JPH05876B2 - - Google Patents

Info

Publication number
JPH05876B2
JPH05876B2 JP63320648A JP32064888A JPH05876B2 JP H05876 B2 JPH05876 B2 JP H05876B2 JP 63320648 A JP63320648 A JP 63320648A JP 32064888 A JP32064888 A JP 32064888A JP H05876 B2 JPH05876 B2 JP H05876B2
Authority
JP
Japan
Prior art keywords
copper plating
hole
plating film
forming
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63320648A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01302795A (ja
Inventor
Shusaku Izumi
Shigeru Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP32064888A priority Critical patent/JPH01302795A/ja
Publication of JPH01302795A publication Critical patent/JPH01302795A/ja
Publication of JPH05876B2 publication Critical patent/JPH05876B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP32064888A 1988-12-21 1988-12-21 プリント回路板の製造方法 Granted JPH01302795A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32064888A JPH01302795A (ja) 1988-12-21 1988-12-21 プリント回路板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32064888A JPH01302795A (ja) 1988-12-21 1988-12-21 プリント回路板の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP8484682A Division JPS58202589A (ja) 1982-05-21 1982-05-21 プリント回路板の製造方法

Publications (2)

Publication Number Publication Date
JPH01302795A JPH01302795A (ja) 1989-12-06
JPH05876B2 true JPH05876B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-01-06

Family

ID=18123758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32064888A Granted JPH01302795A (ja) 1988-12-21 1988-12-21 プリント回路板の製造方法

Country Status (1)

Country Link
JP (1) JPH01302795A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554956A (en) * 1978-06-28 1980-01-14 Oki Electric Ind Co Ltd Method of manufacturing printed circuit board
JPS5518072A (en) * 1978-07-26 1980-02-07 Chiyou Lsi Gijutsu Kenkyu Kumiai Mos semiconductor device
JPS5752196A (en) * 1980-09-16 1982-03-27 Hitachi Ltd Method of producing printed board
JPS58202589A (ja) * 1982-05-21 1983-11-25 株式会社日立製作所 プリント回路板の製造方法

Also Published As

Publication number Publication date
JPH01302795A (ja) 1989-12-06

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