JPH0584463U - Liquid level stabilizer for jet nozzle in soldering machine - Google Patents

Abstract

(57) [Abstract] [Purpose] A stationary portion is formed on the surface of the molten liquid at the jet port of the soldering device to stabilize the solder adhesion length to the electric wire and prevent scattering. [Composition] A molten solder spout opening upward is used, which is used in a soldering device for soldering the electric wire end by immersing the end of the electric wire in the spout and injecting it into the spout It is equipped with a cylindrical shielding member that is inserted from above,
The shield member has one end immersed in the molten solder and the other end positioned above the liquid surface of the molten solder. Has an opening with a small cross-sectional area.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a liquid level stabilizing device for stabilizing a solder liquid level of an immersion type soldering device in which an end of an electric wire is immersed in molten solder for soldering.

[0002]

[Prior Art]

 In general, a covered electric wire for connecting a printed circuit board, an electronic component or the like is used in which the end cover is peeled off in advance and then pre-soldered.

In the end treatment of this covered electric wire, the winding is cut into a certain size, the end covering is removed with a stripper, and the liquid flux is impregnated for soldering. It is processed by cutting, peeling and soldering equipment. In a soldering device mounted on such a processing device or continuously provided, in order to perform soldering at a constant hot water temperature, the molten solder is jetted (overflowed) from a jet port opened upward. There is known a so-called immersion type soldering device in which the end of the electric wire is dipped in the molten solder at the jet port, while circulating.

In the above-mentioned soldering apparatus, a heater for heating molten solder and a temperature adjusting means are generally provided in a solder bath, and a circulation pump or a liquid feeding screw is used along a flow path formed in the solder bath. The molten solder is circulated. A jet port is provided at the upper end of the flow path to make the solder jet flow (overflow), and soldering is performed at this jet port so that soldering can be performed at a predetermined liquid temperature. In addition to making it possible, the position of the liquid surface is stabilized (see JP-A-54-107454 and JP-B-1-34316).

[0005]

[Problems to be solved by the device]

 By the way, in the above-mentioned so-called immersion type soldering device, since the molten solder is overflowed at the jet port, there is no extreme displacement of the liquid surface at this jet port, but liquid is sent by a circulation pump or the like. As a result, the liquid surface constantly fluctuates and becomes unstable. Therefore, there is a problem that the solder adhesion length varies even if the end of the wire from which the coating has been peeled is dipped for a predetermined length set using an automatic machine.

Further, when the end of an electric wire impregnated with flux is immersed in the jet port, a part of flux that flows out into the solder and boils and scatters is entrained, and the solder scatters out of the system to spread around the equipment. In some cases, it adhered to the wire and also to the wire side. This became more noticeable as the electric wire immersion time was shortened, which was an obstacle to improving production efficiency.

The present invention has been made in view of the above circumstances, and stabilizes the liquid surface of the molten solder at the jet port of the soldering device to always perform soldering with a fixed length at the end of the wire. The purpose of the invention is to provide a liquid level stabilization device for the jet nozzle that can prevent the solder from scattering during immersion.

[0008]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, a liquid level stabilizer for a jet port in a solder device of the present invention has a jet port for molten solder that is opened upward, and the end of the electric wire A liquid level stabilizing device used in a soldering device for soldering to the end of an electric wire, which is provided with a cylindrical shielding member that is inserted into the jet port from above, and the shielding member has one end portion. It is immersed in the molten solder, and the other end is located above the liquid surface of the molten solder, and an opening having a cross-sectional area smaller than the body is formed at the other end. It is characterized by being formed.

Further, in order to further stabilize the liquid surface, it is preferable that the shielding member is made of a material having good intimacy with solder.

[0010]

[Action]

 A liquid level stabilizer of the present invention attached to a jet port of a soldering device comprises a cylindrical shielding member which is inserted into the jet port from above, and one end of the shielding member is the melting solder. Since it is immersed in the inside, the molten solder that has entered the cylindrical shielding member through the opening at its one end forms a new liquid level in the cylinder. At that time, since the other end is arranged above the liquid surface of the solder at the jet port, the solder in the cylinder overflows from the tubular body regardless of the flow state of the molten solder at the jet port. It will be relatively stationary without any action. Therefore, when the end of the wire is inserted into this shielding member and soldering is performed, the solder is always attached to the wire only by the immersion.

