JPH0576075U - Printed wiring board - Google Patents

Abstract

(57) [Summary] [Purpose] To reduce the weight and size of products. (EN) Provided is a printed wiring board on which electronic parts can be easily mounted and which can manufacture a highly reliable product. [Structure] The electronic component 2 main body is housed in the insertion hole 12 of the printed wiring board 1. At this time, the connecting portion 21 of the electronic component 2 is placed on the placing portion 13 formed on the surface of the substrate around the insertion hole 12. An electrode of the conductive pattern 11 is formed on the mounting portion 13, and the connection portion 21 and the electrode are aligned by inserting the electronic component 2 into the insertion hole 12. After that, the electrodes of the pattern 11 and the connecting portions 21 are connected by soldering or the like. At this time, since the electronic component may be inserted into the insertion hole, alignment is very easy, connection work such as soldering is facilitated, and reliable connection can be achieved. In addition, the obtained product is thin and lightweight because it is reliable and the main body of the electronic component is contained in the substrate.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a printed wiring board for mounting electronic parts, and more particularly to a printed wiring board with improved assembly workability and product reliability.

[0002]

[Prior Art]

 Conventionally, a printed wiring board has a conductive wiring pattern formed on one side or both sides of a dielectric substrate 100 made of epoxy resin, phenol resin, or the like. In a single-sided printed wiring board, one side having a conductive pattern is formed. On a double-sided printed wiring board, electronic parts 101 such as chip capacitors, chip resistors, transistors, and chip coils are mounted on both sides, and the terminals of electronic parts are electrically connected to a conductive pattern by a soldering method such as flow or reflow. Connected to each other.

[0003]

[Problems to be solved by the device]

 By the way, in such a conventional printed wiring board, the electronic component 101 is mounted on the surface of the printed wiring board 100 as described above regardless of whether it is single-sided or double-sided. However, there was a problem that the product was limited and the product was enlarged. Further, in such a conventional printed wiring board, when connecting the terminals of the chip component by soldering or the like, it is difficult to align and fix the terminals of the chip component with the pads formed on the printed wiring board, which makes the work difficult. There was a problem of poor sex.

It is an object of the present invention to provide a printed wiring board that solves the above-mentioned conventional problems and can reduce the weight and size of a product. Another object of the present invention is to provide a printed wiring board on which electronic components can be easily mounted and which can be manufactured with high reliability.

[0005]

Means for Solving the Problems A printed wiring board according to the present invention that achieves such an object is a part of a dielectric substrate on which a predetermined wiring pattern is provided, on which a component is mounted, and a connection portion with the wiring pattern is formed on the surface. A printed wiring board having an electronic component having an insertion hole for accommodating the electronic component, and a connecting portion for the electronic component on one surface of the dielectric substrate surface around the insertion hole. It is provided with a placing part to be placed.

[0006]

[Action]

 The electronic component body is placed in the insertion hole of the dielectric wiring board so that the connection portion of the electronic component is mounted on the mounting portion provided around the insertion hole of the dielectric substrate. Then, the connection part of the electronic component is connected to the electrode of the wiring pattern formed on the dielectric substrate. At this time, since the electronic parts need only be put in the insertion holes, the alignment is very easy, and the connection work such as soldering is facilitated and the reliable connection can be achieved. Moreover, the obtained product is thin and lightweight because the main body of the electronic component is contained in the substrate, which is reliable.

[0007]

【Example】

 Hereinafter, an embodiment of the printed wiring board of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, the printed wiring board 1 of the present invention has a dielectric substrate made of epoxy resin, phenol resin or the like or a dielectric substrate (hereinafter referred to as a substrate) 10 made of prepreg 10 on one side or both sides of Cu, Al, etc. A predetermined conductive wiring pattern 11 made of the conductive material is formed, and through holes and the like (not shown) are further formed. Further, the printed wiring board 1 is formed with an insertion hole 12 for accommodating an electronic component 2 such as a capacitor, a chip resistor, a transistor and a chip coil. The electronic component 2 has a conductive connecting portion 21 connected to the wiring pattern 11 on the surface thereof, and the connecting portion 21 is formed so as to project to the outside of the main body of the electronic component 2.

