JPH0593811A - Light absorptive film - Google Patents

Light absorptive film

Info

Publication number
JPH0593811A
JPH0593811A JP33352191A JP33352191A JPH0593811A JP H0593811 A JPH0593811 A JP H0593811A JP 33352191 A JP33352191 A JP 33352191A JP 33352191 A JP33352191 A JP 33352191A JP H0593811 A JPH0593811 A JP H0593811A
Authority
JP
Japan
Prior art keywords
film
layer
mgf
phase
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33352191A
Other languages
Japanese (ja)
Inventor
Yoshihiro Kono
芳弘 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Publication of JPH0593811A publication Critical patent/JPH0593811A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the high-quality light absorptive film which lessens the generation of stresses and does not crack by forming the film of the specific layer of the light absorptive film by using SiO2. CONSTITUTION:The stresses of the film of MgF2 are offset and the generation of cracks is prevented by using the SiO2 as a dielectric film. The difference between a phase of a ray A emitted from the film and a phase of a ray B passing a binder is required to be set at 1/4lambda in the case of use for a phase film having 1/4lambda phase difference and, therefore, the MgF2 is not completely formed of the SiO2 but if the number M of the films to be laminated is an even number, the film of the (M/2)+ or -n [where n=0, 1, 2,...,{(M/2)-2}]th layer is formed of the {SiO2 and if the number M is an odd number the film of the {(M+1)/2)+ or -n} [where n=0, 1, 2,...{[M+1)/2],-2)}]th layer is formed of the SiO2. The stresses generated by the MgF2 in the first half of the films are offset by the central part of the films and the light absorptive film which is suppressed in the film thickness over the entire part and is easily workable is obtd.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、NDフィルター,位相
差顕微鏡用位相板,変調コントラスト用瞳変調フィルタ
ー,その他の瞳変調フィルターとして用いられる反射防
止用の光吸収膜に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antireflection light absorbing film used as an ND filter, a phase plate for a phase contrast microscope, a pupil modulation filter for modulation contrast, and other pupil modulation filters.

【0002】[0002]

【従来の技術】この種の光吸収膜としては、(1)特開
昭57−195207号に示された如き、誘電体膜と金
属膜とを含んでいて単独で用いても反射防止効果を有す
る二枚の多層膜で他の誘電体膜を挾んで成るものや、
(2)特公昭55−47361号に示された如き、金属
膜と誘電膜を交互に順次積層して成るものが知られてい
る。
2. Description of the Related Art As a light absorbing film of this type, (1) as shown in JP-A-57-195207, it contains a dielectric film and a metal film and has an antireflection effect when used alone. Two multi-layered films that have another dielectric film sandwiched between them,
(2) As shown in Japanese Examined Patent Publication No. 55-47361, there is known one formed by alternately laminating a metal film and a dielectric film.

【0003】又、薄膜の加工技術上、薄膜には応力が発
生するが、高屈折率物質と低屈折率物質とを交互に積層
して成る多層膜では、圧縮応力と引張り応力を生じる物
質を組み合わせることにより、応力が打ち消されること
が知られている(藤原編「光学薄膜」,共立出版(株)
発行)。
Further, due to the thin film processing technology, stress is generated in the thin film, but in a multilayer film in which a high refractive index material and a low refractive index material are alternately laminated, a material that produces compressive stress and tensile stress is generated. It is known that the stress is canceled by combining them (Fujiwara ed. "Optical thin film", Kyoritsu Shuppan Co., Ltd.)
Issue).

