JP3190538B2 - Wafer cleaning slice base peeling equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a wafer of silicon or the like which is used as a material of a semiconductor device, and more particularly to an apparatus for cutting an ingot by a slicing machine, a wire saw or the like (hereinafter simply referred to as "cutting machine"). The present invention relates to an apparatus having a function of cleaning a sliced wafer, peeling a slice base adhered to a base portion of the wafer, and storing the slice base peeled wafer in a cassette.

[0002]

2. Description of the Related Art A wafer such as silicon, which is used as a material for a semiconductor device, is cut out from a state of an ingot by a cutting machine, and a slice base is adhered to the ingot so that a cut end portion is not chipped at the time of cutting. Cut off including. Therefore, the wafer W after cutting has the shape shown in FIG. 11, and the slice base Wb is peeled off from the base material Wa such as silicon after cutting.

[0003] As a peeling method, the adhesive bonding the slice base Wb to the base material Wa is softened, and in this state, the slice base Wb is pushed in the thickness direction of the wafer W and peeled. As a method of softening the adhesive, there are a method of heating the wafer W in hot water, a method of heating the wafer W with a heater (the base material Wa is heated by a clamp table having a built-in heater, or a slice base receiving device having a built-in heater. The slice base Wb is heated by a plate.) And a method of directly heating the bonded portion with hot air is available.

Further, the cut wafer W needs to be cleaned before and after the peeling of the slice base Wb in order to remove cutting powder and cutting fluid attached at the time of cutting, and furthermore, the peeling and cleaning are completed. It is necessary to store the completed wafer W (that is, the base portion Wa) in a cassette for the next manufacturing process.

[0005]

Conventionally, however, the separation, cleaning, and storage are often performed in separate apparatuses. In this case, not only the equipment cost of the entire wafer manufacturing apparatus is increased, but also the installation of the apparatus is not required. The area increases,
Furthermore, there is a problem that it takes time since an operator often manually carries in and out between these processes.

In the method of softening the adhesive by putting the wafer W in hot water for peeling, maintenance of the hot water is troublesome, the installation area of the apparatus is likely to be large, and Since the temperature is about 100 ° C., it is necessary to take sufficient safety measures.

Further, the wafer W is placed in a horizontal position (wafer W
Refers to a state in which the thickness direction is vertical. ), But in this case, the installation area of the apparatus generally becomes large, and the wafer W is easily bent, and if this state is maintained for a long time, the flatness of the wafer W may be deteriorated. There is. In particular, in recent years, wafers W have become increasingly larger due to improvements in semiconductor production efficiency and the like.
This effect is no longer negligible. In addition, if the cleaning liquid is kept in this posture after cleaning, the cleaning liquid remains and the surface of the wafer W is easily stained.

The present invention has been made in view of such circumstances, and performs cleaning, peeling, and storing automatically in a short time, has a small installation area, is inexpensive, and further deteriorates the flatness of the wafer W. It is an object of the present invention to provide a wafer cleaning slice-based peeling apparatus that is less likely to cause rust and stains.

[0009]

In order to achieve the above-mentioned object, the present invention provides a wafer cleaning slice-based peeling apparatus which is provided with each function of cleaning, peeling, and storing in a single apparatus, for cleaning a wafer W. A method of heating the wafer W with a heater to soften the adhesive while adopting a process of automatically storing the wafer W is adopted, and further, the wafer W is placed in a vertical position (in a state where the thickness direction of the wafer 10 is set in the horizontal direction). .)
And handle it.

That is, the wafer cleaning slice-based peeling apparatus is configured as follows. (A) A cleaning unit for cleaning the wafer W in a vertical position is provided.
The cleaning unit includes an elevator that transports the wafer W in a vertical position up and down inside and outside the cleaning tank. (B) Drying the washed wafer W and attaching the slice base Wb to the base portion Wa of the wafer W
A drying / peeling part for peeling off is provided. (C) A storage unit is provided, and a cassette for storing the wafer W from which the slice base Wb has been peeled off is provided. (D) A horizontal transfer unit that drives the transfer arm in two horizontal directions orthogonal to each other is provided. (E) The transfer arm of the horizontal transfer unit is provided with the first wafer holding unit. The first wafer holder includes a first holder for holding the wafer W and a mechanism for driving the first holder up, down, and 90 °. (F) The transfer arm of the horizontal transfer unit is provided with a second wafer holding unit. The second wafer holding unit includes a second holder for holding the wafer W in a vertical position and a vertical drive mechanism for the second holder. (G) The wafer W carried out from the cutting machine in the horizontal posture is held in the first holder, turned into the vertical posture, and then carried into the elevator of the cleaning unit. (H) Wafer W unloaded by elevator after cleaning is completed
Is transported to the drying / peeling unit while being held by the second holder, and the wafer W from which the slice base has been peeled is transported to the storage unit and stored in the cassette.

