JP3500934B2 - Wafer peeling device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for peeling a wafer from a plurality of wafer rows bonded on a fixing member with a lot for each lot.

[0002]

2. Description of the Related Art Conventionally, when manufacturing wafers of semiconductor materials, magnetic materials, ceramics, etc., these materials are adhered to a fixing member in an ingot state, and then a wire saw is used to make a vertical direction. Slicing in various directions is performed as a wafer row.

On the fixing member, an ingot cut out from a single crystal produced by a single crystal pulling apparatus to a length of about 300 mm is adhered with an adhesive agent, and a wafer obtained from the ingot Are stored in separate cassettes for each lot for reasons such as quality control.

Since the slicing with the wire saw is performed to a depth reaching a part of the fixing member after the ingot is completely cut, the wafer rows after slicing are each bonded to the fixing member with an adhesive. It is in a bonded state.

[0005]

By the way, when a plurality of ingots are cut out from the above-mentioned single crystal body, a scrap material is left over.
Also with respect to the scraps, if a plurality of the scraps are bonded (multi-mounted) on the fixing member and then the slicing work and the wafer peeling work described above are performed, waste can be eliminated and the yield can be improved.

[0006] However, since the multi-mounting fixing member is made by adhering end pieces of different lots in a mixed manner, it is necessary to store the wafers obtained from the end pieces in different cassettes for each lot. It is necessary to detect the switching of lots and replace the storage cassette based on the detection result.

The present invention has been made in view of the above circumstances, and a wafer peeling apparatus capable of automatically detecting a lot changeover with a simple structure and reliably preventing different lots from being mixed in the same cassette. The purpose is to provide.

[0008]

The present invention has the following features to attain the object mentioned above. Wafer stripping according to claim 1 is an apparatus for stripping wafers from a plurality of wafer rows adhered to each other on a fixing member with a gap for each lot, and immersing a bonding portion between the fixing member and each wafer row. A softening tank for weakening the adhesive strength by doing, a wafer suction plate for sucking the wafer located at the end of the wafer row arranged in the softening tank, and driving the wafer suction plate to suck the wafer Driving means for peeling the wafer from the fixing member, second driving means for driving the wafer suction plate along the arrangement direction of each wafer row, and detecting the gap and performing another process after peeling. The cassette storage means for storing the processed wafers in the different cassettes for each lot, and the gap detection means for notifying the changeover of the lot are provided , and the gap detection means
Corresponding to the position of the wafer by the second driving means.
On the side wall of the softening tank along the moving direction of the suction cup, the wafer
-Gap indicator provided without touching the row
By the second drive means together with the wafer suction plate
When moving along the side wall and approaching the gap indicating member,
And an indicator member detecting section for detecting the gap indicator member.
It is characterized in that that.

According to this structure, first, by immersing the bonding portion between the fixing member and each wafer row in the softening tank, the bonding strength is weakened to such an extent that the wafer can be peeled off.

Next, the second driving means is driven to bring the wafer suction plate closer to the wafer located at the end of the wafer row arranged in the softening tank, and the wafer suction plate sucks the wafer. .

Next, the first driving means is driven to peel the wafer from the fixing member. The wafers thus peeled off are cleaned by, for example, a wafer cleaning device, and then stored in separate cassettes for each lot by the cassette storage means.

When the above steps are repeated, the wafer suction plate is sequentially moved in the array direction of the wafer rows by the second driving means each time the wafer is completely peeled off.

When the gap detecting means detects the gap between the wafer rows, it notifies the cassette accommodating means as a lot switching, and all the wafers moving between the wafer peeling device and the cassette are accommodated in the cassette. After that, the cassette in the storage is replaced with an empty cassette.

[0014]

Further, after the bonding portion between the fixing member and each wafer row is immersed in the softening tank, the gap indicating member is moved in the moving direction of the second drive means in correspondence with the position of the gap between the wafer rows. It is provided in advance so as to project from the side wall of the softening tank along the line.

Then, in the same manner as described above, the wafer suction plate moves along the arrangement direction of the wafer rows, that is, along the side wall of the softening tank by the second driving means while separating the wafer from the fixing member. When the indicating member detection unit that moves together with the wafer suction plate passes below the gap indicating member, the gap indicating member, that is, the gap between the wafer rows is detected.

As described above, since the indicating member detecting portion is configured so as to pass below the gap indicating member arranged in a protruding state from the side wall of the softening tank, its movement is not hindered. Therefore, it is not necessary to retract the gap indicating member from the movement axis of the indicating member detecting portion.

