JP2002210823A - Laminating method and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminating method capable of realizing good lamination by reducing the air bubble sump generated between a film and a base material by simple constitution in a process for laminating the film on the base material, and a laminating apparatus used in the laminating method. SOLUTION: At first, an upper film 5 and a lower film 7 are superposed on the base material 10 to be pressed under heating by a first heating roll 9 in a vacuum tank 4 held to a reduced pressure atmosphere and, subsequently, the upper and lower films 5 and 7 are pressed under heating in an atmospheric pressure atmosphere.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminating method for laminating a film on a substrate, and a laminating apparatus used for the laminating method. The present invention relates to a laminating method for laminating a resist film and the like, and a laminating apparatus used for the laminating method.

[0002]

2. Description of the Related Art Conventionally, during a manufacturing process of a wiring circuit board such as a flexible wiring circuit board or a suspension board with a circuit, for example, a metal support layer made of a stainless steel foil or the like, an insulating layer made of a polyimide film or the like,
Or, when a conductor layer or the like made of copper foil or the like, on a variety of substrates that are laminated as a single layer or multilayer, when forming a conductor circuit pattern by plating, or when forming a predetermined pattern by etching, By laminating a dry film resist such as a plating resist or an etching resist on a substrate, and processing the laminated dry film resist into a predetermined pattern so as to cover other parts that are not plated or etched. After that, the dry film resist is used as a resist for plating or etching the base material.

In the step of laminating such a dry film resist on a substrate, bubbles may be formed between the laminated dry film resist and the substrate, resulting in a pattern shape defect.

[0004] Therefore, as a method of laminating a dry film resist on a base material so as not to generate such air bubble accumulation, conventionally, for example, a vacuum laminator provided with a heat roll is used to heat the film under a reduced pressure atmosphere. Method of pressing while heating by roll,
For example, using a multi-stage laminator with a plurality of heat rolls, under normal pressure atmosphere, by a plurality of heat rolls, in multiple stages, a method of pressing while heating, for example, after laminating a dry film resist on a substrate, A method has been proposed in which an autoclave is used to hold the device under a high-temperature and high-pressure atmosphere for a certain period of time.

[0005]

However, in a method using a vacuum laminator provided with a heat roll, the occurrence of air bubbles can be reduced, but large air bubbles may be generated depending on the pattern. Further, in the method using the multi-stage laminator, the bubble accumulation is certainly reduced in the second stage than in the first stage, but the effect is small.
Further, in the method using an autoclave, the accumulation of bubbles can be considerably reduced, but the processing takes time and the amount that can be processed at one time is small.

On the other hand, in recent years, the density and miniaturization of printed circuit boards have been advanced, and accordingly, metal support layers,
Substrates made of an insulating layer or a conductor layer are also required to have various specifications.For example, a substrate having a step exceeding tens of μm must be laminated with a dry film resist. In many cases, the dry film resist does not closely adhere to the base material and bubbles are generated in such a step portion. In the above-described method, such bubbles are generated. It is often very difficult to reduce efficiently.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method for laminating a film on a substrate by a simple structure in a step of laminating the film on the substrate. A laminating method, which can realize good lamination by reducing bubble accumulation generated in
Another object of the present invention is to provide a laminating apparatus used for the laminating method.

[0008]

In order to achieve the above object, the present invention is a laminating method for laminating a film on a substrate, comprising: laminating a film on a substrate in a reduced-pressure atmosphere; A first step of pressing while heating, and a second step of pressing or heating the substrate on which the film is stacked in the first step while heating under a normal pressure atmosphere. It is characterized by:

In such a method, in the first step, after the film is overlaid on the substrate under a reduced pressure atmosphere, the film is pressed while being heated, so that air bubbles remain between the film and the substrate. When this occurs, the inside of the bubble reservoir is in a state of pressure reduction. Then, in the second step, if the film is pressed while being heated or heated under a normal pressure atmosphere, the film covering the air bubble pool flows and adheres well to the substrate. Therefore, in this lamination method, even if air bubbles are generated between the film and the substrate, the air bubbles can be efficiently reduced by a simple method, and a good laminate can be realized. Can be.

[0010] The laminating method of the present invention can be suitably applied to a substrate having a step formed on the substrate. In this case, in the first step, the film is formed by removing at least the film. What is necessary is just to overlap on the said step.

When a step is formed on the base material, even when the film is overlaid on the base material and pressed while heating, the film does not adhere well to the base material in a portion where the step is low, Although bubbles may inevitably occur, even in such a case, according to the laminating method of the present invention, in the second step, the film is brought into close contact with the base material to efficiently remove such bubbles. Can be reduced. Therefore, according to the laminating method of the present invention, it is possible to satisfactorily laminate the film on the step portion even if the substrate has a step.

