JPH0589429A - Thin-film coil type magnetic head and production thereof - Google Patents

Abstract

PURPOSE:To improve a high-frequency characteristic while assuring good head efficiency by spirally forming a coil of conductive film via insulating layers around a ferrite core formed to a prescribed thickness. CONSTITUTION:A thin planar core chip 14 as the 1st ferrite core and a slider body 10 as the 2nd ferrite core are butted and joined to constitute a magnetic circuit. A magnetic gap 26 of a above-mentioned spacing is formed between the butt surfaces of these chips 14, 10 and the coil 18 is provided on the 1st ferrite core 14. The 1st ferrite core 14 is formed at 10 to 100mum thickness and the coil 18 is spirally formed of the conductive thin film via the insulating layers 20, 21 around this core 14, by which the thin-film coil type magnetic head is spirally formed. A magnetic metallic film 28 is provided on at least either of the opposite surfaces of the two cores 14, 10 in the part where the magnetic gap 26 is formed. The low inductance characteristic and low magnetic resistance are compatibly obtd. in this way and the high-frequency characteristic is improved while the good head efficiency is assured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film coil type magnetic head and a method for manufacturing the same, and more particularly to a thin film coil type magnetic head capable of advantageously dealing with an increase in recording density in a magnetic recording medium and a method for manufacturing the same. Is.

[0002]

BACKGROUND ART Conventionally, RDD, HDD, FDD, VT
As a magnetic head used for R or the like, a first ferrite core and a second ferrite core are butted and joined to each other to form a magnetic circuit, and a magnetic gap having a predetermined gap is provided between the butted surfaces. It is formed by mounting the winding coil on the first ferrite core,
A so-called bulk type is used.

However, in this bulk type magnetic head, in addition to the fragile ferrite material,
It is difficult to reduce the thickness of the first ferrite core in order to secure the strength when winding or mounting the coil.
It was formed with a thickness of 00 μm or more. For that reason, it is unavoidable that the inductance becomes large, and 20MHz
Since electric resonance is likely to occur at the above high frequencies, there has been a problem that it is not possible to cope with the recent increase in recording density of magnetic recording media, that is, increase in frequency accompanying increase in linear density.

On the other hand, in recent years, a so-called thin film type magnetic head has been proposed in which a magnetic circuit and a coil are respectively composed of a magnetic film and a conductive film formed by a thin film process such as photoetching. In this thin film type magnetic head, low inductance characteristics can be advantageously realized, so that it is possible to advantageously cope with higher frequencies accompanying the increase in recording density in the magnetic recording medium.

However, in such a thin-film type magnetic head, since the magnetic plate forming the magnetic path is too thin, it is possible to avoid a decrease in head efficiency due to an increase in magnetic resistance as compared with the bulk type described above. However, there is a problem that it is difficult to obtain sufficient signal responsiveness. The magnetic plate in a thin film type magnetic head is generally formed by a sputtering method, so if one tries to increase the thickness,
This is because problems such as prolongation of manufacturing time and peeling due to film stress are caused, and in reality, the thickness must be 5 μm or less.

[0006] In short, in the conventionally known technology relating to the bulk type or thin film type magnetic head, a low inductance characteristic for coping with an increase in frequency accompanying an increase in recording density in a magnetic recording medium, and a good head efficiency. It has been extremely difficult to realize a magnetic head which can satisfy both the low magnetic resistance characteristic for obtaining the desired value at a reasonable place.

[0007]

The present invention has been made in view of the circumstances as described above, and the problem to be solved is to achieve a low inductance characteristic while ensuring good head efficiency. It is an object of the present invention to provide a magnetic head having a novel structure capable of achieving the above and an advantageous manufacturing method of the magnetic head.

[0008]

In order to solve such a problem, in the present invention, a first ferrite core and a second ferrite core are butted and joined together to form a magnetic circuit, and the butted parts are joined together. In a magnetic head in which a magnetic gap having a predetermined gap is formed between surfaces and a coil is provided on the first ferrite core, at least the first ferrite core is formed to have a thickness of 10 to 100 μm, and The thin-film coil type magnetic head is characterized in that the coil is spirally formed of a conductive thin film around the first ferrite core with an insulating layer interposed therebetween.

Further, according to the present invention, in such a thin film coil type magnetic head, a metal magnetic layer is formed on at least one of the facing surfaces of the first ferrite core and the second ferrite core in the magnetic gap forming portion. A thin film coil type magnetic head provided with is also one of its features.