The wafer peeling apparatus according to claim 2 Symbol mounting is fixed
Multiple wafers that are bonded to each other with a gap for each lot
A device for peeling wafers from the wafer
By immersing the bonding part between the member and each wafer row
A softening tank for weakening the adhesive strength, and the above-mentioned placed in the softening tank
Wafers that attract the wafers located at the end of the wafer row
-Ha suction plate and the wafer suction plate are driven to suck
First driving means for separating the wafer from the fixing member
And the wafers along the arrangement direction of the wafer rows.
C Second drive means for driving the suction plate and detection of the gap
In addition to the above
Cassette storage means that stores in different cassettes for each lot
In addition, it is equipped with gap detection means to notify lot switching.
The gap detecting means detects the suction state of the wafer by a suction detecting portion, and the second driving means causes the wafer suction plate to start advancing, and based on an interval from when the wafer is sucked, A gap detection unit for detecting a gap is provided.

In such a configuration, the last wafer in the wafer row is peeled off, and then a different lot is placed with a predetermined gap, as compared with the case where the wafers are sequentially peeled from the wafer row in the same lot. In the case of separating the wafer from the wafer row, the forward movement distance and the movement time of the wafer suction plate by the second drive means become longer, so that the gap can be detected based on the movement distance or the movement time. .

In particular, when the forward movement of the wafer suction plate by the second driving means is not set at a predetermined movement pitch but is controlled based on the wafer suction state by the suction detector, Even if the wafer located at the end in the softening tank is tilted and its upper end is in close contact with the upper ends of the adjacent wafers, the tilted wafer can be surely adsorbed.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of a wafer peeling apparatus according to the present invention will be described below with reference to FIGS. In the present embodiment, the workpieces to be separated are the wafer rows W1, W2, ... On the fixing member 1, as shown in FIG.

The fixing member 1 is composed of carbon 2, glass 3, and an iron base 4, and in each wafer row W, a plurality of ingots of the ingot are bonded on the fixing member 1 with a gap therebetween. After that, it is sliced in a direction perpendicular to the length direction by a wire saw.

Here, the slicing with the wire saw is performed to the depth of the carbon 2, and the wafers are completely separated from each other, but they are individually juxtaposed on the fixing member 1 in a state of being adhered. ing.

The wafer stripping apparatus 10 is provided with a wafer array W1, W2, which has been cleaned by a cleaning device (not shown).
This is for peeling the wafers one by one from the end portion of ..., and the peeling of each wafer is automated.

This wafer peeling apparatus 10 is shown in FIGS.
, A softening tank 11, a wafer suction plate 12, a suction plate rotary actuator (first moving means) 13,
Presser member 14, rotary actuator 1 for presser member
5, slide table 16, slide motor 17 (second
Drive means), ball screw 17a, table body 17
b, a dog 18 (gap indicating member), and a detector 19 (indicator detecting unit) are provided.

The softening tank 11 is for softening the adhesive agent that bonds each wafer row W to the fixing member 1, and is for fixing the heater 11 a and the fixing member 1 in the softening tank 11. And a frame 11b.

The heater 11a is for heating and maintaining the hot water stored in the softening tank 11 at a predetermined temperature. In the present embodiment, the temperature of the hot water is based on the fact that the adhesive is an epoxy adhesive. Is about 9 under the control of thermometer 11c
Set to 0 ° C.

The softening tank 11 is, as shown in FIG.
It has a two-tank structure including an inner tank portion 11A and an outer tank portion 11B. A water supply source (not shown) is provided at a corner of the inner tank portion 11A.
Water supply pipe 11d for guiding the water constantly supplied from the bottom
The hot water overflowing from the stepped portion 11e that is lowered one step at the diagonal position of the corner portion is received by the outer tank portion 11B.

A blocking plate 11f is joined to the wall of the step portion 11e so as to extend in the depth direction of the softening tank 11 at a predetermined interval and surround the step portion 11e. This damming plate 11f has its upper end protruding above the stepped portion 11e, and its lower end separated from the bottom surface of the softening tank 11, and as shown by the arrow in FIG. Warm water flows and overflows from the step 11e to the outer tub 11B.

The wafer suction plate 12 is connected to a vacuum suction source (not shown) and sucks one wafer W11 (see FIG. 4) located at the end of the wafer row W1. As shown by the chain double-dashed line in FIG. 1, this wafer suction plate 12 is rotationally driven by a suction plate rotary actuator 13 via a swing arm 12a.