In this case, when the wafer W is transported in the slice base direction at the time of being unloaded from the cutter, the slice base direction at the time of peeling is changed by a pusher for peeling the slice base Wb at the drying / peeling section. If the position does not match, the following two methods are used.

One of the methods is to provide a posture setting unit having a table rotatably supported in a horizontal plane, and to reset the slice base direction of the wafer W unloaded from the cutting machine by the posture setting unit. Turn to your posture. In another method, the second holder is rotatable, and the second holder is rotated to reset the slice base direction of the wafer W.

When the wafer W carried out from the cutting machine in the horizontal position is held by the first holder, the center portion of the wafer W is held. When the wafer W is turned to the vertical position, the center portion is held as it is. There are a method of holding the wafer W and a method of holding the vicinity of the outer periphery of the wafer W. In any case, the vertical position has a small effect on the flatness of the wafer W in any method.
Selection is made according to the structure of the peeling section and the storage section.

There are also two methods for holding the wafer W with the second holder, but when the second holder is rotatable and the slice base direction of the wafer W is set, the wafer W may be set. A method of holding the center of W is used.

The drying of the wafer W and the softening of the adhesive in the drying / peeling section are performed by one of the following methods. (A) After blowing dry air onto the wafer W, the wafer W is pressed against a clamp table having a built-in heater to heat the base portion Wa. (B) After blowing dry air onto the wafer W, the slice base Wb is heated by a slice base receiving plate having a built-in heater.

In the drying / peeling section, the slice base direction of the wafer W is set to be horizontal or obliquely downward.

Further, the driving method of the transfer arm of the horizontal transfer section is, for example, screw drive by a servomotor.

[0018]

The wafer W cut out of the ingot by the cutting machine and carried out in the horizontal position is moved by the first holder to the wafer W.
After being held in the central part and turned to a vertical position, it is carried into the elevator of the washing unit. Then, the wafer W is carried into the cleaning tank by the elevator and is cleaned. When the cleaning is completed, the wafer W is carried out of the cleaning tank by the elevator.

Next, the wafer W is held by the second holder and carried into the drying / peeling section, where it is dried and the slice base Wb is peeled. The wafer W from which the slice base Wb has been peeled is held by the second holder, transported to the storage unit, and stored in the cassette.

However, when the attitude setting unit is provided when the slice base direction of the wafer W is reset, the slice base direction of the wafer W unloaded from the cutting machine is reset by the attitude setting unit. Later, you can change to a vertical position. When the second holder is rotatably provided, the wafer W is carried into the drying / separation unit after the slice base direction of the wafer W is reset by the second holder.

In the case where the wafer W can be turned to the vertical position after the vicinity of the outer periphery of the wafer W is held by the first holder, the wafer W unloaded from the cutting machine is placed on a table of a position setting unit or a fixed table. Once placed on top and held back.

In the drying / peeling section, the cleaning liquid adhering at the time of cleaning is removed by blowing dry air onto the wafer W, and the base member Wa is heated by a clamp table having a built-in heater, or a slice having a built-in heater. The slice base Wb is heated by the base receiving plate, so that the wafer W is dried and the adhesive is softened.

In the drying / peeling section, the wafer W
When the slice base direction is horizontal or obliquely downward, the peeled slice base Wb falls downward without any special operation.

If the driving method of the transfer arm of the horizontal transfer unit is a screw drive by a servo motor, the pitch for storing the wafers W in the cassette of the storage unit can be set freely, and the type of the cassette is a single wafer type (one wafer W is used). It is possible to cope with any of the stack type (the wafers W are stored one by one without separating them).

[0025]

【Example】

Embodiment 1 FIGS. 1, 2 and 3 show the overall view of Embodiment 1 of a wafer cleaning slice-based peeling apparatus according to the present invention. 1 is a plan view, FIG. 2 is a view as viewed in the direction of the arrow K in FIG. 1 (side view), and FIG. 3 is a front view. In the first embodiment, the wafer W unloaded from the cutting machine
Is assumed to be carried out in a lateral posture in a direction in which the slice base direction is rotated by a predetermined angle θ with respect to the direction at the time of peeling.