【0004】[0004]

【発明が解決しようとする課題】ところで、上記(1)
の場合、金属膜を二層しか使用していないため、分光透
過率を均一にし且つ反射率を小さく設計することは非常
に難しい。又、上記(2)の場合、Ti又はCrから成
る金属膜とMgF2 から成る透明膜を用いると、分光透
過率が均一となり且つ反射率の小さい膜を設計すること
はできるが、積層数が多くなって膜全体の厚さが厚くな
り、膜の応力でクラックが発生し易くなるという問題が
あり、特に位相膜の場合、図1に示すような光線AとB
の位相差が1/4λとなるように設計することになるた
め、膜厚は更に厚くなってしまう。
By the way, the above (1)
In this case, since only two metal films are used, it is very difficult to make the spectral transmittance uniform and the reflectance small. Further, in the case of the above (2), if a metal film made of Ti or Cr and a transparent film made of MgF 2 are used, a film having a uniform spectral transmittance and a small reflectance can be designed, but the number of laminated layers is large. There is a problem that the total thickness of the film becomes thicker and cracks are easily generated due to the stress of the film. Particularly in the case of a phase film, the light rays A and B as shown in FIG.
Since the phase difference is designed to be 1 / 4λ, the film thickness is further increased.

【0005】又、位相膜などのコートとして用いる場合
は、レジスト等を用いてパターンを形成した後真空蒸着
を行うため、基板温度を120℃以上にすることができ
ず、クラックが発生し易い条件となってしまう。
When used as a coat for a phase film or the like, the substrate temperature cannot be raised to 120 ° C. or higher because a pattern is formed using a resist or the like and then vacuum deposition is performed, so that cracks are likely to occur. Will be.

【0006】そこで、図2に示されるような物質を用い
て膜の引張り応力と圧縮応力とにより膜全体としての応
力を打ち消す方法が開示されているが、この方法を用い
て1/4λの位相差を有する位相膜を設計しようとする
と、屈折率の高い膜を組合せて用いなければならず、加
工の難しい厚い膜しか設計できない。
Therefore, a method of canceling the stress of the whole film by the tensile stress and the compressive stress of the film using a substance as shown in FIG. 2 is disclosed. In order to design a phase film having a phase difference, a film having a high refractive index must be used in combination, and only a thick film that is difficult to process can be designed.

【0007】本発明は、従来の技術の有するこのような
問題点に鑑みてなされたものであり、その目的とすると
ころは、膜厚を薄くすることができ且つクラックを生じ
ることのない、NDフィルター,位相差顕微鏡用位相
板,変調コントラスト瞳変調フィルター,その他の瞳変
調フィルターとして用い得る反射防止用の光吸収膜を提
供しようとするものである。
The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to reduce the thickness of the film without causing cracks. An object of the present invention is to provide a light absorbing film for antireflection that can be used as a filter, a phase plate for a phase contrast microscope, a modulation contrast pupil modulation filter, and other pupil modulation filters.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、本発明による光吸収膜は、下記のような誘電体膜と
金属膜とを積層させた光吸収膜を構成している。即ち、
積層されるべき膜数をMとしたとき、膜総数が偶数の場
合は(M/2)±n〔但し、n=0,1,2,‥‥,
{(M/2)−2}〕層目の膜の何れかがSiO2 で形
成されている。又、膜総数が奇数の場合には、{(M+
1)/2}±n〔但し、n=0,1,2,‥‥,
{〔(M+1)/2〕−2}〕層目の膜の何れかがSi
2 で形成されている。或いは、積層された誘電体膜の
うち少なくとも一層は氷晶石で形成されている。
In order to achieve the above object, the light absorbing film according to the present invention comprises the following light absorbing film in which a dielectric film and a metal film are laminated. That is,
When the number of films to be laminated is M, and the total number of films is an even number, (M / 2) ± n (where n = 0, 1, 2, ...,
One of the {(M / 2) -2}] layer films is formed of SiO 2 . If the total number of films is odd, {(M +
1) / 2} ± n (however, n = 0, 1, 2, ...
Any one of the {[(M + 1) / 2] -2}] layer films is Si.
It is formed of O 2 . Alternatively, at least one layer of the laminated dielectric films is made of cryolite.