That is, by the operation of the rotary actuator 13 for the suction plate, the wafer sucked on the wafer suction plate 12 is moved in the plane direction thereof, and the wafer row W is moved.
Be moved out of the area. In this case, a shock absorber 12b for flexibly receiving the revolving arm 12a is provided on the receiving side of the separated wafer.

In the state shown in FIG. 4, the holding member 14 covers the vicinity of the outermost end of the wafer row W1, allows only one wafer W11 located at the outermost end of the wafer row W1 to pass through, and the wafer W11. The purpose is to hold the wafer W12 adjacent to the wafer W12 so that it does not move.
It is rotationally driven between A and the retracted position 14B.

For the above-mentioned purpose, the pressing member 14 is formed with a slit having a gap through which only one wafer W11 can be inserted when the vicinity of the outermost end of the wafer row W1 is covered. A notch 14a is formed to allow the suction plate 12 to move or pass.

The slide motor 17 includes a wafer suction plate 12, a swivel arm 12a, a suction plate rotary actuator 13, a holding member 14, a holding member rotary actuator 15 along the ball screw 17a every time the wafer is peeled off. Slide table 16 and detector 19
However, the assembly fixed to the table base 17c via the table body 17b is moved by a predetermined length in the direction indicated by the arrow A in FIG.

As shown in FIG. 2, the table body 17b is fixed by bolts 17d and 17e on a table base 17c which is screwed into the ball screw 17a.
Further, the table body 17b is formed with an elongated hole 17f extending in an arc shape that can be fixed around the bolt 17d while the table body 17b is slid with respect to the table base 17c by a predetermined angle.

The table body 17b can be fixed to the table base 17c at an angle within a predetermined angle, either manually or by operating a table drive actuator.

As a result, for example, even if the wafer row W adhered on the fixing member 1 is sliced by the wire saw in the direction diagonally intersecting the length direction, that is, the so-called angle cutting is performed. By aligning the axis of the wafer with the axis of the wafer suction plate 12,
It is possible to secure the suction of the wafer.

The dog 18 corresponds to the position of the gap between the wafer rows W1 and W2 arranged in the softening tank 11 and the wall of the softening tank 11 along the moving direction of the wafer suction plate 12 by the slide motor 17. Then, from the wall surface to the detected surface 18a
Is detachably fixed by a clip portion 18b which holds the tank wall so as to project.

The detector 19 constitutes a proximity switch together with the dog 18, and informs the cassette storing means (not shown) of the lot switching. Then, the dog 18 and the detector 19 constitute the gap detecting means in the present embodiment.

The cassette accommodating means separates the wafers, which have been separated by the wafer separating device 10 and which have undergone post-treatments such as a cleaning process, into separate cassettes (not shown) for each lot.
To be stored in.

Next, the operation of the wafer peeling apparatus 10 will be described. First, the bonded portion between each wafer row W and the fixing member 1 is immersed in the softening tank 11 maintained at about 90 ° C. by the heater 11a, and the fixing member 1 is fixed by the fixing frame 11b. Then, the adhesive softens and the wafer is easily peeled off.

Next, the holding member rotary actuator 15 is operated to move the holding member 14 set as the retracted position 14B (see FIG. 1) to the holding position 14A. Then, the wafer suction plate 12 sucks one wafer W11 located at the end of the wafer row W1.

After that, the slide table 16 is driven to slide the axis of the suction plate rotary actuator 13 in the lateral direction, so that the wafer W11 is kept sucked by the wafer suction plate 12 as shown in FIG. And as indicated by arrow B in FIG.
Can be moved in the plane direction.

As a result, the adhesion points 10a to 10
b (see FIG. 1), the wafer W11 is rotated with respect to the fixed member 1 with the end point 10b of the bonded portion serving as a fulcrum among the bonded portions between the wafer W11 and the fixed member 1 and the other end points 10
The softened adhesive portion is gradually and continuously peeled off from the a side.

Next, the wafer W11 is transferred to the wafer suction plate 1
In the state of being adsorbed on No. 2, the slit 14a of the pressing member 14 is inserted together with the wafer suction disc 12 as shown by an arrow C in FIG. 1, and is rotationally driven by the suction disc rotary actuator 13.

At this time, the pressing member 14 moves the wafer row W
Although the vicinity of the end of 1 is still covered, the movement of the wafer suction plate 12 is caused by the notch 1 formed in the holding member 14.
Since it is allowed by 4a, only one wafer W11 is separated from the fixing member 1.

