JP3980115B2 - Bonding device for bonding electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component bonding bond coating apparatus that applies a bond for bonding an electronic component to a substrate.
[0002]
[Prior art]
A method using a syringe is known as a method for applying a bond for bonding an electronic component to a substrate to the substrate. In this method, the syringe held in the holder is moved horizontally relative to the substrate, and a gas pressure is applied to the bond stored in the syringe so that the bond is discharged from the lower nozzle of the syringe. It is something to apply to.
[0003]
When the bond in the syringe is out of stock, the syringe is replaced, and a new syringe is attached to the holder. However, air is mixed in the vicinity of the mouth of the nozzle of a new syringe, etc. when it is attached, and when the bond is discharged from the nozzle as it is, this air is caught in the bond and the bond containing bubbles is applied to the substrate. . When an electronic component is bonded onto a bond containing bubbles in a later process, various inconveniences such as poor adhesion occur.
[0004]
Therefore, conventionally, when the syringe is replaced and a new syringe is mounted on the holder, the operator holds the cup or the like in hand and applies a gas pressure to the bond in the syringe for a while (generally for about 20 seconds). ) A bond containing air bubbles was dripped from the nozzle, and the bond was collected in a cup or the like applied below the nozzle. Thereafter, the bond application to the substrate was resumed.
[0005]
[Problems to be solved by the invention]
However, the above-described conventional method is troublesome for the operator, and it takes a lot of time to replace the syringe. Further, the above-mentioned 20 seconds is a loss time and the work efficiency is not improved.
[0006]
Accordingly, an object of the present invention is to provide a bond applicator for bonding an electronic component that can efficiently discharge a bond containing bubbles in the next syringe during the application of the bond, and can perform a good replacement of the syringe. To do.
[0007]
[Means for Solving the Problems]
The electronic component bonding bond applicator of the present invention is stored in a positioning part of a substrate, a moving table for moving the syringe held by the holder relatively horizontally with respect to the substrate, and a syringe held by the holder. A first pressurizing unit that discharges the bond from the lower nozzle of the syringe by applying a gas pressure to the bonded bond, and a mounting part for removing the syringe to be used next time from the refrigerator and returning it to room temperature. A standby stage is provided for restarting the bonding operation by removing the syringe from the mounting portion and holding it in the holder when the bond in the syringe held by the boulder is out of stock. A second pressurizing unit that applies a gas pressure to the bond in the syringe to be used and discharges the bond containing bubbles from the nozzle.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
According to the present invention having the above-described configuration, when a syringe to be used next time is taken out from the refrigerator and kept waiting, a bond containing bubbles by applying a gas pressure to the bond in the syringe by the second pressurizing means. Is discharged in advance. Therefore, if the syringe bond held by the holder is out of stock and the syringe is replaced, gas pressure is applied to the replaced syringe by the first pressurizing means and the bond application to the substrate is immediately resumed. Can do.
[0009]
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a bonding apparatus for bonding an electronic component according to an embodiment of the present invention, and FIG. 2 is a sectional view of a standby stage of the bonding apparatus for bonding an electronic component.
[0010]
In FIG. 1, reference numeral 1 denotes a moving table, which is composed of an X table 2 and a Y table 3 which are orthogonal to each other. A head 4 is attached to the lower surface of the Y table 3, and a holder 5 is attached to the head 4. A syringe 6 is detachably held in the holder 5. A first pressurizing means 8 is connected to the syringe 6 through a tube 7. Bonds are stored inside the syringe 6, and when a gas pressure is applied to the bonds by the first pressurizing means 8, the bonds are discharged from the lower nozzle of the syringe 6.
[0011]
The substrate 11 is positioned on the positioning unit 12. When the moving table 1 is driven, the syringe 6 moves horizontally in the X direction and the Y direction, and the bond 10 is applied to a predetermined coordinate position of the substrate 11.
[0012]
Side walls 13 are provided on the side of the moving table 1. A mounting portion 14 is attached to the front surface of the side wall 13. The syringe 6 to be used next time is mounted in the mounting hole 15 of the mounting unit 14 and waits. That is, the position where the mounting portion 14 is provided is a standby stage.
[0013]
A connection portion 16 is provided on the upper surface of the side wall 13. The connecting portion 16 is connected to the second pressurizing means 18 through the tube 17. In FIG. 2, a tube 20 that is detachably connected to the joint 19 of the syringe 6 attached to the attachment portion 14 is provided on the front surface of the connection portion 16. The connecting portion 16 has a built-in valve. When the button 21 is rotated, the valve opens and closes. A container 22 as a bond recovery unit is provided below the mounting unit 14.
