JPH0575235A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To improve adhesion of a dry film by heating a photosensitive dry film immediately before laminated on a substrate by a heating role and by heating the substrate wherein the dry film is laminated after the lamination by the same heating roll. CONSTITUTION:A dry film with a protecting film is supplied from a photosensitive dry film roll 1, heated by a heating roll 2 and sent out by the heating roll 2 and a film keeping roll 4, and the protecting film is wound by a protecting film winding roll 5 and the film is laminated on a substrate by a laminate roll 7. The laminated substrate is sent by a feed roll and heated again by the heating roll 2. According to the device, circuit defect which has supposedly caused by lowering of adhesion is reduced to about 1/10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board.

[0002]

2. Description of the Related Art A printed wiring board is a method of laminating a photosensitive dry film on a copper-clad laminate and forming a circuit by baking, developing and etching, or laminating a photosensitive dry film on an insulating board and baking. A method of forming a circuit by development and electroless plating is known,
Usually, such a dry film is provided with a protective film on the adhesive surface, and is laminated on a substrate while applying heat and winding the protective film.

As shown in FIG. 2, an apparatus for laminating such a photosensitive dry film comprises a laminating roll 7, a photosensitive dry film roll 1, a protective film winding roll 5, and a conveying roll 3. ..

The laminating roll 7 is usually a metal roll made of stainless steel or the like coated with heat-resistant rubber or the like, and a heating element such as a heater is incorporated in the metal roll. And, it is arranged in a pair up and down,
The structure is such that pressure is applied to the substrate from both sides to bring the photosensitive dry film into close contact with the substrate.

Usually, the substrate is pre-heated by degreasing, surface conditioning, etc., and then pre-heated by an infrared heater or the like, and a dry film is laminated by the laminating device.

[0006]

In such a conventional method, since the substrate is preheated before laminating the photosensitive dry film, the copper on the surface of the substrate is oxidized or dust or the like adheres during the preheating. However, there is a problem that the dry film does not adhere.

It is an object of the present invention to provide a method for manufacturing a printed wiring board having excellent dry film adhesion.

[0007]

The method for manufacturing a printed wiring board of the present invention is such that a photosensitive dry film is laminated on a substrate in a step of continuously laminating a photosensitive dry film simultaneously on the front and back sides of the substrate of the printed wiring board. The photosensitive dry film just before is heated with a heating roll,
Further, after laminating, the substrate on which the dry film is laminated is heated by the same heating roll.

The inventors of the present invention have made earnest studies and found that the adhesion of the dry film can be enhanced by heating the dry film before laminating and then heating it after laminating it on the substrate. Came to do.

[0009]

FIG. 1 shows an embodiment of the present invention. A dry film with a protective film is supplied from a photosensitive dry film roll 1, heated by a heating roll 2, sent out by the heating roll 2 and a film pressing roll 4, and the protective film is wound up by a protective film winding roll 5. Then, it is laminated on the substrate by the laminating roll 7. The laminated substrate is sent by a feed roll and heated again by the heating roll 2. With this device, the number of circuit defects, which are considered to be caused by the decrease in adhesion, was reduced to about 1/10.

[0010]

As described above, according to the present invention, it is possible to provide a method for manufacturing a wiring board having excellent dry film adhesion.

[Brief description of drawings]

FIG. 1 is a side view showing a main part of an apparatus used in an embodiment of the present invention.

FIG. 2 is a side view showing a main part of an apparatus used in a conventional example.

[Explanation of symbols]

1. Photosensitive dry film roll 2. Heating roll 3. Transport roll 4. Film press roll 5. Protective film take-up roll 6. Film support roll 7. Laminating roll 8. Substrate 9. Photosensitive dry film

Claims (1)

[Claims] 1. In a step of continuously laminating a photosensitive dry film on the front and back sides of a substrate of a printed wiring board by a pair of laminating rolls, the photosensitive dry film immediately before being laminated on the substrate is heated by a heating roll,
Furthermore, after laminating, the substrate laminated with the dry film is heated by the same heating roll, and a method for manufacturing a printed wiring board.