Furthermore, according to the present invention, the second ferrite core is formed to have a thickness of 10 to 100 μm, and a non-magnetic layer is interposed in a groove provided in a predetermined holding member. The thin-film coil type magnetic head as described above, which is embedded, is also a feature.

Further, the present invention is a method for manufacturing a thin film coil type magnetic head according to the present invention as described above, which comprises (a)
A step of forming a coil half with a conductive thin film on the surface of a predetermined support member; and (b) a step of fixing a ferrite substrate to the surface of the support member on which the coil half is formed via an insulating layer. And (c) the ferrite substrate
A step of forming the first ferrite core by polishing and shaping into a predetermined shape to a thickness of up to 100 μm, and (d) the surface of the support member on which the first ferrite core is formed. And a step of forming a coil half by forming a coil half with a conductive thin film via an insulating layer and connecting the coil half with the coil half formed on the surface of the support member. The method of manufacturing a magnetic head is also a feature thereof.

In the method of manufacturing a thin film coil type magnetic head according to the present invention, for example, after the first ferrite core formed on the supporting member is joined to the second ferrite core, The support member will be removed.

Alternatively, in the method of manufacturing a thin film coil type magnetic head according to the present invention, for example, the support member is formed of a member forming the second ferrite core.

[0014]

The embodiments of the present invention will now be described in detail with reference to the drawings in order to clarify the present invention more specifically.

First, the RDD having the structure according to the present invention is formed.
A specific example of a monolithic magnetic head for a magnetic disk is shown in FIG. In addition, an enlarged plan view and a cross-sectional view of the main part are
2 and 3, a perspective explanatory view of the state in which the protective film of the main part is further removed is shown in FIG.

In these figures, 10 is Ni-Zn.
A slider body made of ferrite such as ferrite or Mn-Zn ferrite. Further, the slider body 10 is provided with a pair of air bearing portions 12, 12 having a predetermined height on the surface facing the magnetic recording medium such as a magnetic disk as in the conventional case.

Further, a groove 16 extending in the widthwise direction at the central portion in the thickness direction is formed on the trailing side end surface of the slider body 10, and the groove 16 is formed so as to straddle the thicknesswise direction. A thin plate-shaped core chip 14 serving as a first ferrite core is provided, and is integrally joined to both side portions sandwiching the concave groove 16 with a non-magnetic joining material such as glass. As the material of the core chip 14, the same material as that of the slider body 10 is adopted.

The slider body 10 and the core chip 14 form an annular closed magnetic circuit as a magnetic circuit, and are exposed to the air bearing portion 12 between the joint surfaces of the slider body 10 and the core chip 14. A magnetic gap 26 having a predetermined gap is formed. As is clear from this, in the present embodiment, the slider body 10 is formed as the second ferrite core. Further, in this embodiment, the slider body 10 and the core chip 1 that form the magnetic gap 26 are formed.
Metal magnetic layers 28 and 29 made of sendust or the like are provided on the surface facing the surface 4, respectively, and have a so-called metal in gap (MIG) structure.

Further, around the core chip 14,
In a state of being electrically insulated by the insulating layers 20 and 21,
Coil 1 that extends so as to surround its outer periphery in a spiral shape
8 are provided. Here, this coil 18
Is formed of a conductive thin film formed by a thin film process using a method such as a sputtering method, a plating method, or a photo etching method. In addition, this coil 18
Lead terminals 22 are provided at both ends of the coil 18, respectively, and a recording current is supplied to the coil 18 or a reproducing current is taken out through the lead terminals 22.

Further, as described above, a protective layer 30 having a predetermined thickness is provided on the end surface of the slider body 10 provided with the core chip 14 and the coil 18 to protect them. Then, only the lead terminals 22, 22 of the coil 18 are exposed on the surface by the protective layer 30.

Further, in the magnetic head having such a structure, the core chip 14 constituting the magnetic circuit has a thickness d of 10 to 100 μm, preferably 10 to 50 μm.
It is set to be μm. In other words, since the magnetic head has the structure as described above, it is possible to set the thickness d of the core chip 14 in such a manner, thereby improving the head efficiency. Thus, the low inductance characteristic can be advantageously realized while ensuring.

More specifically, since the core chip 14 is formed of ferrite instead of a metal magnetic film such as the conventional thin film type magnetic head, the core chip 14 has a thickness of 10 μm or more without causing a problem such as peeling due to film stress. It has become possible to secure the wall thickness in an advantageous and easy manner.
In addition, since the coil 18 is configured by a thin film coil instead of a hand-wound coil such as the conventional bulk type magnetic head, the strength required for the core chip 14 for mounting the coil can be advantageously reduced. Therefore, the thickness can be set to 100 μm or less.