Each time the wafers W11, W12, ... Are peeled off, the slide motor 17 is activated and the detector 1
9 is moved in the direction shown by the arrow A in FIG. 2 together with the wafer suction plate 12, the suction plate rotary actuator 13 and the like, and finally reaches the position below the detection surface 18a of the dog 18.

Then, the surface 19 to be detected is detected by the detector 19.
8a, that is, the gap between the wafer rows W1 and W2 is detected, and this is notified to the cassette storing means as a lot switching, and the wafer moving between the wafer peeling device 10 and the cassette is transferred to the cassette. When all the cassettes are stored, the cassettes being stored are replaced with empty cassettes.

As described above, the wafer stripping apparatus 10 of the present embodiment has the wafer row W in the softening tank 11.
Detected surface 18a corresponding to the position of the gap between 1 and W2
Is provided in advance so as to project from the tank wall of the softening tank 11, and the detector 19 that moves along with the wafer suction plate 12 along the tank wall passes below the detected surface 18a. It is configured to detect the detection surface 18a.

Therefore, the movement of the detector 19 is not hindered, and it is not necessary to retract the dog 18 from the movement axis of the detector 19. Therefore, the multi-mounted wafer rows W1, W2, ... Are provided without providing a special retracting mechanism for retracting the dog 18 from the movement axis.
The wafer peeling work from can be automated.

Next, a second embodiment of the wafer peeling apparatus according to the present invention will be described with reference to FIGS. 2, 4 and 5. In the present embodiment, as compared with the above-described first embodiment, only the configuration of the gap detection means is different,
The other components have the same configuration. Therefore,
Only the structure of the gap detecting means will be described.

The gap detecting means in the present embodiment is a suction detection unit (not shown) for detecting the suction state of the wafer and the wafer suction plate 12 by the operation of the slide motor 17.
Starts moving forward in the direction of arrow A in FIG.
A gap detection unit (not shown) that detects a gap between wafer rows based on the distance until the wafer is adsorbed is configured.

As the suction detection unit, for example, the wafer suction plate 12 is based on the value of the suction force of the vacuum suction source.
A device that detects whether or not the wafer has attracted the wafer is adopted. Further, as the gap detection unit, a timer is provided, and the time from the start of the forward movement of the wafer suction plate 12 by the driving means of the slide motor 17 to the time when the wafer suction plate 12 sucks the wafer by the suction detection unit. Is used and the gap is detected based on the measurement result.

Then, in such a configuration, as shown in FIG. 4, wafers W1 to W1
Relative to the case where 1, W12, ... Are sequentially peeled, the last wafer W1n of the wafer row W1 is peeled, and then the wafer is placed at the end of another row of wafer rows W2 of a different lot. When the positioned wafer W21 is peeled off, the movement time of the wafer suction plate 12 due to the operation of the slide motor 17 becomes longer, so that the gap can be detected based on this movement time.

As in the case of the first embodiment, the detection result is notified to the cassette storing means as the lot switching, and the wafer moving between the wafer peeling device and the cassette is transferred to the cassette. When all of the cassettes are stored in, the cassettes being stored are replaced with empty cassettes.

As described above, according to the wafer peeling apparatus of the present embodiment, the forward movement of the wafer suction plate 12 by the slide motor 17 is performed by the suction detection unit regardless of the movement pitch set to the predetermined length. The gap can be detected while controlling based on the suction state of the wafer.

Therefore, as shown in FIG. 5, even if the upper end of the wafer Wa to be adsorbed next at the outermost end is inclined so as to be in close contact with the upper end of the wafer Wb adjacent thereto, Since the wafer suction plate 12 is driven by the slide motor 17 until the inclined wafer Wa is sucked, the wafer Wa can be surely sucked.

In this embodiment, the slide motor 1
Although the gap is detected based on the forward movement time of the wafer suction plate 12 by 7, it is not limited to this.
The gap may be detected based on the moving distance of the wafer suction plate.

Further, in each of the above-described embodiments, the detection result of the gap is notified only to the cassette housing means, but the present invention is not limited to this, and is used for post-processing such as a cleaning device. It is also possible to notify each of the devices described above that the gap has been detected and control these devices appropriately.