【0009】[0009]

【作用】反射防止のための分光透過率の均一な光吸収膜
をTiやインコネルを用いて設計すると、膜は、低屈折
率の誘電体膜と金属膜を交互に積層した構成となり、特
に7層以上の多層膜とすると良好な特性が得られる。こ
の場合、誘電体膜にはMgF2 が多く用いられるが、M
gF2 は図2に示されるように膜の応力が大きいことか
ら、総膜厚が厚い設計となった場合には、膜にクラック
が発生し易くなる。そこで図2に示されている如く膜の
応力の発生が少ないSiO2 を用いることで、MgF2
の膜の応力を相殺することができる。
When a light absorption film having a uniform spectral transmittance for preventing reflection is designed by using Ti or Inconel, the film has a structure in which dielectric films having a low refractive index and metal films are alternately laminated, and in particular, 7 Good characteristics can be obtained by using a multilayer film having more layers. In this case, MgF 2 is often used for the dielectric film, but M
Since gF 2 has a large film stress as shown in FIG. 2, when the total film thickness is designed to be large, cracks are likely to occur in the film. Therefore, as shown in FIG. 2, by using SiO 2 which causes less stress in the film, MgF 2
It is possible to cancel the stress of the film.

【0010】しかしながら、1/4λの位相差を有する
位相膜にこれを用いようとすると、図1に示すように膜
を射出する光線Aの位相と接合剤を通る光線Bの位相と
の間の差を1/4λとしなければならないことから、M
gF2 を総てSiO2 にしてしまうと膜の屈折率と接合
剤の屈折率との差が小さくなってしまい、厚い膜となっ
てしまう。そこで、膜の中心部付近、即ち、積層される
べき膜数をMとしたとき、膜総数が偶数の場合は(M/
2)±n〔但し、n=0,1,2,‥‥,{(M/2)
−2}〕層目の膜に、又膜総数が奇数の場合は{(M+
1)/2}±n〔但し、n=0,1,2,‥‥,
{〔(M+1)/2〕−2}〕層目の膜をSiO2 で形
成することにより、膜前半部におけるMgF2 で発生し
た応力を膜中心部で相殺することができ、且つ全体の膜
厚も余り厚くなることのない而も加工し易い光吸収膜を
作ることができる。
However, if this is used for a phase film having a phase difference of 1 / 4λ, as shown in FIG. 1, the phase between the phase of the light ray A that exits the film and the phase of the light ray B that passes through the bonding agent is increased. Since the difference must be 1 / 4λ, M
If all gF 2 is SiO 2 , the difference between the refractive index of the film and the refractive index of the bonding agent becomes small, resulting in a thick film. Therefore, when the number of films to be stacked is M near the center of the film, that is, (M /
2) ± n [however, n = 0, 1, 2, ..., {(M / 2)
-2}] layer film, or {(M +
1) / 2} ± n (however, n = 0, 1, 2, ...
By forming the film of the {[(M + 1) / 2] -2}] layer with SiO 2 , the stress generated in MgF 2 in the first half of the film can be canceled at the center of the film, and the entire film can be canceled. It is possible to form a light-absorbing film that is not too thick and is easy to process.

【0011】又、氷晶石(Na3 AIF6 )は分子中に
Naを含むため潮解性を有するという問題点はあるが、
MgF2 に比べて応力の発生が可成り小さい(図2参
照)ので、誘電体膜の少なくとも一層を氷晶石で形成す
れば、膜総厚を厚くしたり層数を多くしても、MgF2
を用いた膜に比べてクラックは発生しにくくなる。又、
位相膜として氷晶石を用いる場合は、接合剤を用いて膜
全体をガラス板で挾み、膜への水分の浸入を防止する構
成とすることが好ましい。
Although cryolite (Na 3 AIF 6 ) has a deliquescent property because it contains Na in its molecule,
Since the stress generation is much smaller than that of MgF 2 (see FIG. 2), if at least one layer of the dielectric film is made of cryolite, the MgF will increase even if the total film thickness is increased or the number of layers is increased. 2
Cracks are less likely to occur as compared with the film using. or,
When cryolite is used as the phase film, it is preferable to use a bonding agent to sandwich the entire film with a glass plate to prevent water from entering the film.

