JPH0578393B2 - - Google Patents
Info
- Publication number
- JPH0578393B2 JPH0578393B2 JP60198280A JP19828085A JPH0578393B2 JP H0578393 B2 JPH0578393 B2 JP H0578393B2 JP 60198280 A JP60198280 A JP 60198280A JP 19828085 A JP19828085 A JP 19828085A JP H0578393 B2 JPH0578393 B2 JP H0578393B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- leadless
- workpiece
- conveyor belt
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011248 coating agent Substances 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 25
- 239000003973 paint Substances 0.000 claims description 12
- 229910052573 porcelain Inorganic materials 0.000 description 7
- 239000011253 protective coating Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Coating Apparatus (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60198280A JPS6257670A (ja) | 1985-09-06 | 1985-09-06 | リードレス型電子部品の塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60198280A JPS6257670A (ja) | 1985-09-06 | 1985-09-06 | リードレス型電子部品の塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6257670A JPS6257670A (ja) | 1987-03-13 |
JPH0578393B2 true JPH0578393B2 (fr) | 1993-10-28 |
Family
ID=16388498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60198280A Granted JPS6257670A (ja) | 1985-09-06 | 1985-09-06 | リードレス型電子部品の塗布装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6257670A (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0614811Y2 (ja) * | 1988-01-13 | 1994-04-20 | ローム株式会社 | 円柱状電子部品の塗装装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4838517U (fr) * | 1971-09-09 | 1973-05-12 | ||
JPS5110257A (ja) * | 1974-07-15 | 1976-01-27 | Hitachi Ltd | Juseihagurumasochino kuratsuchikirikaekiko |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6025853Y2 (ja) * | 1977-09-06 | 1985-08-03 | 日東工業株式会社 | 電子部品のカラ−コ−テング装置 |
-
1985
- 1985-09-06 JP JP60198280A patent/JPS6257670A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4838517U (fr) * | 1971-09-09 | 1973-05-12 | ||
JPS5110257A (ja) * | 1974-07-15 | 1976-01-27 | Hitachi Ltd | Juseihagurumasochino kuratsuchikirikaekiko |
Also Published As
Publication number | Publication date |
---|---|
JPS6257670A (ja) | 1987-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0578393B2 (fr) | ||
US2778305A (en) | Device for marking tubular articles | |
EP0376207A3 (fr) | Dispositif applicateur | |
JPH0422834Y2 (fr) | ||
JPS5944576B2 (ja) | 円錐コロ軸受の組立幅測定装置 | |
JPH085039Y2 (ja) | 短冊状割溝付基板の分割装置 | |
JPS6039100Y2 (ja) | ロ−ラ軸のプライマ−塗布装置 | |
JP4197536B1 (ja) | クランプ用棒冶具 | |
JPH031800Y2 (fr) | ||
JPH01119368A (ja) | 液体物質連続塗布装置 | |
JPH0510951Y2 (fr) | ||
JP2679230B2 (ja) | 電子部品の塗装方法及び塗装装置 | |
JP3000786U (ja) | 円筒状用塗布器具 | |
JPS61155728A (ja) | 初期粘着力測定装置 | |
JPS6227869Y2 (fr) | ||
JPH0938961A (ja) | 基板切断装置 | |
JP2772676B2 (ja) | 円筒体の塗布装置 | |
JPS58103771A (ja) | アルカリ電池用封口板へのシ−ル材塗布方法及び装置 | |
JPH07308614A (ja) | 光学素子用塗料の塗布装置と塗布方法 | |
JPH0679462U (ja) | 回転粘着クリーナー保持具 | |
JPH0671629B2 (ja) | ロール成形装置 | |
JPH064231B2 (ja) | 回転軸の回転限界位置検出機構 | |
JPH0451307B2 (fr) | ||
JPH058890A (ja) | 紙送り装置 | |
JPS61181306U (fr) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |