JP3134678B2 - Bond application method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to a ball <br/> command coating method for applying a bond for tacking the chip to the predetermined coordinate position of the substrate.

[0002]

2. Description of the Related Art A bond applying apparatus applies a bond to a predetermined coordinate position of a substrate positioned at a positioning section while horizontally moving an application head having a syringe in which bonds are stored by a movable table section. ing. A nozzle is mounted on the coating head, and by applying gas pressure to the bond in the syringe, the bond is discharged from the nozzle and coated on the substrate.

The bond is a highly viscous fluid, and the inside of the nozzle is gradually clogged with the bond while the bond is repeatedly discharged from the nozzle, and the amount of the bond applied gradually decreases. Therefore, conventionally, the nozzle was manually removed from the coating head as needed, and a new nozzle was attached to the coating head.
The bond application with the new nozzle was restarted, and the removed nozzle was manually cleaned.

[0004]

However, in the above-mentioned conventional means, a great deal of labor is required for cleaning the nozzle and the like, so that there is a problem that the working efficiency is not improved and the labor burden on the worker is large. there were.

[0005] The present invention aims at providing an automatic <br/> performed Rubo command coating method to clean the nozzle.

[0006]

SUMMARY OF THE INVENTION According to the present invention, a positioning unit
Drive the movable table unit above the positioned substrate
While moving the coating head,
Bond coating that discharges the bond and applies it to the substrate
A method, comprising: positioning the coating head on a side of the positioning unit.
By moving the nozzle above the nozzle cleaning section
The nozzle mounted on the cloth head is stored in this nozzle cleaning section.
Removed and immersed in the cleaning solution
Cleaning nozzle by vibrating the cleaning liquid with vibration means
And a cleaned nozzle is attached to the coating head.
Then, move this coating head above the bond discharge section,
Therefore, a bond mixed with the cleaning liquid is discharged from the nozzle.
To remove the cleaning liquid attached to the inside of the nozzle.
After the nozzle has been removed,
This is a bond application method characterized by resuming the bond application .

[0007]

[0008]

According to the above construction, the coating head is moved above the nozzle cleaning section, the nozzle is removed from the coating head, immersed in the cleaning liquid stored in the container, and the cleaning liquid is vibrated to clean the nozzle. Can be done automatically.

Further, a nozzle newly attached to the coating head is moved to a position above the bond discharge section, and a bond mixed with a cleaning liquid is discharged from the nozzle there. Thus, the bond application to the substrate can be resumed.

[0010]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a bond coating apparatus according to one embodiment of the present invention, FIG. 2 is a front view of the essential part, and FIGS. 3 and 4 are explanatory views of the nozzle attaching / detaching method. In FIG. 1, reference numeral A denotes an application head, and a cylindrical syringe 1 having a bond stored therein is mounted on an upper portion thereof. Further, a nozzle 2 is detachably mounted at a lower portion thereof. A tube 3 is connected to an upper portion of the syringe 1. When a gas pressure is applied to a bond in the syringe 1 through the tube 3 from a compressor (not shown), a bond 10 is discharged from a lower end portion of the nozzle 2.

The coating head A is supported by an arm 4, and the arm 4 is supported by a box 5. The box 5 is provided on a movable table 6. Therefore, when the movable table unit 6 is driven, the coating head A
It moves horizontally in the direction and the Y direction, and moves up and down. Reference numeral 7 denotes a clamper, which positions the substrate 8 by clamping it from the left and right. The coating head A horizontally moves above the substrate 8 and applies the bond 10 to a predetermined coordinate position on the substrate 8.

A base 11 is provided on the side of the clamper 7, and a nozzle cleaning unit 12 and a box-shaped bond discharge unit 13 are provided on the base 11. In FIG. 2, the nozzle cleaning section 12 is mainly composed of a container 14, and a cleaning liquid 15 is stored in the inside thereof. A nozzle support 16 for supporting the nozzle 2 is provided inside the container 14. When the coating head A moves above the container 14 and moves downward there, the nozzle 2 is disengaged from the coating head A and is supported on the nozzle support 16. The nozzle 2 on the nozzle support 16 is immersed in the cleaning liquid 15, and when the vibration unit 17 provided at the bottom of the container 12 is driven, the cleaning liquid 15 vibrates and cleans the nozzle 2. The nozzle 2 is a thin tube and has a bond adhered to the inside thereof. When the nozzle 2 is immersed in the cleaning liquid 15 and the cleaning liquid 15 is vibrated, the bond inside the nozzle 2 is removed. As the vibration, ultrasonic vibration has a large cleaning effect.

FIG. 3 and FIG.
2 shows a specific method for attaching and detaching to and from a computer. Reference numeral 21 denotes an inner tube provided below the coating head A, and reference numeral 22 denotes an outer tube mounted on the inner tube 21. A spring 23 is interposed between the inner tube 21 and the outer tube 22, and the outer tube 22 is repelled downward by the spring force. A bearing 24 is disposed below the inner tube 21, and a tapered surface 25 formed on the lower inner surface of the outer tube 22 is pressed against the bearing 24. A concave portion 26 is formed in the upper part of the nozzle 2, and the nozzle 2 is held by fitting the bearing 24 into the concave portion 26. Reference numeral 27 denotes a stopper for defining the upper limit of the outer tube 22. In FIG. 1, a cylinder 30 is mounted on a side surface of the container 14. Cylinder 30
Has two parallel bars 31. When the cylinder 30 is activated, the bar 31 projects into and out of the container 14.