Further, at this time, even if the flux impregnated at the end of the wire is eluted, the opening at the other end of the shielding member, which is the insertion port of the wire, has a smaller cross-sectional area than the trunk, The scattered solder collides with the inner wall side of the shielding member and does not fly out of the shielding member, so that the solder is prevented from scattering.

Further, when the shielding member is formed of a material having good intimacy with the solder, the solder formed in the shielding member is adhered to the inner wall of the cylindrical shielding member. Since the liquid surface is supported, the fluctuation of the liquid surface is further suppressed.

[0013]

【Example】

 An embodiment of the present invention will be described with reference to the drawings.

A liquid level stabilizing device for a jet nozzle in a soldering device according to the present invention (hereinafter simply referred to as a liquid level stabilizing device) is denoted by reference numerals in FIG. 2 showing a side face of the soldering device and FIG. 3 showing a front face thereof. 1 is shown.

First, a soldering device provided with the liquid level stabilizing device 1 will be described by way of example with reference to FIGS. 2 and 3. The soldering device H1 shown in these drawings is the inside of the device body 11 which constitutes the outer tank. A box-shaped solder bath 12 is provided separately from the main body 11 for heat insulation, and a flow tube 13 forming a circulation path for the molten solder S is further suspended inside the solder bath 12. Then, a heater 16 for melting and heating the solder and a temperature sensor 17 are inserted into the solder bath 12, and the temperature in the solder bath 12 is normally 250 ° C. or higher by a temperature controller (not shown). The temperature is kept constant within the range of 300 ° C.

Further, the flow tube 13 is formed in a box body, the suction port 13b for the molten solder S is provided on one end side of the bottom surface, and the other end side of the upper surface is slightly raised upward, and The jet port 13c of the molten solder S opened upward is provided, and the molten solder S introduced from the suction port 13b in the lower layer portion of the solder bath 12 is passed through the flow path 13d to the jet port 13c. It is designed to jet from.

In order to forcibly circulate the molten solder S using the flow tube 13, a rotary blade 14 attached to a lower end of a vertical drive shaft 15 c is opened from a hole 13 a opened at one end of the upper surface of the flow tube 13. Has been inserted. The drive shaft 15c is driven by the geared motor 15 directly connected to the drive shaft 15c. In general, such a soldering device H1 is covered with a cover 18 from above in consideration of safety and heat retention, but an opening 19 is provided on the insertion side of the electric wire, and the jet port 1 of the flow tube 13 is provided. The upper part of 3c is open. Then, from the right side of FIG. 2, the electric wire C1 from which the coating of the end has been peeled off and which is impregnated with the flux is inserted from this jet port 13c, and is immersed in the molten solder S.

The liquid level stabilizing device 1 of the present invention is attached to the jet port 13c of such a soldering device H1 and its outer shape is shown in FIG. The cylindrical body is inserted from above the jet port 13c with the central axis of the tubular body oriented in the vertical direction. In this case, in this embodiment, one end of the support plate 5 fixed horizontally to the flat portion of the outer wall of the shielding member 3 is fixed to the mounting body 11 side of the soldering device H1 as shown in FIG. When viewed in a plan view, the long axis of the ellipse is arranged along the insertion direction of the electric wire C1. If the horizontal cross section of the shielding member 3 is formed in the oval shape as described above, the electric wire C1 supported in the horizontal direction can be easily inserted into the liquid level stabilizing device 1 while rotating in the vertical direction. ..

Then, in order to form the liquid surface L3 of the molten solder S for immersing the electric wire C1 in the cylinder of the shielding member 3, the lower end portion 4 which is one end portion of the shielding member 3 has the jet liquid surface L. It is arranged below 1 and is immersed in the molten solder. On the other hand, the other end of the shielding member 3, in this case, the upper end 2 is arranged above the jet liquid level L1 of the jet port 13c.

It should be noted that the jet liquid level L1 of the molten solder S shown in FIG. 1 is the jet port 13c at the time of jetting (overflowing) from the jet port 13c formed when the soldering device H1 is operated. It is the liquid surface. That is, initially, when the soldering device H1 is stopped, only the jet port 13c raised upward in the solder bath 12 is projected above the liquid surface so that the flow tube 13 is substantially submerged in the solder liquid. With respect to the liquid level L2 of the molten solder S set to be in the above state, the liquid level L1 during the operation of the soldering device H1 is such that the molten solder S is moved upward by the liquid feeding of the rotary blade 14 at the jet port 13c. It is always formed at a predetermined position when it is pushed up and overflows.

