JPH0582491A - Wafer peeling device - Google Patents

Abstract

PURPOSE:To make it possible to peel off a wafer from a wafer mounting jig without making a force act directly on the wafer by a method wherein the jig adhered with the wafer is arranged in a solvent and a bonding material for adhering the wafer to the-jig is dissolved into the solvent. CONSTITUTION:A wafer mounting jig 6 adhered with a thin wafer 1 is held by a holder 9 and the jig 6 is made to dip in a solvent 8 until it is completely dipped in the solvent 8. When the jig 6 is left to stand for a desired time in this state, the solvent 8 passes through holes from the back of the jig 6 to reach a wax 2 on the surface of the jig 6 and this wax 2 is dissolved into the solvent. When the wax 2 is dissolved to some degree, the adhesive force of the wafer 1 to the jig 6 is eliminated and the wafer 1 is peeled off from the jig 6 by the gravity of the wafer 1 and is caught by a bottom 9a of the holder 9. In such a way, the wafer can be peeled off from the jig without making a force act directly on the water from the outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer peeling device for peeling a wafer thinned by polishing or the like from a jig.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view showing an apparatus for peeling a thin wafer attached to a polishing jig with a conventional wax, in which 1 is a thin wafer and 2 is a thin wafer.
Is a wax, 3 is a polishing jig, 4 is a hot plate, and 5 is a wafer pushing jig.

Next, the operation will be described. The polishing jig 3 having the thin wafer 1 adhered to one flat surface with the wax 2 is placed on the upper surface of the hot plate 4 so that the thin wafer 1 is the upper surface. Next, the hot plate 4 is heated to a temperature at which the wax 2 melts. Then wax 2
After melting, the wafer pushing jig 5 is pressed against the side surface of the thin wafer 1 and a force parallel to the flat surface of the polishing jig 3 is applied to push the thin wafer 1 out of the flat surface of the polishing jig 3. , The thin wafer 1 is peeled off from the polishing jig.

[0004]

Since the conventional wafer peeling apparatus is constructed as described above, since the pushing jig 5 is pressed against the thin wafer 1 and a force is directly applied to the thin wafer 1, There is a problem that the wafer is broken during the work.

Further, when the wafer is pushed out from the flat surface of the polishing jig 3, the pushing jig 5 comes off the side surface of the thin wafer 1 and hits the surface of the thin wafer 1 to damage the wafer surface.

The present invention has been made to solve the above problems, and provides a wafer peeling device capable of peeling a wafer from a mounting jig without directly applying a force to the wafer. The purpose is to

[0007]

In the wafer peeling apparatus according to the present invention, a jig to which a wafer is attached is placed in a solvent, and an adhesive substance for attaching the wafer and the jig can be dissolved in the solvent. It was done like this.

[0008]

In the wafer peeling apparatus according to the present invention, the solvent penetrates into the adhesive substance interposed between the wafer and the jig through the through hole from the back surface of the jig to which the wafer is attached. It can be melted and the jig and the wafer can be separated.

[0009]

FIG. 1 is a schematic view showing a usage state of a wafer peeling apparatus according to an embodiment of the present invention, showing a state in which a wafer mounting jig with a wafer attached is immersed in a solvent in a solvent tank. ing.

In the figure, reference numeral 1 is a thin wafer, and the thin wafer 1 is attached to a plate-shaped wafer mounting jig 6 having a plurality of through holes penetrating the back surface and the front surface through a wax 2. The wafer mounting jig 6 is held by a holder 9 and is immersed in the organic solvent 8 contained in the solvent tank 7. The holder 9 for holding the wafer mounting jig is composed of a frame body that supports the wafer mounting jig 6 so that the organic solvent 8 can enter the through holes from the back surface of the wafer mounting jig 9. An area 9a for receiving the thin wafer 1 is formed at the bottom so that the thin wafer 1 peeled off from the attachment jig 9 does not fall into the solvent bath 7.