As shown in FIG. 3, the coating head A is
When the outer tube 22 moves above the bar 31 projecting into the inside 4 and descends there, the outer tube 22 lands on the bar 31 and is pushed up against the spring force of the spring 23 as shown in FIG. Then, the bearing 24 moves to the side by the weight of the nozzle 2 and escapes from the concave portion 26. Then, the nozzle 1 falls on the nozzle support 16. When the nozzle 2 is removed in this manner, the application head A moves up. Then, the outer tube 22 is pushed down by the spring force of the spring 23 and returns to the original position.

Subsequently, the syringe 1 from which the nozzle 2 has been removed moves above the other cleaned nozzle 2 on the nozzle support 16. At this time, the bar 31 of the cylinder 30 has been drawn from the container 14. Then, when the coating head A descends, the concave portion 26 of the nozzle 2 is fitted to the bearing 24 and is mounted on the coating head A. The coating head A on which the new nozzle 2 is mounted in this way restarts the bond coating operation on the substrate 8. A plurality of nozzles 2 having the same shape may be used, but a plurality of nozzles 2 having different shapes are prepared, and a nozzle which is most suitable for an electronic component temporarily fixed to a substrate is exchanged for bonding. You may make it apply.

This bond coating apparatus is configured as described above, and the overall operation will be described next. In FIG.
When the movable table 6 is driven, the coating head A
Moves above the substrate 8 in the X direction or the Y direction, and applies a bond 10 to a predetermined coordinate position of the substrate 8. While the bond 10 is repeatedly applied, the inside of the nozzle 2 is gradually clogged with the bond 10, and the amount of the applied bond gradually decreases. Therefore, replacement and cleaning of the nozzle 2 are performed as follows.

The movable table 6 is driven to apply the coating head A
Is moved above the container 14 of the nozzle cleaning unit 12. Then, the application head A is moved up and down, and the nozzle 2 is removed from the nozzle support 16. Subsequently, the syringe 1 moves above the cleaned nozzle 2 on the nozzle support 16,
Therefore, a new nozzle 2 is mounted by performing the vertical operation again. The new nozzle 2 is immersed in the cleaning liquid 15 and cleaned, so that the cleaning liquid 1 is contained therein.
5 is attached. When the bond application to the substrate 8 is resumed by the nozzle 2 as it is, there is a disadvantage that the bond 10 mixed with the cleaning liquid 15 is applied to the substrate 8. Therefore, when a new nozzle 2 is mounted on the coating head A, the coating head A is moved above the bond discharge unit 13, and the gas pressure is applied to the bond 10 in the coating head A therefrom. The bond 10 is discharged to the bond discharge unit 13. The bond 10 is a mixture of the cleaning liquid 15 as described above. It is desirable that the bond 10 is sufficiently discharged to the bond discharge unit 13 and the cleaning liquid 15 is completely discharged.

Next, the coating head A moves above the substrate 8, and resumes the bond coating on the substrate 8. On the other hand, the nozzle 2 removed on the nozzle support 16 as described above
Is cleaned by driving the vibration unit 17 to vibrate the cleaning liquid 15. The nozzle 2 that has been cleaned waits for the application head A to arrive again for nozzle cleaning.

[0019]

As described above, according to the present invention, the nozzle can be cleaned automatically. In addition, by moving the nozzle newly attached to the coating head above the bond discharge section, and discharging the bond from the nozzle there,
After discharging the cleaning liquid attached to the inside of the nozzle together with the bond, the application of the bond to the substrate can be resumed.
Further, according to the present invention, since a plurality of types of nozzles having different shapes can be used, it is possible to apply a bond to a substrate while exchanging a nozzle most suitable for an electronic component to be temporarily fixed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a bond coating apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of a main part of a bond coating apparatus according to an embodiment of the present invention.

FIG. 3 is an explanatory view of a nozzle attaching / detaching method of the bond coating apparatus according to one embodiment of the present invention.

FIG. 4 is an explanatory diagram of a nozzle attaching / detaching method of the bond applying apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 A coating head 1 syringe 2 nozzle 6 movable table section 7 clamper (substrate positioning section) 8 substrate 10 bond 12 nozzle cleaning section 13 bond discharge section 15 cleaning liquid 17 vibrating section

Claims (1)

(57) [Claims] 1. A bond coating method in which a bond is ejected from a nozzle of a coating head and applied to the substrate while moving a coating table by driving a movable table unit above a substrate positioned by a positioning unit. Then, the coating head is moved above the nozzle cleaning section provided on the side of the positioning section, and the nozzle mounted on the coating head is removed and immersed in the cleaning liquid stored in the nozzle cleaning section. In this state, the nozzle is cleaned by vibrating the cleaning liquid by vibrating means, and the cleaned nozzle is mounted on the coating head, and then the coating head is moved above the bond discharge unit. After discharging the bond mixed with the cleaning liquid from the nozzle to remove the cleaning liquid attached to the inside of the nozzle, the nozzle is applied to the substrate by the nozzle. Bond coating method which is characterized in that to resume the bond coating that.