by the arrow 42. On the other hand, heat generated from a large number of mounted electronic components 22 is transferred to the high thermal conductivity column 18 through the circuit board 16 as indicated by an arrow 44. In this way, heat from the frame chassis 8 and the circuit board 16 is concentrated on the support 18 having high thermal conductivity. The concentrated heat is dissipated from the heat radiating plate, which is the heat radiating structure 20, into the air indicated by the arrow 34 flowing through the space H1 between the frame chassis 8 and the circuit board 16. Further, the air passing through the gap H1 simultaneously contacts the surface of the electronic component 22 mounted on the frame chassis 8 and the circuit board 16, and absorbs their heat.

  1, the outside air indicated by the arrow 26 flows into the back space 7 formed by the rear case 6 from the intake hole 24 disposed below the rear case 6, and is further indicated by arrows 32, 34, and 36. Air flows from below to above. Further, the air that has absorbed the heat of the back space 7 is discharged to the outside by the fan 46 disposed at the upper part of the rear case 6 through the exhaust hole 28 disposed at the upper part of the rear case as indicated by an arrow 30.

  In the first embodiment, the distance H1 between the frame chassis 8 and the circuit board 16 is configured to be sufficiently larger than the distance H2 between the rear case 6 and the circuit board 16. With this configuration, a part of the air flowing into the rear case 6 flows from the lower side to the upper side at the interval H2 between the circuit board 16 and the rear case 6 as indicated by arrows 38 and 40. Can flow through the interval H1 as described above, and can narrow the air flow path. Thereby, the heat generated inside the plasma display device 2 can be effectively dissipated to the air flowing in from the intake holes 24 and can be efficiently discharged to the outside through the exhaust holes 28.

  Further, the plasma display device is required to be thin, and further, it is required to reduce the distance between the circuit board 16 and the frame chassis 8. On the other hand, the effect of dissipating heat can be improved as the length of the column 18 having the heat sink is increased. As in the first embodiment, the arrangement in which the surface of the circuit board 16 on which the electronic component 22 is mounted faces the frame chassis 8 side is such that the surface of the circuit board 16 on which the electronic component 22 is mounted is opposite to the frame chassis 8 side. Compared with the arrangement directed to, the length of the column can be increased by the maximum height H3 in the electronic component 22, so that the heat dissipation effect can be improved. Therefore, the former arrangement is excellent for thinning the plasma display device.

  Although an organic resin is used as the material of the front case 4, using a heat conductive metal is more effective for improving the heat dissipation effect. In addition, the surface of the circuit board on which electronic components are mounted refers to a surface on which a large number of electronic components are mounted and electronic components with a high height are mounted.

(Embodiment 2)
FIG. 3 is a side sectional view of the plasma display device in accordance with the second exemplary embodiment of the present invention. Hereinafter, a description will be given with reference to FIG. The same common elements as those in the first embodiment are denoted by the same reference numerals.

  In the first embodiment, the heat from the frame chassis and the circuit board heated by the PDP is concentrated on the support column having the heat dissipation structure, and the heat is dissipated mainly to the back space formed by the rear case by the heat dissipation structure. It is discharged to the outside of the housing. The first embodiment is a plasma display device that improves the heat dissipation effect by combining the rear case and the frame chassis to conduct heat from the frame chassis to the rear case and efficiently dissipate it to the back space. The difference is realized. In the following description, only differences from the first embodiment will be described.

  In the second embodiment, as shown in FIG. 3, the surface of the circuit board 16 on which a large number of electronic components 22 are mounted is attached on the frame chassis 8 so as to face away from the frame chassis 8. The frame chassis 8 and the rear case 6 are coupled by a high thermal conductive support 18 having a heat dissipation structure 20 so that heat from the frame chassis 8 is directly conducted to the rear case 6 and the fins of the heat dissipation structure 20 are provided. Through the back space 7. Air flows from the outside through the intake holes 24 disposed below the rear case 6 and flows from below to above as indicated by arrows 52 and 54. The air cools the circuit board 16 and the electronic component 22 mounted on the circuit board 16, and further cools the heat dissipation structure 20. The air that has absorbed the heat dissipated in the back space 7 in this manner is discharged through the exhaust hole 28 disposed above the rear case 6. In the process, air flowing upward from below contacts the surface of the rear case 6, transfers heat to the rear case 6, and dissipates heat from the rear case 6. If necessary, a fan may be provided above the rear case 6 to forcibly create an air flow.