By thus setting the thickness d of the core chip 14 constituting the magnetic circuit to be 10 μm or more, a significant increase in magnetic resistance can be avoided and good head efficiency can be obtained. And, again,
By setting the thickness d of the core chip 14 to 100 μm or less, it is possible to avoid high inductance and obtain good high frequency characteristics. As a result, it is possible to realize a magnetic head that can cope with high density of the magnetic recording medium extremely advantageously.

Moreover, in such a magnetic head, since the core chip 14 constituting the magnetic circuit is made of ferrite, the eddy current is larger than that of the thin film type magnetic circuit in which the magnetic circuit is constituted by the metal magnetic film. The loss can be reduced extremely effectively, and in combination with the effect based on the thickness of the core chip 14 as described above, even more excellent head efficiency can be exhibited.

In the magnetic head of this embodiment,
Since the metal-in-gap structure in which the metal magnetic layer 28 is provided in the portion where the magnetic gap 26 is formed is employed, and the magnetic flux density of the leakage magnetic field in the magnetic gap 26 can be effectively obtained, magnetic recording with high coercive force is achieved. It can be favorably applied to a medium, and in combination with the excellent high frequency characteristics as described above, it is possible to more advantageously cope with the high density of the magnetic recording medium.

By the way, the thin film coil type magnetic head according to the present invention as described above can be easily manufactured by adopting a known method, but particularly, it can be advantageously manufactured by the method described below. it can.

First, as shown in FIG.
Core chip 42 as a first ferrite core described later
A first ferrite substrate 32 that provides In addition,
As described above, Mn is added to the first ferrite substrate 32.
A single crystal material of -Zn ferrite or Ni-Zn ferrite is preferably used. Then, after mirror-finishing one surface of the first ferrite substrate 32, SiO _{2 is formed on the} surface.
An insulating layer 34 such as Al ₂ O ₃ or the like is formed by sputtering to have a thickness of about 1 μm.

Then, as shown in FIG. 6, on the insulating layer 34 of the first ferrite substrate 32, a coil half body 36 for providing a coil 48 to be described later is formed by a conductive thin film such as copper or copper alloy. It is formed with a plurality of parallel straight lines. The coil half body 36 is formed by a thin film process, for example, a method of forming a copper film on the entire surface of the insulating layer 34 by sputtering, patterning the resist, and then etching and further peeling the resist. Is formed with a thickness of about 4 to 10 μm.

Further, as shown in FIG. 7, an insulating layer 38 such as SiO ₂ or Al ₂ O _{3 is} formed by sputtering so as to cover the coil half body 36. Note that FIG.
FIG. 4 is an enlarged cross-sectional view showing only a main part of the first ferrite substrate 32.

Further, as shown in FIG. 8, a supporting substrate 40 as a supporting member is prepared. The supporting substrate 4
Since 0 does not constitute a magnetic head, its material is not particularly limited, but from the viewpoint of securing adhesive force with the first ferrite substrate 32 and ease of subsequent removal, for example, Single crystal or polycrystalline ferrite is preferably used. Then, after one surface of the support substrate 40 is mirror-finished to form an adhesive surface, a bonding glass layer is formed on at least one of the adhesive surface and the surface on which the insulating layer 38 is formed on the first ferrite substrate 32. Are formed by sputtering. Then, the first ferrite substrate 32 and the supporting substrate 40 are butted against each other through the bonding glass layer and heated to, for example, 500 to 600 ° C. to bond them.

Next, the first ferrite substrate 32 of the obtained joined body is subjected to polishing to reduce the thickness. Here, the polishing process is performed such that the thickness of the first ferrite substrate 32 becomes a target dimension within the range of 10 to 100 μm. Then, as shown in FIG. 9, a shaping operation is applied to the thinned first ferrite substrate 32 to form a core chip 42 having a predetermined shape. The shaping operation is performed, for example, by patterning the resist into the desired shape of the core chip on the first ferrite substrate 32, and then viewing the coil half body 36 in the phosphoric acid aqueous solution through the insulating layer 34. Etching until the unnecessary parts of ferrite are completely removed, and then
This is performed by the method of removing the resist.