[0060]

As is apparent from the above description, according to the present invention, the following effects can be obtained. (A) According to the wafer stripping apparatus of claim 1, the gap detecting means detects a gap between a plurality of wafer rows adhered on the fixing member and notifies the cassette storing means of the lot switching. Since it is possible to automate, a device that peels wafers one by one from a plurality of wafer rows that are bonded to each other with a gap for each lot on the fixing member,
The workability from the peeling of the wafer to the storage can be dramatically improved. (B) Further , every time the wafer is peeled off by the first driving means, the indicating member detection section is moved along with the wafer suction plate along the side wall of the softening tank by the second driving means, and the indicating member detection section is moved. Gap indicator where the side wall protrudes
Since the gap is detected when the gap is approached to the material, the gap indicating member does not hinder the movement of the indicating member detection unit.

Therefore, the retracting mechanism for retracting the gap indicating member from the moving axis of the indicating member detecting section is unnecessary,
It is possible to realize automation of the work which makes the entire structure of the wafer peeling device simpler.

[0062] (c) According to the wafer peeling apparatus according to claim 2 Symbol placement, to detect the gap based on the interval of the wafer suction disc from the start of the movement by the second drive means until the adsorption of the wafer Therefore, it is possible to detect the gap while controlling the forward movement of the wafer suction plate by the second drive means based on the wafer suction state by the suction detection unit regardless of the movement pitch of the wafer suction plate. Become.

Therefore, even if the upper end of the wafer located at the end in the softening tank is tilted so as to be in close contact with the upper end of the wafer next to it, the tilted wafer is surely adsorbed. be able to.

[Brief description of drawings]

FIG. 1 is a partially sectional front view showing an embodiment of a wafer peeling apparatus according to the present invention.

FIG. 2 is a plan view showing a main part of the wafer peeling apparatus.

FIG. 3 is a side view showing a main part of the wafer peeling apparatus.

FIG. 4 is a perspective view showing a work to be peeled by the wafer peeling apparatus.

FIG. 5 is a side view showing a state in which the wafer to be attracted is tilted and its upper end is in close contact with the upper ends of other adjacent wafers in the work.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Fixing member 11 Softening tank 12 Wafer suction plate 13 Suction plate rotary actuator (first driving means) 17 Slide motor (second driving means) 18 Dog (gap indicating member) 19 Detector (indicating member detecting portion) W Wafer row

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-11-54462 (JP, A) JP-A-9-237770 (JP, A) JP-A-9-45640 (JP, A) JP-A-1- 230246 (JP, A) JP-A-6-254786 (JP, A) JP-A-2-95633 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/304

Claims (2)

(57) [Claims] 1. An apparatus for peeling a wafer from a plurality of wafer rows adhered to each other on a fixing member with a gap for each lot, wherein the fixing member and each wafer row are adhered by immersing the bonded portion. A softening tank for weakening the strength, a wafer suction plate for sucking the wafer located at the end of the wafer row arranged in the softening tank, and driving the wafer suction plate to hold the sucked wafer by the fixing member. The first driving means for peeling from the wafer, the second driving means for driving the wafer suction plate along the arrangement direction of the wafer rows, the gap being detected, and another processing after peeling was performed. the wafer in the cassette storage means for storing the different cassette for each of the lots, and a gap detecting means for notifying the switching of the lot, the gap detection means, corresponding to the position of the gap Said
Along the moving direction of the wafer suction plate by the second driving means
On the side wall of the softening tank, without touching the wafer row
With the gap indicating member provided and the wafer suction plate by the second drive means
Moved along the side wall and approached the gap indicating member
And an indicator member detecting section for detecting the gap indicator member.
Wafer stripping device characterized by the above. 2. A lot is provided on the fixing member for each lot, and a contact is made.
A device that separates wafers from multiple wafer rows
And immersing the bonding part between the fixing member and each wafer row.
Be located at the outermost ends of the softening tank weaken the adhesive strength, the wafer column arranged in softening tank by the
A wafer suction plate for sucking a wafer, and driving the wafer suction plate
The first driving means that separates from the fixing member and the wafer suction unit along the arrangement direction of the wafer rows.
A second drive moving means for driving the Chakuban, and detects the gap, were subjected to the different treatment after peeling
A unit that stores wafers in different cassettes for each lot.
A gap that informs the set storage means of lot switching
And a gap detecting means for detecting the suction state of the wafer.
Adhesion detection unit and the wafer sucking unit by the second driving unit.
Wait until the platen begins to move forward until it picks up the wafer.
Equipped with a gap detection unit that detects the gap based on the
Wafer stripping device characterized by the above.