JPH058679Y2 - - Google Patents

Info

Publication number
JPH058679Y2
JPH058679Y2 JP1988070584U JP7058488U JPH058679Y2 JP H058679 Y2 JPH058679 Y2 JP H058679Y2 JP 1988070584 U JP1988070584 U JP 1988070584U JP 7058488 U JP7058488 U JP 7058488U JP H058679 Y2 JPH058679 Y2 JP H058679Y2
Authority
JP
Japan
Prior art keywords
bonding
wire
ultrasonic
bonding tool
predetermined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988070584U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01173939U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988070584U priority Critical patent/JPH058679Y2/ja
Publication of JPH01173939U publication Critical patent/JPH01173939U/ja
Application granted granted Critical
Publication of JPH058679Y2 publication Critical patent/JPH058679Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—

Landscapes

  • Wire Bonding (AREA)
JP1988070584U 1988-05-28 1988-05-28 Expired - Lifetime JPH058679Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988070584U JPH058679Y2 (enExample) 1988-05-28 1988-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988070584U JPH058679Y2 (enExample) 1988-05-28 1988-05-28

Publications (2)

Publication Number Publication Date
JPH01173939U JPH01173939U (enExample) 1989-12-11
JPH058679Y2 true JPH058679Y2 (enExample) 1993-03-04

Family

ID=31295818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988070584U Expired - Lifetime JPH058679Y2 (enExample) 1988-05-28 1988-05-28

Country Status (1)

Country Link
JP (1) JPH058679Y2 (enExample)

Also Published As

Publication number Publication date
JPH01173939U (enExample) 1989-12-11

Similar Documents

Publication Publication Date Title
US20080265002A1 (en) Method of ultrasonic mounting and ultrasonic mounting apparatus using the same
WO2000013229A1 (en) Bump joining judging device and method, and semiconductor component production device and method
KR100855548B1 (ko) 감쇠 제어식 캐필러리
JPH058679Y2 (enExample)
JPWO2020067191A1 (ja) 超音波接合方法
JPH0574874A (ja) 金属細線の超音波接合方法および装置
US20060043149A1 (en) Method of bonding and bonding apparatus for a semiconductor chip
JP3528643B2 (ja) ワイヤボンディング装置
JP3313568B2 (ja) ワイヤボンディング装置およびその制御方法
JPH05347334A (ja) ボンディング装置
JPH08181175A (ja) ワイヤボンディング方法
JP2555120B2 (ja) ワイヤボンディング方法
JP2004165536A (ja) フリップチップ接合方法およびその装置
JPH1056034A (ja) ボンディング装置
JP4893814B2 (ja) 半導体チップの接合方法および接合装置
JP2001129469A (ja) ペースト塗布方法
JPS6122641A (ja) 超音波加工装置
JPH1140612A (ja) バンプ付電子部品のボンディング方法
JPH0521883Y2 (enExample)
CN121420694A (zh) 打线接合装置
JPS609664B2 (ja) 起音波ワイヤボンダ
JP4252700B2 (ja) ボンディングまたは半導体素子実装用の超音波ホーン
JPH0564462B2 (enExample)
JPS5858737A (ja) ワイヤボンデイング方法
JPS6298629A (ja) ワイヤボンデイング方法