In the laminating method of the present invention, in the first step and the second step, pressing may be performed while heating using a heat roll. The roll may be pressed while being heated, and in the second step, heating may be performed using a warm air heater, an infrared or far-infrared heater.

[0013] The present invention also relates to a laminating apparatus for laminating a film on a substrate, comprising: a decompression tank in which the pressure in the tank is reduced; A first laminating apparatus including a heating and pressing unit for pressing while heating while overlapping, and a heating and pressing unit for pressing while heating the substrate on which the film is stacked by the first laminating device under normal pressure or And a second laminating apparatus having a heating means for heating.

In such a laminating apparatus, first, in the first laminating apparatus, the heating and pressing means presses the film while heating the film on the substrate in the decompression tank in which the pressure in the tank is reduced. When air bubbles accumulate between the substrate and the base material, the inside of the air bubbles is in a state of pressure reduction.
Then, in the second laminating apparatus, the first
The base material on which the film is stacked by the laminating device,
When the heating / pressing unit presses while heating, or when the heating unit heats, the film covering the bubble reservoir flows and adheres well to the substrate. Therefore, in this laminating apparatus, even if air bubbles are generated between the film and the substrate, the air bubbles can be efficiently reduced with a simple configuration, and a good lamination can be realized. Can be.

[0015] In the laminating apparatus of the present invention, the heating and pressing means provided in the first laminating apparatus and the second laminating apparatus may be a heat roll, and the heating and pressing means provided in the first laminating apparatus may be used. The means may be a heat roll, and the heating means provided in the second laminating apparatus may be any one of a warm air heater, an infrared heater, and a far infrared heater.

[0016]

FIG. 1 is a schematic diagram showing one embodiment of a laminating apparatus according to the present invention.

In FIG. 1, this laminating apparatus includes:
A vacuum laminator 1 as a first laminating device;
A second heat roll 2 as a laminating device and a heating and pressing means, and a winding roll 3 for winding a substrate 10 on which the upper film 5 and the lower film 7 are laminated.
Are sequentially provided from the upstream side to the downstream side in the winding direction of the base material 10.

The vacuum laminator 1 has a vacuum tank 4 as a decompression tank, an upper winding roll 6 around which an upper film 5 is wound, and a lower film 7 wound in the vacuum tank 4. A lower winding roll 8 and a first pressing means
And a heat roll 9.

A vacuum pump (not shown) is connected to the vacuum tank 4 so that the pressure in the tank is reduced.
An upstream-side passage port 11 and a downstream-side passage port 12 for passing 0 are formed in the front wall and the rear wall of the main body, respectively. Further, near the upstream side of the upstream side passage opening 11 and near the downstream side of the downstream side passage opening 12, an upstream side vacuum seal roll 13 and a downstream side vacuum seal roll 14 for maintaining the degree of vacuum in the vacuum chamber 4 are provided. Each is provided.

Upper winding roll 6 and lower winding roll 8
Are vertically opposed to each other at a predetermined interval with the base material 10 passing through the vacuum chamber 4 interposed therebetween. An upper film 5 for laminating the upper side of the base material 10 is wound around the upper winding roll 6, and a lower winding roll 8 for laminating the lower side of the base material 10 is laminated on the lower winding roll 8. The lower film 7 is wound.

The first heat rolls 9 are opposed to each other.
It consists of a pair of upper roll 15 and lower roll 16 and is arranged on a straight line connecting the upstream passage port 11 and the downstream passage port 12 in the vacuum chamber 4. The upper roll 15 and the lower roll 16 are heated by a heater (not shown). In the heated state, the base roll 10 is sandwiched, and the base roll 10 is fed while being pressed while being heated. ing.

The upper film 15 is pulled out from the upper winding roll 6 disposed above the upper roll 15, and the lower film 16 disposed below the upper roll 5 is drawn from the lower roll 16. The lower film 7 is pulled out from the winding roll 8. Then, the upper film 5 is pressed by the upper roll 15 in a state where the upper film 5 is overlaid on the upper side of the substrate 10, and the lower film 7 is
It is configured so as to be pressed in a state of being superimposed on the lower side of 0.

The second heat roll 2 comprises a vacuum laminator 1
In contrast, a pair of upper rolls 17 and lower rolls 18 are arranged on the downstream side in the winding direction of the base material 10 and face each other. The upper roll 17 and the lower roll 18 are heated by a heater (not shown),
In the heated state, the substrate 10 on which the upper film 5 and the lower film 7 are laminated is sandwiched, and the substrate 1
It is configured to press while heating while feeding 0.