The wafer cleaning slice-based peeling apparatus of the first embodiment is roughly divided into a posture setting unit 20 and a cleaning unit 3.
0, drying / peeling section 40, storage section 60, horizontal transport section 70,
It comprises a first wafer holder 80 and a second wafer holder 95. As shown in FIGS. 1, 2 and 3, the posture setting unit 20 and the cleaning unit 3 extend in the X direction from the cutting machine side.
0, the drying / peeling unit 40 is arranged in this order, and the storage unit 60 is arranged in front of the cutting machine. Note that two horizontal directions perpendicular to each other are defined as an X direction and a Y direction, and in the first embodiment, a direction parallel to the cutting machine is defined as a Y direction. Further, from the cleaning unit 30, the thickness direction of the wafer W is transported in the X direction.

The attitude setting section 20 sets the slice base direction of the wafer W so that the slice base Wb at the time of peeling is adapted to the position of a pusher 55 of a drying / peeling section described later. Details are shown in FIG. 4 (plan view) and FIG. 5 (partial sectional view in front view). The wafer W is shown by an imaginary line in FIG. 4 and by a solid line in FIG.

In the attitude setting section 20, a bearing 22 is fixed to a bracket 21 attached to a column 71 of a horizontal transport section 70 described later, and a shaft 23 is rotatably supported by a bearing built in the bearing 22. A table 24 is fixed to the upper end of the shaft 23, and a pulley 25 is fixed to the lower end. The bracket 21 has a rotary cylinder 2
6, a pulley 27 is fixed to the tip of a rotary cylinder 26, and the pulley 27 and the pulley 25 are connected by a belt 26.

Further, the table 24 has a wafer W
Concave portion 24 having a shape slightly larger than base material portion Wa
a, a notch 24b slightly larger than the width of the slice base Wb is formed. A projection 24c is formed on the lower surface of the table 24, and two stoppers 29a and 29b are provided on the bracket 21.

The attitude setting section 20 is configured as described above, and the table 24 has two projections 24c and two stoppers 29.
a and 29b are rotated by the rotary cylinder 26 by the angle θ. Further, since the slice base Wb is regulated by the notch 24b, the wafer W follows the rotation angle of the table 24.

The cleaning section 30 is for cleaning the wafer W, and details are shown in FIG. 6 (partial sectional view in front view) and FIG. 7 (plan view). In each case, the wafer W is indicated by an imaginary line.

The washing section 30 has a washing tank 31 in which washing water is stored up to a predetermined height 32.
Although not shown, an ultrasonic generator is provided. An air cylinder 34 with a built-in slide guide is attached to a column 33 provided outside the washing tank 31 with the drive direction up and down. An elevator 35 is attached to a slider 34 a of the air cylinder 34. At three places of the elevator 35, receiving pieces 35a for supporting the wafer W are fixed.

The cleaning unit 30 is configured as described above.
The elevator 35 receives and supports both sides and the lower side of the wafer W in the horizontal direction by receiving pieces 35a fixed at three places. Then, the wafer W is ultrasonically cleaned in the cleaning water with the elevator 35 at the lower end state (the position shown in FIG. 6), and comes out of the cleaning water at the upper end state.

The drying / peeling section 40 dries the wafer W to which the cleaning liquid has been adhered after being cleaned by the cleaning section 30 and, at the same time, from the base portion Wa of the wafer W to the slice base Wb.
Where it is peeled off. The drying / peeling part 40 is divided into two parts, a drying nozzle side and a peeling side.
-It is shown in FIG. 7 is a plan view showing the cleaning unit 30 together with the above-described cleaning unit 30. FIG. 8 is a cross-sectional view taken along line LL of FIG. In the state before is fixed, the wafer W is shown by imaginary lines.

In the drying / peeling section 40, drying nozzles 42 and 43 are attached to the upper end of the column 41 near the cleaning section 30. The drying nozzles 42 and 43 are formed with a large number of holes 42a in a row facing obliquely downward, and dry air is blown out from the holes 42a. However, the center of the drying nozzle 43 has a U-shape so as not to interfere with the tip portion (the suction pad 99 and the like) of the second wafer holding portion 95, and the hole 42a is not formed in that portion. Also,
An enclosure 44 is attached to the column 41 immediately below the drying nozzles 42 and 43.