Further, as shown in FIG. 10, with respect to the surface of the support substrate 40 to which the core chip 42 is fixed, the entire surface including the surface of the core chip 42 is covered.
An insulating layer 44 such as SiO ₂ or Al ₂ O ₃ is formed by sputtering to have a thickness of about 1 μm. After that, the second ferrite substrate 5 described later in the core chip 42 is formed.
At the joints a and b with 2 and the coil half 36,
The insulating layer 44 is removed at each connection portion c with the coil half body 46 described later. Generally, the insulating layer 44 is removed by patterning the resist, etching the resist, and then peeling the resist.

Next, as shown in FIG. 11, a coil half body 46 extending over the core chip 42 is formed in a plurality of parallel and substantially linear shapes on the surface on which the insulating layer 44 is formed. Each connection part c in the coil half 36
Connect to. Thereby, the core chip 42 as a whole
A coil 48 is formed that extends spirally around the. The coil half body 46 is formed by, for example, sputtering a copper film and performing a photoetching operation, like the coil half body 36. Also, this coil half 4
6 is the insulating layer 34, 44 with respect to the core chip 42.
Are electrically insulated by.

Thereafter, as shown in FIG. 12, a metal magnetic layer 50 of sendust or the like is formed on each of the joint portions a and b in the core chip 42. The metal magnetic layer 50 is formed, for example, by sputtering the metal magnetic layer and performing a photoetching operation so as to have a thickness of about 2 to 4 μm, similar to the formation of the coil half body 46. At that time, the coil half body 46 (coil 4
In order to prevent 8) from being removed, it is necessary to perform a process such as applying a resist for protecting the coil half body 46 before the sputtering of the metal magnetic layer 50.

On the other hand, separately from the step of forming the core chip 42, the coil 48, etc. on the support substrate 40, as shown in FIG. 13, a second ferrite substrate 52 which provides a slider body as a second ferrite core is prepared. To do. As the second ferrite substrate 52, a single crystal material of Mn-Zn ferrite or Ni-Zn ferrite is preferably used as described above. Then, after mirror-finishing one surface of the second ferrite substrate 52 (the surface on the trailing side to which the core chip 42 is to be joined), a concave portion extending in the width direction is formed in the central portion in the thickness direction of the surface. The groove 54 is formed. The concave groove 54 is formed by, for example, a photolithography method on both end portions in the thickness direction of the end surface of the second ferrite substrate 52, after forming a resist film, and then performing a chemical etching operation using phosphoric acid or the like. It is performed by applying. The depth of the concave groove 54 is
As will be described later, the core chip 42 joined to the forming surface
And the coil 48 to such an extent that sufficient electric and magnetic insulation is obtained, and usually 10 to 30
It is formed with a depth of about μm.

Next, as shown in FIG. 14, a metal magnetic layer 56 of sendust or the like is formed on at least the magnetic gap forming portion of the surface of the second ferrite substrate 52 on which the concave groove 54 is formed. To do. The metal magnetic layer 56 is formed, for example, by the core chip 42.
Similarly to the formation of the metal magnetic layer 50 in FIG.
The thickness is set to about 4 μm. Further, in the present embodiment, the metal magnetic layer 56 is formed in a shape substantially corresponding to the core chip 42, including the bottom of the groove 54 and the back gap forming portion.

After that, at least one of the surface of the second ferrite substrate 52 on which the metal magnetic layer 56 is formed and the surface of the support substrate 40 on which the core chip 42 is formed, preferably the second ferrite substrate 52. An insulating layer made of SiO ₂ or the like for forming a magnetic gap is formed on the side surface, and a bonding glass layer is further formed to a predetermined thickness by sputtering or the like. Then, as shown in FIGS. 15 and 16, the second ferrite substrate 52 and the core chip 42 on the support substrate 40 are joined by this joining glass layer. Simultaneously with the bonding operation, the glass 60 is poured into a portion other than the abutting surface of the second ferrite substrate 52 and the support substrate 40 with respect to the core chip 42 to be filled and fixed.

Further, after such joining operation, the core chip 4 is
The support substrate 40 bonded to 2 is removed. The removal of the support substrate 40 can be advantageously performed by, for example, chemical etching using phosphoric acid or the like. At this time, the insulating layer 38 made of SiO ₂ or the like formed between the core chip 42 and the support substrate 40 functions as a stopper for stopping etching, and the coil 48 and the like can be protected.

That is, by removing the supporting substrate 40, the second ferrite substrate 52 and the core chip 42 are integrally joined, and a joined body is obtained in which a magnetic circuit is constituted by them, and these are joined together. The metal magnetic layers 50 and 56 formed on the bonding surfaces are bonded to face each other with the insulating layer 62 interposed therebetween, so that the magnetic gap 64 at a predetermined interval is formed between the bonding surfaces of the metal magnetic layers 50 and 56. Is formed.