【0012】[0012]

【実施例】実施例1 光吸収膜はTiとMgF2 とSiO2 を用いて9層から
成っており、膜全体を屈折率n=1.56の接合剤を用
いて、屈折率n=1.516の基板ガラスとガラス板と
で挾み、位相差は1/4λとなるようにした(図1参
照)。基板ガラス上に順次積層された各層1乃至9の成
分,厚さd,屈折率n及び550nmの波長の光の透過率
Tは下記の通りである。 層 成分 d n T(%) 1 MgF2 286.4 1.37914 2 Ti 70.9 3 MgF2 77.6 1.37914 4 Ti 48.9 5 SiO2 70.9 1.46019 6 Ti 48.9 7 MgF2 77.6 1.37914 8 Ti 70.9 9 MgF2 286.4 1.37914 光吸収膜の構成は、入射側と射出側の膜構成を対称にす
ることにより、両面反射防止とした。尚、透過率25%
以下の光吸収膜を両面反射防止とした場合には、9層以
上とした方がよい。分光特性は図3に示す通りである。
EXAMPLE 1 A light absorbing film is composed of 9 layers using Ti, MgF 2 and SiO 2 , and the entire film is made of a bonding agent having a refractive index n = 1.56 and a refractive index n = 1. It was sandwiched between the substrate glass of 0.516 and the glass plate, and the phase difference was set to 1 / 4λ (see FIG. 1). The components, the thickness d, the refractive index n, and the transmittance T of light having a wavelength of 550 nm of each of the layers 1 to 9 sequentially laminated on the substrate glass are as follows. Layer component d n T (%) 1 MgF 2 286.4 1.37914 2 Ti 70.9 3 MgF 2 77.6 1.37914 4 Ti 48.9 5 SiO 2 70.9 1.460196 6 Ti 48.9 7 MgF 2 77.6 1.37914 8 Ti 70.9 9 MgF 2 286.4 1.37914 The structure of the light absorbing film was antireflection on both sides by making the film structure on the incident side and the emitting side symmetrical. .. 25% transmittance
When the following light-absorbing films are anti-reflection on both sides, it is better to have 9 or more layers. The spectral characteristics are as shown in FIG.

【0013】実施例2 光吸収膜はTiとMgF2 とSiO2 を用いて11層か
ら成っていて、全体を実施例1と同様に構成した。各層
の成分,厚さd,屈折率n及び透過率Tは下記の通りで
ある。 層 成分 d n T(%) 1 MgF2 314.5 1.37914 2 Ti 57.7 3 MgF2 80.3 1.37914 4 Ti 31.4 5 SiO2 81.7 1.46019 6 Ti 31.4 7 SiO2 81.7 1.46019 8 Ti 31.4 9 MgF2 80.3 1.37914 10 Ti 57.7 11 MgF2 314.5 1.37914 第5層と第7層をSiO2 で形成することにより、光吸
収膜の特性は良好となる。特に光吸収膜の透過率を15
%以下にした場合は、総膜厚が厚くなるため、積層数を
11層程度とした方がクラックが発生しにくい。分光特
性は図4に示す通りである。
Example 2 The light absorbing film was composed of 11 layers using Ti, MgF 2 and SiO 2 , and the whole structure was the same as in Example 1. The components of each layer, the thickness d, the refractive index n, and the transmittance T are as follows. Layer component d n T (%) 1 MgF 2 314.5 1.37914 2 Ti 57.7 3 MgF 2 80.3 1.37914 4 Ti 31.4 5 SiO 2 81.7 1.46019 6 Ti 31.4 7 SiO 2 81.7 1.46019 8 Ti 31.49 MgF 2 80.3 1.37914 10 Ti 57.7 11 MgF 2 314.5 1.37914 The fifth layer and the seventh layer are formed of SiO 2 . As a result, the characteristics of the light absorbing film are improved. Especially, the transmittance of the light absorption film is 15
%, The total film thickness becomes large. Therefore, cracks are less likely to occur when the number of stacked layers is about 11 layers. The spectral characteristics are as shown in FIG.