  A method of joining the frame chassis 8 and the rear case 6 is as follows. First, the frame chassis 8 and the column 18 are coupled. As the method, a method of screwing and fixing a column 18 having a screw structure at the tip to the frame chassis 8 or a method of inserting into a boss formed in advance on the frame chassis 8 of aluminum die casting is effective. Thereafter, the rear case 6 is screwed and fixed to the column 18 from the back surface of the rear case 6 using the screws 50.

  With the above configuration, since the temperature of the frame chassis 8 that has conducted heat to the rear case 6 is significantly reduced, the radiant heat to the circuit board 16 is greatly reduced, and the life of the electronic component is reduced due to the heat to the circuit board 16. Adverse effects such as deterioration of the bonding state due to solder can be greatly improved.

(Embodiment 3)
In Embodiment 3 of the present invention, both the heat from the frame chassis and the heat from the circuit board are conducted to the rear case using the support having the heat dissipation structure, and dissipated to the rear space in the rear case. The heat from the frame chassis and the circuit board is radiated to the outside of the housing.

  FIG. 4 is a side sectional view of the plasma display device of the present invention when the surface of the circuit board on which the electronic component is mounted faces the frame chassis side. FIG. 5 is a side cross-sectional view of the plasma display device of the present invention when the surface of the circuit board on which the electronic component is mounted faces the side opposite to the frame chassis side. The plasma display device according to the third embodiment will be described with reference to FIGS. Only differences from the first and second embodiments will be described. The same common elements as those in the first and second embodiments are denoted by the same reference numerals.

  FIG. 4 is a diagram in which the rear case 6 made of high thermal conductivity such as Al shown in FIG. 1 and the support column 18 are connected to each other with a screw 50 through a thermal conductive elastic body 48. By configuring in this way, the heat of the frame chassis 8 and the heat of the circuit board 16 are simultaneously conducted to the rear case 6 in the back space 7, and in parallel with the heat radiation by the heat radiating structure described in the first and second embodiments. The heat can be radiated from the rear case 6 to the outside. For this reason, the temperatures of the frame chassis 8 and the circuit board 16 are greatly reduced, and the thermal effects on each other are reduced. For example, the fact that the heat of the circuit board 16 affects the video screen of the PDP 10, the radiant heat from the frame chassis 8 deteriorates the service life of the components, and causes poor solder joints, is stable. The plasma display device 2 can be realized.

  As the heat conductive elastic body 48, silicon rubber, silicon resin, resin in which heat conductive particles are dispersed, or the like is effective. In addition, by making the area of the heat conductive elastic body 48 larger than the area of the end surface on the rear case 6 side of the support column 18, heat can be diffused over a wide range of the rear case, and a part of the rear case is locally distributed. It is possible to prevent heat from concentrating on. Therefore, even if it touches a hand, it will hardly feel hot, and it will become the heat dissipation method excellent also in safety | security.

  Further, as a method of attaching the heat conductive elastic body 48, the heat conductive elastic body 48 is bonded to the rear case 6 side in an area larger than the area in contact with the support pillar 18 in advance, and the support pillar 18 is pressed against the heat conductive elastic body 48. The method is fine. In this method, it is not always necessary to screw all the support columns 18 to the rear case 6, and the manufacturing becomes easy. Further, there is an advantage that the rear case 6 can be easily removed when repairing. The support column 18 may be directly coupled to the rear case 6, but the plasma display device 2 that is resistant to mechanical vibration and impact can be obtained by using the above-described thermally conductive elastic body 48.

  FIG. 5 is a view in which the circuit board 16 shown in FIG. 3 is fixed to the rear case 6 via a thermally conductive elastic body 48 by a support 18 having a heat radiating structure 20 together with the frame chassis 8. Also in this case, as described above, the heat from the frame chassis 8 and the circuit board 16 is conducted to the rear case 6 and the heat of both is remarkably lowered, so that adverse effects due to heat are greatly improved. In addition, the air flowing in from the intake holes 24 comes into contact with the circuit board 16, the electronic component 22, and the surface of the frame chassis 8, and each of them is cooled in parallel. Further, it is common in FIGS. 4 and 5 that the heated air is discharged to the outside of the housing through the exhaust hole 28.