After that, as shown in FIG. 17, both ends of the coil 48 in the bonded body of the second ferrite substrate 52 and the core chip 42 are exposed by a feto-etching operation or the like, and are exposed there. By applying copper plating, the both ends are thickened to form the lead terminals 66, 66.

After that, as shown in FIG. 18, a protective film 68 for covering the core chip 42, the coil 48, etc. is formed on the surface of the bonded body on the core chip 42 side with Al ₂ O ₃ or the like to have a predetermined thickness. By polishing the surface, only the lead terminals 66, 66 are exposed on the surface.

Further, as in the conventional case, the surface exposed with the magnetic gap of the bonded body is polished to adjust the gap depth length to a target value, and then the air bearing portion is machined or photoetched. Along with the formation, a leading ramp process is performed.

Then, as described above, the core chip 4
2. The joined body formed with all the components constituting the magnetic head, such as the coil 48, the lead terminals 66, 66, etc., is cut out with an appropriate width, and a final finish such as chamfer processing is added to each. As a result, the desired magnetic head can be obtained. The magnetic head thus obtained has a structure as shown in FIGS.

Therefore, according to the manufacturing method as described above, the first ferrite substrate 32 forming the core chip 42 is
Since the first ferrite substrate 32 is fixed and supported by the support substrate 40 and can effectively function as a reinforcing member when polishing the first ferrite substrate 32, the first ferrite substrate 32 is not damaged or broken. 10-100 while avoiding
It is possible to easily grind to a desired thickness of μm, whereby the core chip 42 and thus the desired magnetic head can be obtained advantageously.

Further, according to such a manufacturing method, a coil made of a conductive thin film can be advantageously formed by a thin film process such as photoetching, and moreover, compared with a general thin film coil manufacturing process. Since the thin film forming process is simple, excellent productivity of the magnetic head can be exhibited.

In the method of manufacturing the magnetic head in the above-described embodiment, the first ferrite substrate 32 forming the core chip 42 was made of only single crystal ferrite. Instead, it is shown in FIG. As described above, it is possible to use the first ferrite substrate 70 having a composite structure in which the magnetic gap forming portion side is formed of the non-magnetic material 72 such as glass.

When the first ferrite substrate 70 having such a composite structure is used, as shown in FIGS. 20 and 21, the metal magnetic layer 50 located at the site where the magnetic gap 64 is formed is formed on the non-magnetic material 72. Therefore, the leakage of the magnetic flux at the portion where the magnetic gap 64 is formed can be effectively prevented.

That is, as described above, when the metal magnetic layer 50 is formed on the core chip 42 by the sputtering and photoetching operations, the metal magnetic layer 50 is formed.
Is actually impossible to form with the same shape as the surface shape of the core chip 42, and is inevitably smaller than the surface shape of the core chip 42.
Therefore, in the magnetic head formed by the first method, the core chip 42 is positioned directly around the metal magnetic layer 50 so as to directly face the metal magnetic layer 56 on the second ferrite substrate 52 (slider body) side. (See FIG. 16), magnetic flux may leak there. However, in the present embodiment, the portion of the core chip 42 that is directly opposed to the metal magnetic layer 56 on the second ferrite substrate 52 side is a non-contact portion. Since it is formed of the magnetic material 72 (see FIG. 21), such leakage of magnetic flux can be prevented very effectively.

Further, in manufacturing the magnetic head according to the method of the first embodiment, the metal magnetic layer 50 is formed on the core chip 42 by the sputtering and photoetching operations (see FIG. 12), and then shown in FIG. As described above, the both side edges 50a, 50a of the metal magnetic layer 50 are removed by the laser-induced etching.
Along with 2, trimming may be performed.

That is, if such a trimming process is performed, as shown in the figure, the portion of the core chip 42 that directly faces the metal magnetic layer 56 on the second ferrite substrate 52 side is advantageously removed. Therefore, the track width at the magnetic gap forming portion can be advantageously defined, and the leakage of magnetic flux can be effectively prevented.

Alternatively, in manufacturing the magnetic head according to the method of the first embodiment, the bonded body in which the second ferrite substrate 52 and the core chip 42 are bonded is polished for setting the depth length, After forming the air bearing portion and performing the leading ramp processing, as shown in FIG. 23, a portion 64 where the magnetic gap 64 is formed.
The a and 64a may be trimmed with a laser so that the core chip 42, the second ferrite substrate 52, and the metal magnetic layers 50 and 56 have the same width.