Further, when the solder device H1 is operated, the liquid level L3 of the molten solder S flowing from the opening 4a of the lower end portion 4 of the liquid level stabilizer 1 attached to the jet port 13c into the shielding member 3 is Due to the jet pressure and the surface tension of the solder, it is slightly above the jet liquid level L1 described above. In this case, the position of the upper end portion 2 of the shielding member 3 arranged above the jet liquid level L1 is such that the molten solder S in the shielding member 3 does not overflow from the opening 2a of the upper end portion 2. Adjusted to height.

Further, in order to prevent the solder from scattering during soldering, the other end portion of the shielding member 3, that is, the opening 2a of the upper end portion 2 has an opening area smaller than that of the body portion of the shielding member 3. Has been reduced. That is, as shown in FIG. 1, the peripheral edge of the upper end portion 2 is curved inward.

Further, in the liquid level stabilizing device 1 of the present invention, in order to further stabilize the liquid level L3, the shielding member 3 is made of Cu-based alloy, Fe-based alloy, Ni-based alloy such as permalloy, etc. Preferably, it is formed of a material having good intimacy with the solder.

According to the liquid level stabilizing device 1 configured as described above, as shown in FIG. 2, the electric wire C1 whose end coating is peeled off is, for example, a processing device that performs dimension cutting, end peeling, and flux impregnation. The liquid level stabilizer 1 supported by a grip portion B1 (not shown) and attached to the jet port 13c of the flow tube 13 of the solder device H1 is inserted from above and soldered.

The shield member 3 of the liquid level stabilizer 1 is formed in a cylindrical shape with its central axis oriented in the vertical direction, and its lower end portion 4 is arranged below the jet liquid surface L1 of the jet port 13c. And is immersed in the molten solder S. Then, the molten solder S that has entered the inside of the shielding member 3 through the opening 4a of the lower end portion 4 forms a new liquid level L3 in the cylinder due to the jet pressure and the surface tension. At that time, since the upper end 2 of the shielding member 3 is arranged above the jet liquid level L1 of the jet port 13c, regardless of the flow state of the molten solder S at the jet port 13c, the overflow from the opening 2a. Without doing so, the liquid level L3 in the cylinder is relatively stationary. Even if the molten solder S overflowing from the jet port 13c is partially surrounded by the shielding member 3, the capacity of the solder contained in the shielding member 3 and the heat capacity of the shielding member 3 itself are extremely large. Since the solder is small, the molten state of the solder in the shielding member 3 is maintained at a constant temperature.

Further, when the shielding member 3 is formed of a material having good intimacy with the solder, the liquid surface L3 formed in the shielding member 3 adheres to the inner wall of the cylinder so as to rise. It is supported by the adhesive force of the paddy field, resulting in a more stabilized liquid surface. Therefore, when the end of the electric wire C1 is inserted into this cylindrical body, the solder is always attached to the electric wire C1 to the depth of being immersed below the liquid level L3.

Further, at this time, even if the flux impregnated at the end of the electric wire C1 is leached onto the molten solder S, the opening 2a in the upper end portion 2 of the shielding member 3 which is the insertion port of the electric wire C1 has a sectional area Since the solder is reduced, the scattered solder does not fly out of the shielding member 3 and collides with the inner wall of the cylindrical body to prevent the solder from scattering.

As described above, according to the liquid level stabilizing device 1 of the present invention, the shielding member 3 is formed into a cylindrical body whose central axis is oriented in the vertical direction, and the upper end portion 2 of the shielding member 3 is the jet flow of the soldering device H1. Since it is arranged above the jet liquid level L1 at the mouth 13c, and the lower end portion 4 is arranged below the jet liquid level L1, it is possible to prevent the jet liquid level L1 from swinging at the jet port 13c. In spite of this, it is possible to form a stationary liquid level L3 in the cylinder of the shielding member 3, and it is possible to always carry out soldering to a fixed length at the end of the electric wire C 1 with an accurate dimension without variation. ..