(Embodiment 4)
FIG. 6A is a plan view of the plasma display device according to the fourth embodiment of the present invention as viewed from the back side with the rear case removed. FIG. 6B is a perspective view schematically showing the arrangement of the frame chassis and ribs formed on the frame chassis and functioning as partition plates and the rear case. In FIG. 6B, drawing of the circuit board 16 is omitted for easy understanding. The plasma apparatus of Embodiment 4 will be described with reference to FIGS. 6 (A) and 6 (B). In addition, the same number is attached | subjected to the same common element as Embodiment 1-3.

  The circuit board 16 on which electronic components are mounted is disposed between the plurality of ribs 58 disposed on the frame chassis 8. The ribs 58 are arranged in a substantially vertical direction with respect to the frame chassis 8, and a plurality of the ribs 58 are arranged in parallel in the lateral direction. Further, the plurality of ribs 58 and the rear case 6 indicated by the dotted lines in FIG. In this case, the rib 58 and the rear case 6 are not shown, but may be fixed from the outer surface side of the rear case 6 with screws or the like. Since the upper end 62 and the lower end 64 of each block 60 are open, external air flows upward from the bottom due to the effect of a chimney, and the higher the temperature, the faster the block. There is a feature that improves. Therefore, the heat generated from the frame chassis 8 and the circuit board 16 is released from below to above by this air flow.

  Further, by bringing the rib 58 and the rear case 6 into intimate contact, heat from the frame chassis 8 is transmitted from the rib 58 to the rear case 6 and the temperature inside the housing can be greatly reduced. In addition, the rib 58 serves as a partition plate, so that heat radiation from a block that generates a large amount of heat to a block that generates a small amount of heat is prevented, and the radiant heat is absorbed by each rib 58 and conducted to the rear case 6. Therefore, it is possible to realize a fanless plasma display device with low noise and electric power.

  The rib 58 is preferably formed integrally with the frame chassis 8, but it is of course effective to fix the rib 58 to the frame chassis 8 by screwing or the like.

  Further, the thermal conductive elastic body 48 is bonded in advance to the rear case 6 side with a width wider than the region where the rib 58 is in close contact with the rear case 6, and the rib 58 is pressed against the bonded thermal conductive elastic body 48. The method of hitting may be used. As a result, it is possible to prevent the heat from diffusing in a wider range where the rib and the rear case are in direct contact, and to concentrate the heat on the local part of the rear case.

  Further, the upper end 62 and the lower end 64 of each block 60 are preferably open structures, but it is also effective to cover them with a mesh structure cover. In the case where the upper end 62 is covered with the rear case 6 (not shown), air may be discharged to the outside by providing a fan near the upper end of the block 60 having the highest temperature.

  The plasma display device according to the present invention is useful as a display device having a high heat dissipation effect and a good quality and a long life.

Side surface principal part sectional drawing which shows the structure of the plasma display apparatus in Embodiment 1 of this invention. FIG. 3 is an enlarged side cross-sectional view schematically showing a heat conduction path in the first embodiment of the present invention. Side surface principal part sectional drawing which shows the structure of the plasma display apparatus in Embodiment 2 of this invention. Side surface principal part sectional drawing which shows the structure of the plasma display apparatus in Embodiment 3 of this invention. Side surface principal part sectional drawing which shows the structure of another plasma display apparatus in Embodiment 3 of this invention. (A) The top view seen from the rear case side of the structure of the plasma display apparatus in Embodiment 4 of this invention (B) The perspective view of (A) Side cross-sectional view showing the structure of a conventional plasma display device

Explanation of symbols

2,800 Plasma display device 4 Front case 5,818 Case 6 Rear case 7 Back space 8 Frame chassis 9,814 Front panel 10,802 PDP
12 Thermal conductive sheet 14,50 Screw 16,815 Circuit board 18 Post 20 Heat dissipation structure 22,816 Electronic component 24 Air intake hole 26, 30, 32, 34, 36, 38, 40, 42, 44, 52, 54, 822 Arrow 28 Exhaust hole 46 Fan 48 Thermally conductive elastic body 58 Rib 60 Block 62 Upper end 64 Lower end 804 Discharge cell structure portion 806 Surface plate 808 Back plate 810 Circuit portion 812 Base portion 820 Ventilation portion

Claims (10)

