JPS6051941B2 - Jet solder bath - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a jet solder bath used for soldering leadless components (chip components) and the like.

Conventionally, there is a device that attaches electronic components with lead wires to a printed wiring board and performs a continuous soldering process. On the other hand, when performing a soldering process, the conventional jet-type soldering bath does not provide satisfactory soldering characteristics.

The reason for this is that while the soldered parts of conventional electronic components are long and thin lead wires, leadless components have a prismatic or cylindrical shape and have a large heat capacity, and the leadless components themselves can be soldered directly to the soldering surface. Conventional jet solder baths require complex solder jet waveforms and pressure from all directions when working with densely packed leadless components. The fact that solder flows in only two directions, which are split into forward and backward directions after being ejected, is a cause of poor soldering.

The present invention aims to improve these points, and aims to make it possible to reliably solder leadless parts. Therefore, the present invention aims to improve the above-mentioned points by making it possible to reliably solder leadless parts. A plurality of nozzles for jetting the pressure-fed molten solder are arranged upright, and a spiral rectifying plate is provided inside the plurality of nozzles. Hereinafter, the present invention will be explained based on embodiments shown in the drawings.

As shown in FIG. 1, the inside of the tank body 1 is partitioned by a horizontal partition plate 2, and a pump means is provided on one side of the partition plate 2.

3 is a heater.

The pump means includes a hole 5 bored in the partition plate 2, a pump blade 6 disposed below the hole 5, and a rotating shaft 7 of the pump blade 6 supported by a support or holding means (not shown). An external motor 9 is connected to this rotating shaft 7 via a rotation transmitting means 8.

Further, a rectangular hole 11 is bored in the partition plate 2, and a plurality of cylindrical nozzles 12 are installed vertically in the hole 11.

As shown in FIGS. 2 and 3, each nozzle 12 has its upper and lower ends supported by an upper plate part 13 and a lower plate part 14, and the upper plate part 13 has a curved plate part on one side. 15 is provided continuously, and a recess 16 is provided on the other side, and this recess 1
A vertical movement adjustment plate 17 is provided on the opposite side of the nozzle 6, and reinforcing plate parts 18 and 19, which correspond to conventional nozzles, are provided between the upper plate part 13 and the lower plate part 14, and A side plate 20 is provided.

Incidentally, round holes are formed in the upper side plate part 13 and the lower side plate part 14 in the portions corresponding to the upper end opening 21 and the lower end opening 22 of the nozzle 12. Further, a spiral current plate 24 is provided inside each nozzle 12, and a core member 25 is provided at the center of the spiral current plate 24.

The baffle plate 24 is provided from the lower end opening 22 to the upper end opening 21 of the nozzle 12, and its outer peripheral surface is fixed to the inner peripheral surface of the nozzle 12. 27 is the solder side of molten solder.

As shown in FIG. 1, each nozzle 12 is arranged in the direction of distance with respect to the pump blade 6, so by providing a sub-pressure device or a valve device below each nozzle 12, each The amount of ejection from the nozzle 12 may be made uniform.

Next, the action will be explained.

When the pump blade 6 is rotated by the motor 9, the molten solder circulates as shown by the arrows in FIG.

During this upward movement, the molten solder is given a spiral vector by the spiral current plate 24 in the nozzle 12, and
The water jets out from the upper end opening 21 of. On the upper surface of the nozzle 12 (printed wiring board passage surface), the jetted molten solder takes on a spiral shape, and at the same time forms a spiral on the side of the curved plate portion 15 and the concave portion 16.
flows out to the side.

At this time, if the flow rate toward the curved plate portion 15 is to be increased, the vertical adjustment plate 17 of the recessed portion 16 is adjusted upward. When the printed wiring board 32, which has the leadless component 31 bonded to the bottom surface thereof, is advanced at an upward inclination angle α against such a jet wave front, the leadless component 31 will be exposed to the plurality of nozzles 12.
Due to the swirling solder flow jetted from the leadless component 31, the solder pressure can be applied from all angles, and the molten solder penetrates into the fine details between the leadless components 31, resulting in good soldering. .

That is, as shown in FIG. 4, the leadless component 31 passing above the nozzle 12 separates from the spiral solder flow 34 at the upper end opening 21 of the nozzle 12 on the A side to the curved plate portion 15. Receive the flowing solder flow 35,
Further, when it moves to the B side, it receives the spiral solder flow 36 and the solder flow 37 that is split at the upper end opening 21 of the nozzle 12 and flows out into the recess 16 .

In this way, the leadless component 31 receives solder pressure from each angle of the front, rear, left, right, and bottom surfaces. As described above, according to the present invention, since the spiral current plate is provided inside the plurality of nozzles, a spiral flow is imparted to the molten solder jetted from the nozzles, and this spiral flow of solder can be applied to leadless components. Soldering pressure can be applied from all angles, allowing molten solder to penetrate into the finer details between leadless parts and ensuring that all necessary parts of leadless parts are soldered.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing an embodiment of the jet-flow soldering bath of the present invention, Fig. 2 is a sectional view taken along the line ■-■ in Fig. 1, Fig. 3 is a perspective view of the nozzle portion thereof, and Fig. 4 is FIG. 3 is an explanatory diagram of a solder flow jetted from a nozzle. 1... Tank body, 6... Pump blade, 1
2... Nozzle, 24... Spiral rectifier plate.

Claims (1)

[Scope of Claims] 1. A plurality of nozzles for jetting molten solder pumped by a pump means are vertically provided inside the tank body, and a spiral rectifying plate is provided inside the plurality of nozzles. A jet soldering bath characterized by: 2. The jet solder bath according to claim 1, wherein the nozzle is formed in a cylindrical shape.