Further, an L-shaped flange 45 fixed to two upper and lower locations on the side of the column 41 remote from the washing section 30 is provided.
A clamp table 47 is attached via a heat insulating plate 46. The clamp table 47 incorporates a heater that generates heat at a predetermined temperature and a temperature sensor (both not shown) that detects the temperature of the clamp table 47, and is heated and held at a predetermined temperature (around 100 ° C.). .

The contact surface 47a of the clamp table 47 has the same shape (circle) as the base member Wa, and the diameter is equal to the base member Wa.
Slightly smaller than the diameter. Two positioning bars 48 are provided below, and when the outer periphery of the base portion Wa contacts the two positioning bars 48, the center of the base portion Wa substantially coincides with the center of the contact surface 47a. ing.

An attachment plate 49 is fixed to the end surfaces of the two positioning bars 48, and the air cylinder 50 is attached to the attachment plate 49.
Are mounted with the driving direction being the X direction (the clamp table 47 direction). A piston head 51 is fixed to the tip of the piston shaft of the air cylinder 50, and a clamper 52 is supported by the piston head 51 so as to be movable in the X direction. The clamper 52 is urged in the X right direction (toward the clamp table 47) by the compression spring 53, and is returned to the X left direction by the air cylinder 50.

Further, the flange 4 to which the column 41 is fixed
5, an air cylinder 54 with a built-in slide guide is attached with the drive direction being the X direction, and a pusher 55 is attached to a slider 54 a of the air cylinder 54.
Is fixed. A basket 56 is provided below the clamp table 47 and the like.

The drying / peeling section 40 is configured as described above. On the drying nozzle side, the wafer W is held by the suction pad 99 of the second wafer holding section 95 described later, and the space between the drying nozzles 42 and 43 is formed. Through the lower end (Fig. 8
(Position shown in FIG. 5), the drying air is blown out from the drying nozzles 42 and 43 to remove the cleaning liquid.
At this time, the removed water drops are not scattered outside by the surrounding box 44.

On the peeling side, the wafer W is held by a suction pad 99 of a second wafer holding portion 95, which will be described later, and the center of the base member Wa is positioned at the contact surface 47 of the clamp table 47.
a to a position slightly above the center of “a” (before the outer periphery of the base material portion Wa contacts the positioning bar 48).
(Without touching the clamp table 47).

Next, the holding force of the suction pad 99 is released, and the outer periphery of the base portion Wa contacts the positioning bar 48, so that the center of the base portion Wa substantially coincides with the center of the contact surface 47a. When the piston shaft of the air cylinder 50 is driven to the right in the X direction from this state, the clamper 52
3, the base material portion Wa is pressed against the clamp table 47 and fixed.

When a predetermined time elapses after the clamper 52 fixes the base portion Wa to the clamp table 47, the base portion Wa
Since the adhesive bonding the slice base Wb and the slice base Wb becomes high temperature and becomes soft, the pusher 55 presses the slice base Wb in the X right direction and peels off the base part Wa. Further, the base material portion Wa is heated and dried. The peeled slice base Wb falls and is stored in the basket 56.

The storage section 60 is shown in FIGS.
The storage unit 60 includes three cassettes 62 on a table 61, and stores the wafer W (that is, the base material Wa) from which the slice base Wb has been peeled. There are single-wafer type and stack type cassettes, and the cassette 62 shown in FIGS.
Is a single-wafer type.

The horizontal transport section 70 is shown in FIGS. 1, 2 and 3 of the overall views. In the horizontal transfer unit 70, 2 is installed on the base 11 of the wafer cleaning slice base peeling device of the first embodiment.
A horizontal member 72 is fixed to the upper end of each of the four columns 71, and a beam 73 is provided on the horizontal member 72 in the Y direction. A Y slide unit 74 is attached to the lower surface of the beam 72, and an X slide unit 75 is attached to the slider of the Y slide unit 74 in the X direction. Further, the slider of the X slide unit 75 is provided with a transfer arm 76.

Thus, the transfer arm 76 is driven in the XY directions. The Y slide unit 74 and the X slide unit 75 are driven by screws using a servo motor as a drive source.

The details of the first wafer holder 80 and the second wafer holder 95 are shown in FIGS. 9 and 10 (FIG. 10 is a view taken in the direction of the arrow M in FIG. 9).