Furthermore, since the shielding member 3 is formed of a material having good intimacy with the molten solder S, the shielding member 3 is formed in the tower by the adhesive force of the solder that adheres to the inner wall of the cylinder. The effect of making the liquid surface L3 more stable and stationary is remarkable.

Further, since the opening area of the upper end portion 2 of the shielding member 3 is reduced, the shielding member 3 prevents the solder that is entrained and scattered in the flux when the end end of the electric wire C1 is immersed in the molten solder S. It is possible to prevent the electric wire C1 from jumping outward from the device, and to prevent it from adhering around the device or to the electric wire C1. Therefore, the yield of the electric wire C1 as a product can be improved and the soldering device H1 is not polluted. Therefore, the labor of cleaning work can be reduced.

Surprisingly, according to the liquid level stabilizing device 1 of the present invention, the new liquid level L2 formed in the shielding member 3 is surrounded by the tubular body and is jetted at the jet port 13c. Since it is separated from the liquid surface L1, the flux eluted from the electric wire C1 does not adhere to the inner circumference of the shielding member 3 and does not diffuse together with the molten solder S circulating in the solder device H1. S can always be kept in a clean state. This is because in the conventional soldering device, an oxide film of the flux is formed on the liquid surface near the jet port due to the eluted flux, and lead oxide and the like are often generated and adhered in the circulation route of the molten solder. Compared with the fact that such oxides had to be removed due to the effect on the electric wire, the present invention enables high-quality soldering of the electric wire C1 end and also requires the labor required for the cleaning work. Can also be reduced.

In the above embodiment, the shielding member 3 formed on the cylindrical body of the liquid level stabilizer 1 has an oval bottom surface shape, but the bottom surface shape is not limited to this. Instead of being a thing, it can be formed in a desired shape such as a circle or a square.

[0033]

[Effect of the device]

 As described above, according to the present invention, the central axis is formed in the vertical direction, and the upper end of the cylindrical body is arranged above the jet liquid surface at the jet port of the soldering device and the lower end. Since the part is located below the jet liquid surface, a stationary liquid surface can be formed in the cylinder regardless of fluctuations in the jet liquid surface at the jet outlet, and there is no variation at the end of the wire. In addition to making it possible to perform soldering with accurate dimensions, the opening at the top end is also reduced, preventing solder from scattering when the wire end is immersed in molten solder, and Adhesion can be prevented, and the yield of electric wires as a product can be improved.

Further, when the shielding member is made of a material having good intimacy with the molten solder, the shielding solder is formed in the shielding member by the adhesive force of the molten solder that is attached so as to rise up on the inner wall of the cylinder. The effect of stabilizing the liquid surface to be stabilized and making it stand still becomes remarkable.

Further, according to the present invention, since the new liquid surface formed inside the tubular body is isolated from the jet liquid surface at the jet port of the solder device, the new liquid surface is formed together with the molten solder circulating in the solder device. It also has an excellent effect that the molten solder can be always kept in a clean state without being diffused.

[Brief description of drawings]

FIG. 1 is a perspective view of a liquid level stabilizer having an oblong cross section, which is an embodiment of the present invention.

FIG. 2 is a side view showing an embodiment of a liquid level stabilizing device of the present invention attached to a soldering device.

FIG. 3 is a front view showing an embodiment of a liquid level stabilizing device of the present invention attached to a soldering device.

[Explanation of symbols]

 1 Liquid Level Stabilizer 2 Other End (Upper End) 3 Main Body 4 One End (Lower End) 2a, 4a Opening 12 Solder Tank 13 Flow Tube 13c Jet Port C1 Electric Wire L1 Jet Liquid Level L2, L3 Liquid Level H1 Soldering Device S Molten solder

Claims (2)

[Scope of utility model registration request] 1. A liquid level stabilizer for use in a soldering device, which has a jet port of molten solder that is opened upward, and in which the end of an electric wire is immersed in the jet port to perform soldering to the end of the electric wire. There is provided a cylindrical shielding member which is inserted into the jet port from above, and the shielding member has one end immersed in the molten solder and the other end having a liquid surface of the molten solder. It is located above the
An opening having a cross-sectional area smaller than that of the body portion is formed at the other end portion. 2. The liquid level stabilizing device for a jet nozzle in a soldering device according to claim 1, wherein the shielding member is made of a material having good intimacy with solder.