[0014]
Therefore, as shown in FIG. 2, when the syringe 6 is attached to the attachment portion 14, the tube 20 is connected to the joint 19, and the valve is opened by operating the button 21, the bond inside the syringe 6 is connected from the second pressurizing means 18. A gas pressure is applied to 10, the bond 10 containing bubbles is discharged from the nozzle 9 below the syringe 6, and the discharged bond 10 is collected in the container 22. Reference numeral 23 denotes a base of the nozzle 9.
[0015]
This electronic component bonding bond coating apparatus has the above-described configuration. Next, the handling operation will be described. In FIG. 1, the moving table 1 is driven to move the syringe 6 held by the holder 5 in the X direction and the Y direction, and coating is performed on a predetermined coordinate position of the substrate 11. Meanwhile, the operator takes out the syringe 6 stored in the refrigerator (not shown) from the refrigerator, attaches it to the attachment part 14, and connects the tube 20. Air is present near the mouthpiece 23 of the syringe 6. Therefore, if the operator operates the button 21 to apply a gas pressure to the bond 10 in the syringe 6, the bond 10 containing bubbles near the base 23 is discharged into the container 22 (FIG. 2). This discharge time is about 20 seconds.
[0016]
When the bond 10 in the syringe 6 held by the holder 5 is out of stock, the syringe 6 is removed from the holder 5 and collected. Moreover, the syringe 6 is removed from the mounting portion 14 and is held by the holder 5 to restart the application work of the bond 10. In this case, since the new syringe 6 has air bubbles removed from the mounting portion 14, the application work of the bond 10 can be resumed immediately.
[0017]
In addition, in order to prevent the quality deterioration of the bond 10 in the syringe 6, the syringe 6 is generally stored in a refrigerator (not shown), and the syringe 6 to be used next time is taken out from the refrigerator and mounted on the mounting portion 14. However, in this case, it is desirable that the bond 10 in the syringe 6 be returned to room temperature during the standby state where the bond 10 is mounted on the mounting portion 14. This is because the bond 10 in the syringe 6 used by being mounted on the holder 6 is assumed to be at room temperature, and when the bond 10 is at room temperature or less, its viscosity is high and even if gas pressure is applied. This is because it is difficult to discharge a predetermined amount from the nozzle 9.
[0018]
Therefore, it is desirable that the timing of taking out the syringe 6 from the refrigerator and mounting it on the mounting portion 5 is considerably before the timing at which the bond 10 in the syringe 6 held by the holder 5 is out of stock and the syringe is replaced. This time difference is the time required for the bond 10 in the syringe 6 taken out from the refrigerator to reach room temperature, and is generally about one hour. A method for predicting when the bond 10 in the syringe 6 held by the holder 5 is used up is well known. Therefore, the syringe 6 can be taken out of the refrigerator and attached to the attachment unit 14 a predetermined time ago. it can.
[0019]
Moreover, in the said embodiment, although the syringe 6 used next time is mounted | worn with the mounting part 14, and the bond 10 containing a bubble is discharged, after an operator takes out the syringe 6 used next time from a refrigerator, this The gas pressure may be applied to the bond 10 in the syringe 6 by the second pressurizing means 18 while being held in the hand, and the bond containing bubbles may be discharged.
[0020]
【The invention's effect】
The present invention removes the syringe to be used next time from the refrigerator during the application of the bond to the substrate, applies a gas pressure to the bond in the syringe, and discharges the bond containing bubbles in advance to the holder. If the held syringe bond is out of stock and the syringe is replaced, the application of the bond to the substrate can be immediately restarted with the replaced syringe.
[Brief description of the drawings]
FIG. 1 is a perspective view of a bonding apparatus for bonding an electronic component according to an embodiment of the present invention. FIG. 2 is a sectional view of a standby stage of the bonding apparatus for bonding an electronic component according to an embodiment of the present invention. Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Moving table 5 Holder 6 Syringe 8 1st pressurizing means 9 Nozzle 10 Bond 11 Board | substrate 12 Positioning part 14 Mounting part 16 Connection part 18 2nd pressurizing means

Claims (1)

A positioning part of the substrate, a moving table for horizontally moving the syringe held by the holder relative to the substrate, and a lower portion of the syringe by applying a gas pressure to the bond stored in the syringe held by the holder A first pressurizing means for discharging the bond from the nozzle and a mounting part for removing the syringe to be used next time from the refrigerator and mounting it to normal temperature, and the bond in the syringe held in the boulder When the product is out of stock, remove the syringe from this mounting part and hold it in the holder to restart the bond application work, and apply gas pressure to the bond in the syringe that will be used next time. And a second pressurizing means for discharging a bond containing bubbles from the nozzle.

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