In the first wafer holding section 80, an air cylinder 81 with a built-in slide guide is attached to a transfer arm 76 of a horizontal transfer section 70, and an arm 82 is fixed to a slider 81a of the air cylinder 81. Arm 8
A shaft 83 is provided at the distal end of the pad 2, and a pad holder 84 is supported by the shaft 83 so as to be rotatable by 90 °. At the tip of the pad holder 84, a suction pad (corresponding to the "first holder" described above) 85 is provided. The suction pad 85 holds the wafer W by vacuum suction.

A shaft 87 is provided on a flange portion 82a formed at the upper end of the arm 82, and an air cylinder 88 is swingably supported on the shaft 87. A shaft 86 is fixed to a piston head 89 fixed to a tip of a piston shaft 88a of the air cylinder 88. The shaft 86 is rotatably connected to a bearing built in an end of a pad holder 84. Further, stoppers 90 and 91 are provided at two places on the arm 82.

The first wafer holding section 80 is configured as described above, and the suction pad 85 moves up and down when the slider 81a of the air cylinder 81 moves up and down.
When the piston shaft 88a of the air cylinder 88 is driven downward, the pad holder 84 comes into contact with the stopper 90, and the suction pad 85 faces downward.
When a is driven upward, the pad holder 84 comes into contact with the stopper 91, and the suction pad 85 turns in the horizontal direction.

In the second wafer holder 95, an air cylinder 97 with a built-in slide guide is attached to a pedestal 96 fixed to the transfer arm 76 on the opposite side of the first wafer holder 80. A pad holder 98 is fixed to the slider 97a of the air cylinder 97, and a suction pad (corresponding to the "second holder" described above) 99 is provided at the tip of the pad holder 98. The suction pad 99 holds the wafer W by vacuum suction.

The second wafer holding section 95 is configured as described above, and the suction pad 99 moves up and down by the slider 97a of the air cylinder 97.

Next, the operation of the wafer cleaning slice-based peeling apparatus according to the first embodiment configured as described above will be described.
The main positions of the wafer W are denoted by reference numerals from A to H (at the time of peeling) in FIG. 2, only the position of C (above the cleaning unit 30) is indicated by a solid line, and the others are indicated by imaginary lines. However, FIG.
Shows a state held by the second wafer holding unit 95.

The wafer W (position A in FIG. 2) carried out of the cutter is attached to the suction pad 8 of the first wafer holder 80.
5, the center portion of the wafer W is held and transferred by the horizontal transfer unit 70, and is loaded into the table 24 when the table 24 of the attitude setting unit 20 is rotated by θ from the state of FIG. 4 (see FIG. 2). B position).

In the attitude setting unit 20, after the holding force of the suction pad 85 is released and the suction pad 85 is raised, the wafer W is rotated by θ by the table 24, and the slice base direction is the Y left direction (FIGS. 1 and 4). -The state shown in Fig. 5) is set.

When the slice base direction is set, the suction pad 85 moves to the cutting machine side (X left direction in FIG. 2) and then descends to hold the vicinity of the outer periphery of the wafer W. Next, the suction pad 85 moves rightward in FIG. 2 to a position where the wafer W does not interfere with the table 24, and
゜ Rotate to change the orientation of wafer W to a vertical orientation (Fig. 2
In the state of C).

When the wafer W is changed to the vertical position, the elevator 35 of the cleaning section 30 is raised, and when the elevator 35 is at the position of the rising end, the holding force of the suction pad 85 is released, and the wafer W is lifted. It is delivered to the receiving piece 35a.

When the wafer W is received, the elevator 35
Descends and carries the wafer W into the cleaning tank (D in FIG. 2).
State). When the cleaning of the wafer W is completed, the elevator 3
5 rises and the wafer W is carried out of the cleaning tank.

When the elevator 35 returns to the position of the rising end,
This time, the wafer W is held by the suction pad 99 of the second wafer holding unit 95 (the state of E in FIG. 2). Then, first, it is carried into the drying nozzle side of the drying / peeling section 40, and as described above, descends between the drying nozzles 42 and 43, and rises from the descending end (the state of F in FIG. 2). During this time, the drying air is blown out from the drying nozzles 42 and 43 to remove the cleaning liquid.

Next, the wafer W is transported to the peeling side while being held by the suction pad 99 (the state G in FIG. 2), and is fixed to the clamp table 47 as described above (the state H in FIG. 2). The slice base Wb is peeled. The wafer W from which the slice base Wb has been peeled off is again put on the suction pad 99.
And is conveyed to the storage unit and stored in the cassette.