【0014】実施例3 光吸収膜はインコネルと氷晶石を用いて11層から成っ
ており、全体を実施例1と同様に構成した。各層の成
分,厚さd,屈折率n及び透過率Tは下記の通りであ
る。 層 成分 d n T(%) 1 氷晶石 224.2 1.371 2 インコネル 70.9 3 氷晶石 64.8 1.371 4 インコネル 58.4 5 氷晶石 37.4 1.371 6 インコネル 58.4 7 氷晶石 37.4 1.371 8 インコネル 58.4 9 氷晶石 64.8 1.371 10 インコネル 70.9 11 氷晶石 224.2 1.371 分光特性は図5に示す通りである。
Example 3 The light absorbing film was composed of 11 layers using Inconel and cryolite, and the whole structure was the same as in Example 1. The components of each layer, the thickness d, the refractive index n, and the transmittance T are as follows. Layer component d n T (%) 1 Cryolite 224.2 1.371 2 Inconel 70.9 3 Cryolite 64.8 1.371 4 Inconel 58.4 5 Cryolite 37.4 1.371 16 Inconel 58.4 7 Cryolite 37.4 1.371 8 Inconel 58.4 9 Cryolite 64.8 1.371 10 Inconel 70.9 11 Cryolite 224.2 1.371 The spectral characteristics are shown in FIG. On the street.

【0015】実施例4 光吸収膜はTiとMgF2 とSiO2 を用いて11層か
ら成っていて、実施例2の第5層と第7層をMgF2
し、又第3層と第9層をSiO2 として本実施例による
膜を構成した。各層の成分,厚さd,屈折率n及び透過
率Tは下記の通りである。 層 成分 d n T(%) 1 MgF2 400 1.37914 2 Ti 65.9 3 SiO2 74.89 1.46019 4 Ti 47.4 5 MgF2 93.94 1.37914 6 Ti 47.4 7 MgF2 93.94 1.37914 8 Ti 47.4 9 SiO2 74.89 1.46019 10 Ti 65.9 11 MgF2 400. 1.37914 尚、より厚い光吸収膜を構成する場合、屈折率nの大き
な位置にSiO2 膜を入れることで、更に応力を小さく
することができる。本実施例は屈折率nが3の場合に相
当する。又、分光特性は図6に示す通りである。
[0015] Example 4 the light absorbing film is consisted 11 layers using Ti and MgF 2 and SiO 2, the fifth layer and the seventh layer of Example 2 and MgF 2, also the third layer and the ninth A film according to this example was formed by using SiO 2 as a layer. The components of each layer, the thickness d, the refractive index n, and the transmittance T are as follows. Layer component d n T (%) 1 MgF 2 400 1.37914 2 Ti 65.9 3 SiO 2 74.89 1.46019 4 Ti 47.4 5 MgF 2 93.94 1.37914 6 Ti 47.4 7 MgF 2 93.94 1.37914 8 Ti 47.4 9 SiO 2 74.89 1.46019 10 Ti 65.9 11 MgF 2 400. 1.37914 In the case of forming a thicker light absorbing film, the stress can be further reduced by inserting the SiO 2 film at the position where the refractive index n is large. This embodiment corresponds to the case where the refractive index n is 3. The spectral characteristics are as shown in FIG.

【0016】実施例5 光吸収膜はTiとMgF2 とSiO2 を用いて13層か
ら構成されている。各層の成分,厚さd,屈折率n及び
透過率Tは下記の通りである。 層 成分 d n T(%) 1 MgF2 250 1.37914 2 Ti 67.9 3 SiO2 83.48 1.46019 4 Ti 67.9 5 MgF2 140.84 1.37914 6 Ti 67.9 7 MgF2 87.07 1.37914 8 Ti 67.9 9 MgF2 140.84 1.37914 10 Ti 67.9 11 SiO2 83.48 1.46019 12 Ti 67.9 13 MgF2 250. 1.37914 本実施例は屈折率nが4の場合である。又、分光特性は
図7に示す通りである。
Example 5 The light absorption film is composed of 13 layers using Ti, MgF 2 and SiO 2 . The components of each layer, the thickness d, the refractive index n, and the transmittance T are as follows. Layer component d n T (%) 1 MgF 2 250 1.37914 2 Ti 67.9 3 SiO 2 83.48 1.46019 4 Ti 67.9 5 MgF 2 140.84 1.37914 6 Ti 67.97 MgF 2 87.07 1.37914 8 Ti 67.9 9 MgF 2 140.84 1.37914 10 Ti 67.9 11 SiO 2 83.48 1.46019 12 Ti 67.9 13 MgF 2 250. 1.37914 In this embodiment, the refractive index n is 4. The spectral characteristics are as shown in FIG.