That is, by performing such a trimming process, the track width at the magnetic gap forming portion can be advantageously defined, and the leakage of magnetic flux can be effectively prevented.

In the method of the first embodiment,
The core chip 42 was formed by polishing the first ferrite substrate 32 using the support substrate 40 with the first ferrite substrate 32 fixed and supported to the support substrate 40. Instead of 40, it is also possible to use the second ferrite substrate 52 in which the concave groove 54 is formed and to form the core chip 42, the coil 48, etc. on the second ferrite substrate.

According to such a method, since it is not necessary to use the supporting substrate 40 and the removing step of the supporting substrate 40 is unnecessary, the simplification of the manufacturing process can be achieved more effectively. Can be done.

Furthermore, in the first embodiment,
The so-called MIG type magnetic head in which the metal magnetic layers such as sendust are arranged on both side surfaces facing each other across the magnetic gap and the embodiment of the manufacturing method thereof have been described. The same can be applied to a magnetic head having no layer.

Further, in the method of the first embodiment, the slider body is formed by the second ferrite substrate 52, and the slider body cooperates with the core chip 42 to form the magnetic circuit. Although the core is configured, the second ferrite core can also have a thin core chip structure. One specific example for that is shown in FIGS.

That is, first, the first ferrite substrate 32 is used by the same steps as in the method of the first embodiment,
The core chip 42, the coil 48, and the like are formed on the support substrate 40 (see FIGS. 5 to 12).

On the other hand, separately from such steps, as shown in FIG. 24, a holding block 74 as a holding member for forming the slider body is prepared. This holding block 7
Since 4 does not form a magnetic circuit, its material is not particularly limited, and a magnetic material such as ferrite or a non-magnetic material such as CaTiO ₃ can be used. A plurality of grooves 7 extending in the thickness direction are formed on the surface of the holding block 74 on the magnetic gap formation side.
6 is formed by machining.

Separately from the holding block 74,
As shown in FIG. 25, a second ferrite substrate 78 forming a second ferrite core is prepared. As the second ferrite substrate 78, the second ferrite substrate 52 used in the method of the first embodiment is used.
Similarly to, the single crystal material of Mn-Zn ferrite or Ni-Zn ferrite is preferably used. Then, a plurality of target core chip-shaped protrusions 80 are formed on one surface of the second ferrite substrate 78 at positions corresponding to the grooves 76 provided in the holding block 74. In addition,
The formation of these convex portions 80 can be advantageously formed by a photoetching method.

Then, as shown in FIG. 26, the holding block 74 and the second ferrite substrate 78 are placed in the groove 76 of the holding block 74 in the second ferrite substrate 78.
In the state where the convex portions 80 are butted so as to enter, they are integrally joined using the joining glass. Further, at the same time as the joining operation, the gap in the groove 76 of the holding block 74 is
Glass 82 as a non-magnetic material is poured and filled.

After that, as shown in FIG. 27, the second ferrite substrate 78 is subjected to grinding to remove the second ferrite substrate 78 except for the convex portions 80. That is, thereby, at each convex portion 80,
Second core chip 84 as second ferrite core
The second core chips 84 are integrally formed with the holding block 74 in a magnetically insulated state.

The thickness of the second core chip 84 is not particularly limited, but is, for example, 10 to 100 μm.
It is desirable to form it with a thickness of m, more preferably 10 to 50 μm, in order to achieve both low inductance characteristics and low magnetic resistance. In addition, the second core chip 84
Are fixed to and supported by the holding block 74 via the glass 82. Since the holding block 74 can effectively function as a reinforcing member for the second core chip 84, the second ferrite substrate 78 is damaged. While avoiding breakage etc.
The target core can be easily ground to a desired thickness, and the second core chip 84 can be advantageously obtained.

Then, after the holding block 74 is mirror-finished on the surface on which the second core chip 84 is exposed, a groove 86 extending in the width direction is formed in the central portion in the thickness direction of the surface. Form. The formation of the concave groove 86 is performed by forming the second ferrite substrate 5 in the first embodiment.
Similar to the formation of the concave groove 54 in the second groove, it is performed by the photoetching method or the like. Further, the concave groove 86 is
The second core chip 84 is formed with a depth shallower than the thickness of the second core chip 84 so as not to be cut.

Further, a metal magnetic layer 88 of sendust or the like is formed by sputtering and photo-etching on at least the magnetic gap forming portion of the second core chip 84.