Second Embodiment Next, a second embodiment of the wafer cleaning slice-based peeling apparatus according to the present invention will be described. Example 2 corresponds to Example 1
Similarly to the above case, the slice base direction of the wafer W unloaded from the cutting machine is a direction rotated by a predetermined angle with respect to the direction at the time of peeling, but in the second embodiment, the wafer W is The only difference is that the slice base direction is reset. The rest is the same as the first embodiment, and the second embodiment is not shown.

That is, in the second embodiment, instead of the posture setting unit 20 shown in the first embodiment, the posture setting unit 20 shown in the first embodiment is attached to the pad holder 98 of the second wafer holding unit 95.
A rotary cylinder is provided as shown in FIG.
Attach a pulley to the opposite side of the suction surface, and connect with a pulley of a rotary cylinder with a belt. Then, the central part of the wafer W is held.

As a result, the wafer W is held by the suction pad 99, and the slice base direction is reset in the state of E or G in FIG. 2 shown in the first embodiment.
In this case, the relationship between the clamper 52 and the clamper 47 is set at a position farther from the clamp table 47 than the position shown in the first embodiment so as not to interfere with the suction pad 99 and the like.

In the second embodiment, since the central portion of the wafer W is held, the substrate portion Wa is held at the time of peeling.
May be performed by the suction pad 99 instead of the clamper 52 shown in the first embodiment. That time,
The suction pad 99 is biased toward the clamp table 47 by a spring or the like.

Third Embodiment Next, a third embodiment of the wafer cleaning slice-based peeling apparatus according to the present invention will be described. The third embodiment is a case where the angle of the slice base direction of the wafer W unloaded from the cutting machine with respect to the direction at the time of peeling is not specified, and the posture setting unit is changed from the first embodiment as follows. The other components are the same as those of the first embodiment, so that the third embodiment is not particularly illustrated.

That is, in the third embodiment, unlike the posture setting unit 20 shown in the first embodiment, a motor is provided instead of the rotary cylinder 26, and the recess 24 on the upper surface of the table 24 is provided.
a, notch 24b, lower surface convex portion 24c, stopper 2
9a and 29b are eliminated, and a non-contact (for example, optical) sensor is provided above the table 24 on the left side of Y (the position where the slice base Wb is set). Thus, even if the wafer W is carried into the table in an unspecified slice base direction, the table is rotated by the motor, the position of the slice base Wb is confirmed by the non-contact sensor, and the slice base direction is set.

In the embodiment described above, two drying nozzles 42 and 43 are provided in the drying / peeling section 40 and the dry air is blown on both surfaces of the wafer W. However, the present invention is not limited to this. The present invention can also be applied to a case where dry air is blown only on one side of the wafer W or processing is performed without blowing dry air by omitting any drying nozzle. In either method, the cleaning liquid for the wafer W is removed and dried by pressing the wafer W against a clamp table having a built-in heater. Which method is adopted depends on various conditions.

In the above-described embodiment, the wafer W is pressed against the clamp table 47 having a built-in heater in order to soften the adhesive bonding the base portion Wa and the slice base Wb in the drying / peeling section 40. The method is not limited to this, but the present invention can be applied to a method in which the slice base Wb is heated by a slice base receiving plate having a built-in heater.

Furthermore, in the embodiment, the driving method of the transfer arm 76 of the horizontal transfer section 70 is screw driving by a servo motor, but belt driving or rack driving may be used. Although the first holder and the second holder are of a vacuum suction type, the present invention can be applied to holders of other types.

In the embodiment, the cassette 6 in the storage section 60 is used.
Although 2 is a single wafer type, it is needless to say that a stack type can also be used.

[0071]

As described above, according to the wafer cleaning slice-based peeling apparatus of the present invention, cleaning, peeling,
A single device is provided with each function of storing, and the process from cleaning to storing of the wafer W is automatically performed, and a method of heating the wafer W with a heater to soften the adhesive is adopted. Handled in a posture.

Therefore, the cleaning, peeling, and storing are automatically performed in a short time, the installation area is small, the cost is low, and the wafer cleaning slice base peeling is less likely to deteriorate the flatness of the wafer W or cause spots. An apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is an overall plan view of a wafer cleaning slice-based peeling apparatus according to a first embodiment of the present invention.

