JP3000720B2 - Bond application equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bond applying apparatus,
After the operation of applying the bond to the substrate is completed, the nozzle is cleaned with a cleaning liquid to prevent the nozzle from being clogged with the bond.

[0002]

2. Description of the Related Art In a process of mounting an electronic component such as an IC or an LSI on a substrate, a bond is applied to a predetermined position of the substrate in a spot by a bond coating device.
The bonding of electronic components is performed.

[0003] Such a bond applicator is constructed by connecting a nozzle to a syringe for storing a bond and mounting this syringe on a moving table, and driving the moving table to move the syringe. The bond is dropped from the nozzle to a predetermined position on the substrate.

[0004]

After one day's work, a bond remains inside the syringe or nozzle, but the viscosity of the bond gradually increases with time.
For this reason, conventionally, when one day's work is completed and the next day's work is resumed, the bond remaining in the nozzle is considerably solidified. There was a problem that the quantity was easily insufficient.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and to provide means for smoothly discharging a bond from a nozzle when resuming a bond application operation after a long operation halt. Aim.

[0006]

In order to achieve this, the present invention provides a cleaning liquid storage container mounted on a moving table in place of a syringe storing bonds, and applying a pressure to the cleaning liquid in the container. A collection container for collecting the cleaning liquid discharged from the nozzle.

[0007]

In the above construction, when one day's work is completed, the cleaning liquid storage container is mounted on the moving table in place of the bond storage container. Then, when the container is moved above the collection container and the pressure is applied to the container, the cleaning liquid is discharged from the nozzle, and the bond remaining inside the nozzle is cleaned and removed.

[0008]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an overall perspective view of a bond coating apparatus. Reference numeral 1 denotes a substrate, which is positioned on a positioning portion 2 formed of a clamp member. Reference numeral 3 denotes a conveyor for transporting the substrate 1.

Reference numeral 4 denotes an XY table as a moving table, and a container 5 (see FIG. 2) in which a cleaning liquid 10 is stored,
A syringe 21 (see FIG. 3) in which the bond 20 is stored is mounted. 9 is a mounting tool. The container 5 and the syringe 21 have the same shape and the same size, and are interchangeably attached to the attachment 9.

A nozzle portion 6 is detachably connected to the container 5 and the syringe 21. When a pressure is applied through the pressure generating means 7 and the tube 8, the cleaning liquid 10 and the bond 20 are discharged from the nozzle 6 a of the nozzle portion 6. Discharged.

A stage 11 is provided in the vicinity of the positioning section 2. The stage 11 is provided with a recovery container 12 for the cleaning liquid 10 and a bond detecting means including a light emitting section 13 and a light receiving section 14. The light emitting unit 13 and the light receiving unit 1
4 is disposed so as to sandwich the collection container 12. Fifteen
Numeral denotes a bond throw-off table provided on the side of the positioning unit 2. The present apparatus has the above configuration, and the operation will be described next.

The syringe 21 is mounted on the mounting tool 9, the XY table 4 is driven, and while the syringe 21 is moved in the X and Y directions, a pressure is applied to the bond 20 in the syringe 21 to move the syringe 21 to a predetermined position on the substrate 1. The bond 20 is applied in a spot manner. An electronic component is bonded on this bond in a later step.

When the one-day coating operation is completed, the container 5 is mounted on the XY table 4 in place of the syringe 21. Then, the container 5 is moved to a position immediately above the collection container 12, and a pressure is applied to the cleaning liquid 10 in the container 5. Then, as shown in FIG. 2, the cleaning liquid 10 is discharged from the nozzle 6a to the collection container 12, and the bond 20 remaining inside the nozzle 6a is cleaned and removed. By cleaning the nozzle 6a in this manner, it is possible to prevent the bond 20 remaining inside the nozzle 6a from solidifying and clogging the nozzle 6a.

When resuming the bonding operation, the syringe 21 is mounted in place of the container 5. Then, as shown in FIG. 3, the syringe 21 is moved onto the stage 11, and the lower end of the nozzle 6a is positioned between the light emitting unit 13 and the light receiving unit 14.

At the same time, when a pressure is applied to the bond 20 in the syringe 21, the bond 20 gradually flows down the nozzle section 6 and is discharged from the lower end of the nozzle 6 a after a while. When the dropped bond 20a is detected by the light emitting unit 13 and the light receiving unit 14, the syringe 21 is moved to the discarding table 15 and the bond 20a is discarded and struck on the table 15. It is moved upward, and the operation of applying the bond to the substrate 1 is restarted.

As described above, it is confirmed by the light emitting section 13 and the light receiving section 14 that the application of the bond in the syringe 21 is enabled. In this case, the nozzle 6a is cleaned as described above. Therefore, the bond 20 flows down smoothly in the nozzle 6a and drops out.

In general, the discharge amount of the first-shot bond 20a discharged from the nozzle 6a is likely to be excessive. Therefore, the first-shot bond 20a is discarded on the table 15 and is discharged. Can be coated with an appropriate amount of bond. Of course, this discarding may be performed several times. When the bond is applied to the substrate 1, the nozzle 6a is cleaned.
The discharge property of the bond is extremely good, and an appropriate amount of the bond can be applied.

[0019]

As described above, the present invention provides a cleaning liquid storage container mounted on a moving table in place of a syringe storing a bond, and applying a pressure to the cleaning liquid in the container so that the nozzle can be moved from the nozzle. Since the recovery container for recovering the discharged cleaning liquid is provided, it is possible to apply the bond to the substrate while smoothly discharging the bond remaining in the nozzle.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of a bond coating apparatus according to the present invention.

FIG. 2 is a front view during cleaning according to the present invention.

FIG. 3 is a front view during detection of a bond according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 4 Moving table 5 Container of cleaning liquid 6 Nozzle 10 Cleaning liquid 12 Collection container 20 Bond 21 Syringe

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B05C 5/00-5/02 B05B 15/02 B05K 3/34 504

Claims (1)

(57) [Claims] 1. A syringe in which bonds are stored is mounted on a moving table, and while the moving table is driven to move the syringe, air pressure is applied to the syringe, and the syringe is detachably connected to a lower portion of the syringe. From the nozzle
In a bond applicator configured to drop a bond on a substrate, a cleaning liquid storage container mounted on the moving table in place of the syringe and a pressure applied to the cleaning liquid in the container are discharged from the nozzle. A bond coating device, comprising: a collection container for collecting a cleaning liquid.