A housing including a front case and a rear case;
A plasma display panel for displaying signals on the front surface of the housing;
A frame chassis mounted on the back surface of the plasma display panel via a heat conductive material;
A circuit board that is electrically connected to the plasma display panel; and a fan that is disposed above the rear case and discharges air in the back space to the outside.
The frame chassis and the circuit board are joined by a post made of a heat conductive material and having a heat dissipation structure at least partially,
In the air flowing into the back space formed by the rear case, heat generated from the frame chassis and the circuit board is dissipated from the heat dissipation structure,
A plasma display device for radiating heat from the back space to the outside. The circuit board has a surface on which electronic components are mounted facing the frame chassis surface, and the heat dissipation structure of the support is sandwiched between the circuit board and the frame chassis.
The gap between the circuit board and the frame chassis is arranged to be larger than the gap between the rear case and the circuit board,
The plasma display device according to claim 1, wherein heat passing through the gap between the circuit board and the frame chassis is radiated from the heat of the circuit board and the frame chassis. In the state where the surface on which the electronic component is mounted faces the circuit board facing away from the frame chassis surface, the distance between the rear case and the circuit board is the distance between the circuit board and the frame chassis. Arranged to be larger,
The heat dissipation structure of the support is disposed between the circuit board and the rear case, and the heat of the circuit board and the frame chassis is radiated to the air passing through the space between the rear case and the circuit board. The plasma display device described in 1. A housing including a front case and a rear case;
A plasma display panel for displaying signals on the front surface of the housing;
A frame chassis mounted on the back surface of the plasma display panel via a heat conductive material;
A circuit board electrically connected to the plasma display panel; and an exhaust hole that is disposed above the rear case and discharges air in a back space formed by the rear case to the outside.
The frame chassis and the rear case are joined by a post made of a heat conductive material and having a heat dissipation structure at least partially,
The heat generated from the frame chassis is dissipated from the heat dissipation structure to the air flowing into the back space formed by the rear case, and discharged outside through the exhaust holes.
A plasma display device that conducts to the rear case through the support and dissipates heat to the outside through the rear case. A housing consisting of a front case and a rear case;
A plasma display panel for displaying signals on the front surface of the housing;
A frame chassis mounted on the back surface of the plasma display panel via a heat conductive material;
A circuit board electrically connected to the plasma display panel; and an exhaust hole that is disposed above the rear case and discharges air in a back space formed by the rear case to the outside.
The frame chassis and the circuit board and the rear case are joined by a support column made of a heat conductive material and having a heat dissipation structure at least in part.
The heat generated from the frame chassis and the circuit board is dissipated from the heat dissipation structure into the air flowing into the back space formed by the rear case,
A plasma display device that discharges to the outside through the exhaust hole and conducts heat to the rear case through the support column and dissipates heat to the outside through the rear case. The circuit board and the frame chassis are spaced apart from each other so that the surface of the circuit board on which electronic components are mounted faces the frame chassis surface and the heat dissipation structure of the support is sandwiched between the rear case and the circuit board. Configured to be larger than the interval between
The heat of the circuit board and the frame chassis is dissipated to the air passing through the gap between the circuit board and the frame chassis, and released to the outside through the exhaust hole,
The plasma display device according to claim 5, wherein the plasma display device is conducted to the rear case through the support column and radiates heat to the outside through the rear case. In the state where the surface on which the electronic component is mounted faces the circuit board facing away from the frame chassis surface, the distance between the rear case and the circuit board is the distance between the circuit board and the frame chassis. Arranged to be larger,
A heat dissipating structure of the support is disposed between the circuit board and the rear case, and heat of the circuit board and the frame chassis is dissipated to air passing through a space between the rear case and the circuit board to thereby form the exhaust hole. The plasma display device according to claim 5, wherein the plasma display device is further discharged to the outside, is conducted to the rear case through the support column, and is radiated to the outside through the rear case. The plasma display device according to claim 4, wherein the support column and the rear case are coupled to each other through a heat conductive elastic body. A housing consisting of a front case and a rear case;
A plasma display panel for displaying signals on the front surface of the housing;
A frame chassis mounted on the back surface of the plasma display panel via a heat conductive material;
A plurality of circuit boards electrically connected to the plasma display panel; and a plurality of thermally conductive ribs extending in a vertical direction of the frame chassis,
A plasma display device in which the plurality of circuit boards are respectively disposed between the plurality of ribs, and one end of the rib is disposed in close contact with the surface of the rear case. The plasma display device according to claim 9, wherein an end of the rib and the rear case are coupled via a heat conductive elastic body.

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