Next, the process of peeling the thin wafer 1 attached to the wafer mounting jig 9 from the wafer mounting jig 9 will be described with reference to FIG.

2A and 2B show a wafer mounting jig 6 in which a thin wafer 1 is stuck in a solvent 8 contained in a solvent tank 7.
6A and 6B are views showing a state where the wafer 1 is held in a holder 9 to be infiltrated therein, respectively, showing a state before the thin wafer 1 is peeled from the wafer mounting jig 6 and a state after the thin wafer 1 is peeled off.

First, the wafer mounting jig 6 to which the thin wafer 1 is attached is held by the holder 9, and is immersed until the wafer mounting jig 6 is completely immersed in the solvent 8 as shown in FIG. 2 (a).

Then, when the wafer 8 is left in this state for a desired time, the solvent 8 reaches the wax 2 on the surface of the wafer mounting jig 6 from the back of the wafer mounting jig 9 through the through hole, and the wax 2 is dissolved.

When the wax 2 is dissolved to some extent, the adhesive force between the thin wafer 1 and the wafer mounting jig 6 is lost, and as shown in FIG. It is peeled off from the tool 6 and received by the bottom surface 9 a of the holder 9. At this time,
The frame of the holder 9 that supports the wafer mounting jig 6 is at an inclined angle, and the thin wafer 1 that has been peeled off is received by the holder 9 without falling forward.

In such a wafer peeling apparatus of this embodiment, the solvent 8 is transferred from the back surface of the wafer mounting jig 6 having a plurality of through holes to the front surface through the through holes, and the wafer mounting jig 6 and the thin wafer 1 Since the wax that adheres to and is melted, the thin wafer 1 can be peeled from the wafer mounting jig 6 by the gravity of the thin wafer 1 without exerting an unnecessary force on the thin wafer 1 from the outside, and peeling can be performed. Since the thin wafer 1 is received in the liquid by the holder 9, the wafer is not cracked or the surface of the wafer is not scratched.

As the solvent, it is possible to selectively use a solvent that dissolves the substance for adhering the wafer mounting jig 6 and the thin wafer 1 to each other.

Further, it goes without saying that the shapes of the wafer mounting jig and the holder are not limited to those in the above embodiment, and can be changed to desired shapes.

[0019]

As described above, according to the present invention, the jig to which the wafer is attached is placed in the solvent, and the adhesive substance for attaching the wafer and the jig is dissolved in the solvent. Therefore, the wafer can be peeled off from the jig without directly exerting a force on the wafer from the outside, and the wafer is not cracked or the surface of the wafer is not scratched, so that a high yield can be obtained. .

[Brief description of drawings]

FIG. 1 is a schematic view showing a usage state of a wafer peeling device according to an embodiment of the present invention.

FIG. 2 is a view showing a state of the wafer peeling apparatus shown in FIG. 1 before and after being peeled off from the jig.

FIG. 3 is a perspective view schematically showing a conventional wafer peeling device.

[Explanation of symbols]

 1 Thin Wafer 2 Wax 3 Polishing Jig 4 Hot Plate 5 Wafer Pushing Jig 6 Perforating Polishing Jig 7 Tank 8 Organic Solvent 9 Holder 9a Bottom of Holder

Claims (1)

[Claims] 1. A wafer peeling apparatus for peeling a wafer fixed to a jig by a desired substance from the jig, wherein the wafer peeling apparatus has a plurality of through holes penetrating a front surface and a back surface, and a flat surface of the surface. A plate-shaped wafer mounting jig on which a wafer is attached and fixed via a desired substance; jig holding means for holding the wafer mounting jig so that a solvent described later can enter the through hole; A wafer peeling device, characterized in that a solvent for dissolving the desired substance is housed therein, and a wafer mounting jig held by the holding means is provided with a solvent tank having a structure capable of being completely immersed in the solvent.