On the other hand, the insertion hole 12 has such a shape and size that the main body portion can be accommodated according to the type of the electronic component 2, and the connecting portion 21 of the electronic component 2 is formed on the peripheral surface of the substrate. A mounting portion 13 on which is mounted is formed. Therefore, when the main body of the electronic component 2 is inserted into the insertion hole 12, the connecting portion 21 does not enter the insertion hole 12 and is placed on the placing portion 13. An electrode portion 11a of the conductive pattern 11 connected to the connection portion 21 of the electronic component 2 is formed on the mounting portion 13, and after the electronic component 2 is housed in the insertion hole 12, the connection portion 21 and the electrode portion 11a is electrically connected by soldering. When conductive patterns are formed on both sides, the mounting portion 13 is formed on any surface of the substrate 10 around the insertion hole 12, and the electronic component 2 is mounted on the side where the mounting portion 13 is formed. The surface is inserted into the insertion hole 12.

Next, a method of manufacturing the printed wiring board 1 of the present invention by the subtrust method will be described. As shown in FIG. 2, first, a plastic substrate or a dielectric substrate 3 made of prepreg to which an adhesive has been applied is formed on a dielectric substrate 3 by a processing method such as press working or NC router processing. A plurality of insertion holes 31 are formed (a). Then, the filler 4 which is soluble in water or a solvent such as an organic solvent is embedded in the insertion hole 31 (b). In this way, the copper foil 5 is adhered to one side or both sides of the substrate 3 in which the filler 4 is embedded (c) and a pattern is formed by a pattern forming technique such as a printing method or a photographic method. If necessary, an NC drill is used to drill holes for through-hole plating wiring. After that, the substrate 3 is immersed in a solvent that dissolves the filler 4 to remove the filler 4 and form an insertion hole for an electronic component (d). If necessary, solder resist printing, gold plating, solder plating, etc. are performed to obtain the printed wiring board 1.

Although the sub-trust method has been described above, it goes without saying that the printed wiring board of the present invention can be manufactured by other manufacturing methods such as the additive method and the semi-additive method. When the electronic component 2 is mounted on the printed wiring board 1 configured as described above, the main body of the electronic component 2 is inserted into the insertion hole 12 of the printed wiring board 1 and is formed on the connecting portion 21 and the mounting portion 13 on which the electronic component 2 is mounted. Since it is sufficient to solder the formed electrode portion 11a by flow or reflow, the work for mounting is extremely easy. Also, in the obtained product, the weight of the printed wiring board 1 itself is light and the thickness of the electronic component 2 is almost entirely accommodated in the printed wiring board 1. Therefore, in the case of single-sided mounting or double-sided mounting. In the case of, the thickness of the wiring board is almost the same as that of the wiring board, which is especially effective for mounted products that are required to be light and thin.

[0011]

[Effect of the device]

 As is clear from the above examples, according to the printed wiring board of the present invention, the electronic component is not mounted on the surface thereof, but the insertion hole is provided and the connecting portion of the electronic component is provided on the peripheral surface of the substrate. Since the mounting part for mounting is provided, the connection part and the electrode part of the wiring pattern can be aligned simply by inserting the electronic component into the insertion hole, and the electronic component and the pattern can be aligned and soldered during mounting work. Can be easy. Further, according to the printed wiring board of the present invention, the board is made lighter by the amount of the insertion hole, and most of the thickness of the electronic component is in the insertion hole, so that a thin and lightweight mounted product can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a printed wiring board of the present invention.

FIG. 2 is a diagram showing an embodiment of a method for manufacturing a printed wiring board according to the present invention.

FIG. 3 is a diagram showing a conventional printed wiring board.

[Explanation of symbols]

 1 ··· Printed wiring board 2 ·· Electronic parts 3, 10 ··· Dielectric substrate 11 ··· Conductive pattern 12, 31 ··· Insertion Hole 13: Mounting part 21: Connection part

Claims (1)

[Scope of utility model registration request] 1. A printed wiring board comprising an electronic component having a connection portion with the wiring pattern on the surface of a component mounting surface of a dielectric substrate provided with a predetermined wiring pattern. A printed wiring having an insertion hole for accommodating a component, and a mounting portion on which a connection portion of the electronic component is mounted is provided on one surface of the dielectric substrate surface around the insertion hole. Board.