JPH0576555B2 - - Google Patents

Info

Publication number
JPH0576555B2
JPH0576555B2 JP28900385A JP28900385A JPH0576555B2 JP H0576555 B2 JPH0576555 B2 JP H0576555B2 JP 28900385 A JP28900385 A JP 28900385A JP 28900385 A JP28900385 A JP 28900385A JP H0576555 B2 JPH0576555 B2 JP H0576555B2
Authority
JP
Japan
Prior art keywords
tin
plating
surface treatment
metal
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28900385A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6263692A (ja
Inventor
Hiroki Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd filed Critical Uemera Kogyo Co Ltd
Publication of JPS6263692A publication Critical patent/JPS6263692A/ja
Publication of JPH0576555B2 publication Critical patent/JPH0576555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Chemically Coating (AREA)
JP28900385A 1985-05-10 1985-12-20 表面処理液中の4価の錫イオンの除去方法 Granted JPS6263692A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-99374 1985-05-10
JP9937485 1985-05-10

Publications (2)

Publication Number Publication Date
JPS6263692A JPS6263692A (ja) 1987-03-20
JPH0576555B2 true JPH0576555B2 (enrdf_load_stackoverflow) 1993-10-22

Family

ID=14245756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28900385A Granted JPS6263692A (ja) 1985-05-10 1985-12-20 表面処理液中の4価の錫イオンの除去方法

Country Status (1)

Country Link
JP (1) JPS6263692A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4580085B2 (ja) * 2000-10-26 2010-11-10 メック株式会社 金属スズまたはスズ合金をエッチングする方法ならびに金属スズまたはスズ合金のエッチング液
JP4143385B2 (ja) * 2002-03-05 2008-09-03 株式会社大和化成研究所 無電解めっきの触媒付与のための前処理液、該液を使用する前処理方法、該方法を使用して製造した無電解めっき皮膜及び(又は)めっき被覆体
CN119384526A (zh) * 2022-11-28 2025-01-28 株式会社村田制作所 镀覆组合物的再生方法和再生装置
CN116288292A (zh) * 2023-03-20 2023-06-23 聂柱根 一种化学锡药水锡还原再生除铜装置

Also Published As

Publication number Publication date
JPS6263692A (ja) 1987-03-20

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