【0017】[0017]

【発明の効果】上述の如く本発明によれば、膜全体とし
て応力発生が少なく、クラックの発生することのない高
品質の光吸収膜を提供することができる。
As described above, according to the present invention, it is possible to provide a high-quality light-absorbing film in which stress is not generated as a whole and cracks are not generated.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る光吸収膜の一実施例の全体構成図
である。
FIG. 1 is an overall configuration diagram of an embodiment of a light absorption film according to the present invention.

【図2】各種物質から成る薄膜の応力の膜厚依存性を示
す特性線図である。
FIG. 2 is a characteristic diagram showing the film thickness dependence of stress of thin films made of various substances.

【図3】本発明に係る光吸収膜の第1実施例の分光特性
線図である。
FIG. 3 is a spectral characteristic diagram of a first embodiment of a light absorbing film according to the present invention.

【図4】本発明に係る光吸収膜の第2実施例の分光特性
線図である。
FIG. 4 is a spectral characteristic diagram of a second embodiment of the light absorbing film according to the present invention.

【図5】本発明に係る光吸収膜の第3実施例の分光特性
線図である。
FIG. 5 is a spectral characteristic diagram of a light absorbing film according to a third embodiment of the present invention.

【図6】本発明に係る光吸収膜の第4実施例の分光特性
線図である。
FIG. 6 is a spectral characteristic diagram of a light absorbing film according to a fourth embodiment of the present invention.

【図7】本発明に係る光吸収膜の第5実施例の分光特性
線図である。
FIG. 7 is a spectral characteristic diagram of a fifth embodiment of the light absorbing film according to the present invention.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】誘電体膜と金属膜とを積層することによっ
て構成される光吸収膜において、積層されるべき膜数を
Mとしたとき、膜総数が偶数の場合、(M/2)±n
〔但し、n=0,1,2,‥‥,{(M/2)−2}〕
層目の膜の何れかをSiO2 により形成したことを特徴
とする光吸収膜。
1. A light absorbing film formed by stacking a dielectric film and a metal film, where M is the number of films to be stacked, and (M / 2) ± n
[However, n = 0, 1, 2, ..., {(M / 2) -2}]
A light absorbing film, characterized in that any one of the layers is formed of SiO 2 .
【請求項2】誘電体膜と金属膜とを積層することによっ
て構成される光吸収膜において、積層されるべき膜数を
Mとしたとき、膜総数が奇数の場合、{(M+1)/
2}±n〔但し、n=0,1,2,‥‥,{〔(M+
1)/2〕−2}〕層目の膜の何れかをSiO2 により
形成したことを特徴とする光吸収膜。
2. A light-absorbing film formed by stacking a dielectric film and a metal film, where M is the number of films to be stacked, and {(M + 1) /
2} ± n [however, n = 0, 1, 2, ..., {[(M +
1) / 2] -2}]] A light-absorbing film, characterized in that any one of the layers is formed of SiO 2 .
【請求項3】誘電体膜と金属膜とを積層することによっ
て構成される光吸収膜において、少なくとも一層の誘電
体膜を氷晶石によって構成したことを特徴とする光吸収
膜。
3. A light absorbing film formed by laminating a dielectric film and a metal film, wherein at least one layer of the dielectric film is made of cryolite.
JP33352191A 1991-08-06 1991-12-17 Light absorptive film Pending JPH0593811A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19657391 1991-08-06
JP3-196573 1991-08-06

Publications (1)

Publication Number Publication Date
JPH0593811A true JPH0593811A (en) 1993-04-16

Family

ID=16359991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33352191A Pending JPH0593811A (en) 1991-08-06 1991-12-17 Light absorptive film