FIG. 2 is a view as viewed in the direction of arrow K in FIG. 1 (side view).

FIG. 3 is an overall front view of the first embodiment according to the present invention.

FIG. 4 is a detailed plan view of a posture setting unit according to the first embodiment of the present invention.

FIG. 5 is a detailed front view (partially sectional view) of a posture setting unit according to the first embodiment of the present invention.

FIG. 6 is a detailed front view (partially sectional view) of a cleaning unit according to the first embodiment of the present invention.

FIG. 7 is a detailed plan view of a cleaning unit and a drying / peeling unit according to the first embodiment of the present invention.

8 is a sectional view taken along line LL of FIG. 7;

FIG. 9 is a detailed view of a first wafer holding unit and a second wafer holding unit according to the first embodiment of the present invention.

FIG. 10 is a view taken in the direction of arrow M in FIG. 9;

FIG. 11 is a view showing an outer shape of a wafer;

[Explanation of symbols]

 W: Wafer 20: Attitude setting unit 30: Cleaning unit 40: Drying / peeling unit 60: Storage unit 70: Horizontal transfer unit 74: Y slide unit 75: X slide unit 76: Transfer Arm 80: First wafer holder 95: Second wafer holder A: Wafer unloading position of cutting machine

Claims (8)

(57) [Claims] 1. An elevator for transporting a wafer in a vertical position up and down inside and outside a cleaning tank, a cleaning unit for cleaning the wafer, and drying the cleaned wafer in a vertical position. A drying / peeling part for peeling the slice base adhered to the base material part of the above, a storage part having a cassette for storing the wafer from which the slice base has been peeled in a vertical position, and a transfer arm in two horizontal directions orthogonal to each other. A horizontal transfer unit to be driven; a first holding unit for holding a wafer; a first wafer holding unit supported by the transfer arm, including a vertical and 90 ° rotation drive mechanism for the first holding unit; And a second wafer holding portion supported by the transfer arm, comprising a second holding tool for holding the second holding tool and a vertical drive mechanism for the second holding tool. A wafer that has been carried out in a horizontal attitude from,
After holding with the first holder and changing the orientation to the vertical position,
The wafer carried into the elevator of the cleaning unit, and the wafer carried out of the cleaning tank of the cleaning unit by the elevator was held by the second holding tool and carried into the drying / peeling unit, and the slice base was peeled. A wafer cleaning slice-based peeling apparatus, wherein a wafer is held by the second holder, transported to a storage unit, and stored in the cassette. 2. An attitude setting unit for setting a slice base direction of a wafer by placing the wafer on a table rotatably supported in a horizontal plane, and setting a slice base direction of a wafer carried out in a horizontal attitude from an ingot cutting machine. 2. The wafer cleaning slice-based peeling device according to claim 1, wherein the wafer holding slice is held by the first holder and changed to a vertical posture. 3. The apparatus according to claim 1, wherein the second holder is rotatably provided, and the second holder is rotated to set a slice base direction of the wafer. . 4. A fixed table on which a wafer is placed is provided, and a wafer carried out of the ingot cutting machine in a lateral position is loaded into the table while holding the central portion of the wafer with the first holding tool. It is characterized by changing the holding position to the vicinity of the outer periphery and turning the wafer to the vertical position
The wafer cleaning slice-based peeling device according to claim 1 . 5. A wafer carried out in a lateral posture from an ingot cutting machine is carried into the posture setting part while holding a central portion of the wafer with the first holder, and then the holding position of the wafer is changed to a position near an outer periphery. 3. The wafer cleaning slice-based peeling apparatus according to claim 2, wherein the wafer is turned to a vertical posture. 6. A drying nozzle for blowing dry air onto a wafer, a clamp table having a built-in heater for generating heat at a predetermined temperature, and a base portion of a wafer fixed to the clamp table. 6. A clamper comprising: a clamper; and a pusher for pushing a slice base of the wafer in a thickness direction of the wafer.
The wafer cleaning slice-based peeling apparatus according to any one of the above. 7. In the drying / peeling section , the wafer is vertically
When it is held in position, intake of slice-based wafer
The wafer cleaning slice-based peeling apparatus according to any one of claims 1 to 6, wherein the attached position is configured to face a horizontal direction. 8. The wafer cleaning slice base peeling apparatus according to claim 1, wherein a driving method of the transfer arm of the horizontal transfer unit is screw driving by a servo motor. . [0001]