Thereafter, with the second core chip 84 of the holding block 74 facing the core chip 42 of the support substrate 40, the holding block 74 and the support substrate 40 are butted against each other and at least one of the surfaces is brought into contact. Through the formed insulating layer for forming the magnetic gap, the glass for bonding is integrally bonded. Then, with respect to the obtained joined body, the support substrate 40 is removed, the coil 48 is formed, the lead terminal 66,
Formation of 66, formation of protective film 68, etc. (see FIGS. 16 to 18)
After further performing the polishing of the gap depth length, the formation of the air bearing portion, and the leading ramp processing,
The desired magnetic head is obtained by cutting out such a bonded body with an appropriate width.

That is, in the magnetic head manufactured by the method of this embodiment, as shown in FIG.
Since the second core chip 84 as the second ferrite core, which forms a magnetic circuit in cooperation with the core chip 42 as the first ferrite core, is also formed with a thin structure, the first embodiment The low-inductance characteristic can be achieved more advantageously than that of the magnetic head manufactured by the method (1), and thereby the superior high-frequency characteristic can be exhibited.

Moreover, the second core chip 84 is also
Similar to the core chip 42, its thickness can be ensured sufficiently and easily as compared with the magnetic circuit in the thin film head, so that a significant increase in the magnetic resistance can be effectively avoided, and as a result, a sufficient increase can be achieved. The head efficiency can be obtained.

As described above, in addition to the representative examples of the magnetic head and the method of manufacturing the same according to the present invention, some modified examples thereof have been described in detail. The description is in no way intended to be limiting.

For example, the present invention is not limited to the magnetic head for an RDD or HDD equipped with a slider as illustrated, and
It is also applicable to magnetic heads for FDD and VTR. When applied to a magnetic head for a VTR, for example, the joined body as shown in FIGS. 15 and 16 obtained in the method of the first embodiment is cut into a predetermined width to support it. Including the substrate 40,
It is possible to configure the magnetic head.

Although not listed one by one, the present invention is
Based on the knowledge of those skilled in the art, the present invention can be carried out in a mode in which various alterations, modifications, improvements, etc., which are not described in the above-mentioned examples, are carried out, and such a mode is also applicable. It goes without saying that all of them are included in the scope of the present invention without departing from the spirit.

[0071]

As is apparent from the above description, in the thin film coil type magnetic head having the structure according to the present invention, a coil having a thin film structure is adopted and the first ferrite core provided with the coil is used. By forming it with a thickness of 10 to 100 μm, it was possible to advantageously achieve both low inductance characteristics and low magnetic resistance, which could not be realized with conventional bulk type or thin film type magnetic heads. While ensuring good head efficiency,
The improvement of the high frequency characteristics can be effectively achieved.

Further, in the thin film coil type magnetic head according to the present invention according to claim 2 in which a metal magnetic layer is provided on the surface opposite to the magnetic gap forming portion, the above-mentioned excellent high frequency characteristics and metal are provided. Due to the synergistic action with the effect of improving the magnetic flux density by the magnetic layer, the adaptability to the high density of the magnetic recording medium can be extremely advantageously exhibited.

Furthermore, in addition to the first ferrite core, the second ferrite core is also formed to have a thickness of 10 to 100 μm. As a result, an even better low inductance characteristic can be realized.

On the other hand, according to the manufacturing method of the present invention, since the ferrite substrate is reinforced by the supporting member, it is possible to effectively prevent breakage and breakage of the ferrite substrate during polishing, and the ferrite substrate is 10 to 100 μm. The desired first ferrite core having a thickness of 1 can be advantageously formed.

As the supporting member, a supporting member separate from the first and second ferrite cores and a member constituting the second ferrite core can be preferably used.

[Brief description of drawings]

FIG. 1 is a perspective view showing a thin film coil type magnetic head as one embodiment of the present invention.

FIG. 2 is an enlarged plan view showing a main part of the magnetic head shown in FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a perspective explanatory view showing an enlarged main part of the magnetic head shown in FIG. 1.

5 is an explanatory diagram for explaining formation of an insulating layer on a first ferrite substrate, which is one manufacturing process of the magnetic head shown in FIG. 1. FIG.

6 is an explanatory diagram for explaining formation of coil halves on an insulating layer in the first ferrite substrate shown in FIG.

FIG. 7 is an explanatory diagram for explaining formation of an insulating layer on the coil half body in the first ferrite substrate shown in FIG.

8 is an explanatory diagram for explaining joining of the support substrate to the first ferrite substrate shown in FIG. 7. FIG.

9 is an explanatory diagram for explaining a polishing process (formation of a core chip) on the first ferrite substrate shown in FIG.