Country Status (1)

Country Link
JP (1) JPH0593811A (en)

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JPH0933959A (en) * 1995-07-14 1997-02-07 Olympus Optical Co Ltd Phase control film structure
US5715103A (en) * 1993-08-26 1998-02-03 Canon Kabushiki Kaisha Neutral density (ND) filter
US6671109B2 (en) 2001-07-27 2003-12-30 Nidec Copal Corporation ND filter having composite PVD film of metal and its oxide
WO2007083833A1 (en) * 2006-01-20 2007-07-26 Sumitomo Metal Mining Co., Ltd. Absorption-type multilayer film nd filter and process for producing the same
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US9844898B2 (en) 2011-09-30 2017-12-19 Apple Inc. Mirror feature in devices
US10099506B2 (en) 2016-09-06 2018-10-16 Apple Inc. Laser bleach marking of an anodized surface
US10919326B2 (en) 2018-07-03 2021-02-16 Apple Inc. Controlled ablation and surface modification for marking an electronic device
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Cited By (25)

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Publication number Priority date Publication date Assignee Title
US5715103A (en) * 1993-08-26 1998-02-03 Canon Kabushiki Kaisha Neutral density (ND) filter
JPH0933959A (en) * 1995-07-14 1997-02-07 Olympus Optical Co Ltd Phase control film structure
US6671109B2 (en) 2001-07-27 2003-12-30 Nidec Copal Corporation ND filter having composite PVD film of metal and its oxide
WO2007083833A1 (en) * 2006-01-20 2007-07-26 Sumitomo Metal Mining Co., Ltd. Absorption-type multilayer film nd filter and process for producing the same
JPWO2007083833A1 (en) * 2006-01-20 2009-06-18 住友金属鉱山株式会社 Absorption-type multilayer ND filter and method for manufacturing the same
US7894148B2 (en) 2006-01-20 2011-02-22 Sumitomo Metal Mining Co., Ltd. Absorption type multi-layer film ND filter and process for producing the same
JP4692548B2 (en) * 2006-01-20 2011-06-01 住友金属鉱山株式会社 Absorption-type multilayer ND filter and method for manufacturing the same
JP4568810B1 (en) * 2010-03-03 2010-10-27 ナルックス株式会社 Thin film type light absorption film
WO2011108040A1 (en) * 2010-03-03 2011-09-09 ナルックス株式会社 Thin light absorbing film
JP2011180532A (en) * 2010-03-03 2011-09-15 Nalux Co Ltd Thin-film type optical absorbing film
US9844898B2 (en) 2011-09-30 2017-12-19 Apple Inc. Mirror feature in devices
US11033984B2 (en) 2013-06-09 2021-06-15 Apple Inc. Laser-formed features
US9790126B2 (en) 2013-09-05 2017-10-17 Apple Inc. Opaque color stack for electronic device
TWI612342B (en) * 2013-09-05 2018-01-21 蘋果公司 Opaque color stack for electronic device
US10592053B2 (en) 2013-09-05 2020-03-17 Apple Inc. Opaque white coating with non-conductive mirror
US10781134B2 (en) 2013-09-05 2020-09-22 Apple Inc. Opaque color stack for electronic device
US9727178B2 (en) 2013-09-05 2017-08-08 Apple Inc. Opaque white coating with non-conductive mirror
US10099506B2 (en) 2016-09-06 2018-10-16 Apple Inc. Laser bleach marking of an anodized surface
JP2017167557A (en) * 2017-05-22 2017-09-21 旭硝子株式会社 Light absorber and image capturing device using the same
US10919326B2 (en) 2018-07-03 2021-02-16 Apple Inc. Controlled ablation and surface modification for marking an electronic device
US11772402B2 (en) 2018-07-03 2023-10-03 Apple Inc. Controlled ablation and surface modification for marking an electronic device
US11200385B2 (en) 2018-09-27 2021-12-14 Apple Inc. Electronic card having an electronic interface
US11200386B2 (en) 2018-09-27 2021-12-14 Apple Inc. Electronic card having an electronic interface
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