10 is an explanatory diagram for explaining formation of an insulating layer on a core chip bonded to the supporting substrate shown in FIG.

11 is an explanatory diagram for explaining formation of coil halves on an insulating layer provided on the support substrate shown in FIG.

12 is an explanatory diagram for explaining formation of a metal magnetic layer on the core chip bonded to the supporting substrate shown in FIG.

FIG. 13 is an explanatory diagram for explaining grooving for the second ferrite substrate, which is one manufacturing process of the magnetic head shown in FIG. 1.

14 is an explanatory diagram for explaining formation of a metal magnetic layer on the second ferrite substrate shown in FIG.

15 is an explanatory diagram for explaining bonding of the support substrate shown in FIG. 12 to the second ferrite substrate shown in FIG. 14.

16 is an enlarged plan view showing a main part of the joined body shown in FIG. 15. FIG.

FIG. 17 is a support substrate 4 in the bonded body shown in FIG.
It is explanatory drawing for demonstrating removal of 0.

FIG. 18 is an explanatory diagram for explaining formation of a protective film on the core chip in the joined body shown in FIG. 17.

FIG. 19 is a perspective view showing a first ferrite substrate used in another embodiment of the method of the present invention.

20 is a perspective explanatory view showing a main part of a magnetic head formed using the ferrite substrate shown in FIG.

21 is a plan view of the magnetic head shown in FIG. 20. FIG.

FIG. 22 is a plan explanatory view showing a main part of a magnetic head formed in another embodiment of the method of the present invention.

FIG. 23 is an explanatory plan view showing a main part of a magnetic head formed in another embodiment of the method of the present invention.

FIG. 24 is a perspective explanatory view showing a holding block used in another embodiment of the method of the present invention.

FIG. 25 is a perspective explanatory view showing a second ferrite substrate separately formed from the holding block shown in FIG. 24.

FIG. 26 is an explanatory diagram for explaining bonding between the holding block shown in FIG. 24 and the second ferrite substrate shown in FIG. 25.

FIG. 27 is an explanatory diagram for explaining the polishing process (formation of core chip) for the second ferrite substrate shown in FIG. 26.

28 is an explanatory diagram for explaining grooving for the holding block shown in FIG. 27. FIG.

FIG. 29 is a plan view showing a main part of a magnetic head formed in another embodiment of the method of the present invention.

[Explanation of symbols]

 10 slider body 14,42 core chip 18,48 coil 26,64 magnetic gap 28,56,88 metal magnetic layer 32,70 first ferrite substrate 36,46 coil half 40 support substrate 52,78 second ferrite substrate 74 Holding block 84 Second core chip

Claims (6)

[Claims] 1. A magnetic circuit is formed by butting and joining a first ferrite core and a second ferrite core, and a magnetic gap having a predetermined gap is formed between the butting surfaces, and the first ferrite core and the second ferrite core are formed. In a magnetic head comprising a ferrite core and a coil, at least the first ferrite core is
A thin film coil type magnetic head characterized in that the coil is formed with a thickness of μm, and the coil is spirally formed of a conductive thin film around the first ferrite core via an insulating layer. 2. The thin-film coil type according to claim 1, wherein a metal magnetic layer is provided on at least one of the facing surfaces of the first ferrite core and the second ferrite core in the magnetic gap forming portion. Magnetic head. 3. The second ferrite core is 10 to 1
The thin film coil type magnetic head according to claim 1 or 2, wherein the thin film coil type magnetic head is formed to have a thickness of 00 μm and is embedded in a groove provided in a predetermined holding member via a non-magnetic layer. 4. The method of manufacturing a thin film coil type magnetic head according to claim 1, wherein a coil half body is formed on the surface of a predetermined supporting member with a conductive thin film, and the coil half body is formed. A step of fixing a ferrite substrate to the surface of the formed supporting member via an insulating layer, and the ferrite substrate having a thickness of 10 to 100 μm,
A step of forming the first ferrite core by polishing and shaping into a predetermined shape, and a conductive thin film on the surface of the support member on which the first ferrite core is formed via an insulating layer. Forming a coil half, and forming the coil by connecting the coil half to the coil half formed on the surface of the supporting member, and a method of manufacturing a thin-film coil magnetic head. 5. The thin-film coil magnetic head according to claim 4, wherein after the first ferrite core formed on the support member is bonded to the second ferrite core, the support member is removed. Production method. 6. The method of manufacturing a thin-film coil magnetic head according to claim 4, wherein the support member is formed of a member that constitutes the second ferrite core.