The winding roll 3 is arranged downstream of the second heat roll 2 in the winding direction of the substrate 10, and the upper film 5 and the lower film 7 are laminated by the vacuum laminator 1. The second heat roll 2 winds the substrate 10 pressed while heating them.

Next, using such a laminating apparatus, the upper film 5 and the lower film 5 are attached to the base material 10 during the manufacturing process of a wiring circuit board such as a flexible wiring circuit board or a suspension board with a circuit. 7
The method of laminating the will be described.

As the substrate 10, a metal supporting layer such as a suspension board made of stainless steel foil or the like, an insulating layer such as an insulating film made of a polyimide film or the like, or a conductor layer such as a metal foil made of a copper foil or the like is used. Various base materials that are laminated as a single layer or multiple layers during the manufacturing process of the printed circuit board are used.

As the upper film 5 and the lower film 7, for example, a plating resist for forming a conductive circuit pattern on the base material 10 by plating,
A dry film resist such as an etching resist for patterning by etching to 0 is used. Such a dry film resist has, for example, a softening point of 80 to 130 ° C., preferably 100 to 115 ° C.
It is formed of a photosensitive hot melt resin having a temperature of ° C., and can be processed into a predetermined pattern by a photolithographic method of exposing and developing in a later step.

As the upper film 5 and the lower film 7, in addition to the dry film resist, for example,
Various films constituting the base material 10 such as an insulating film for forming the base insulating layer 32 and the cover insulating layer 34 described later, and an adhesive film for bonding each layer of the base material 10 may be used.

This method can be particularly preferably applied to the substrate 10 having a step. More specifically, for example, as shown in FIG. 2A, it can be suitably applied in the final step of manufacturing a suspension board with circuit. That is, in FIG. 2A, the base material 10 is a base material in the final step of the suspension board with circuit, and the base insulating layer 32 is formed in a predetermined pattern on the metal support layer 31 and the base insulating layer 32 is formed. A conductor layer 33 is formed as a predetermined conductor circuit pattern on the layer 32, and the conductor layer 33 is covered with a cover insulating layer 34. A large step (for example, a step of 5 μm or more, furthermore, a step of 10 to 50 μm) corresponding to the thickness of the base insulating layer 32, the conductor layer 33 and the cover insulating layer 34 is formed.

In the final step of the suspension board with circuit, as shown in FIG. 2B, after the upper film 5 and the lower film 7 made of dry film resist are laminated on both sides of the substrate 10, FIG.
As shown in FIG. 2C, the upper film 5 and the lower film 7 are processed into a predetermined pattern by a photolithographic method of exposing and developing, and then, as shown in FIG. The metal support layer 31 is etched into a predetermined pattern using the side film 7 as a resist.

First, in this method, as a first step, the inside of the vacuum tank 4 of the vacuum laminator 1 is
After a reduced pressure atmosphere of 0 KPa or less, preferably 1.5 KPa or less, for example, the upper roll 15 heated to about 90 to 130 ° C., preferably about 100 to 110 ° C.
Then, the upper film 5 is pressed while being heated in a state of being superposed on the upper side of the substrate 10, and, similarly, for example, the lower roll 16 heated to about 80 to 120 ° C., preferably about 100 to 110 ° C. Then, the lower film 7 is
The upper film 5 and the lower film 7 are overlaid and laminated on the upper and lower sides of the base material 10 by heating and pressing while being superimposed on the lower side. The pressing force of the first heat roll 9 is, for example, 0.2 to
It is set to be 0.5 MPa.

Further, in the substrate 10 on which the upper film 5 and the lower film 7 are superposed in this manner,
In particular, in the case of the substrate 10 having a large step 36 as shown in FIG. 2A, even if the upper film 5 is pressed onto the substrate 10 while being heated by the first heat roll 9, the step 36 The upper film 5 does not adhere well to the surface of the metal support layer 31 which is the lower part in the vicinity, and FIG.
As shown in FIG.

That is, such a bubble pool 36 is
For example, as shown in FIG. 3A, when the first heat roll 9 rides over the step 36 during lamination, the first heat roll 9 is hardened due to the hardness of the first heat roll 9 and the laminating direction 37 of the upper film 5 with respect to the step 36. As a result, the upper film 5 is not sufficiently filled up to the corners of the step 36, and as a result,
In the vicinity of the step 36, a linear gap 42 along the step 36
Then, as shown in FIG. 3 (b), when the first heat roll 9 rides on the step 36, the upper film 5 is pushed back, and the linear gap is formed by the action of surface tension. It is formed by being round. And the upper film 5 laminated on the step 36 is
Since the upper film 5 is cooled immediately after being sent out from the first heat roll 9, the upper film 5 loses fluidity with the bubble pool 35 in which the inside is in a state of being pulled down, and the upper film 5 covers the bubble pool 35. , A residual stress occurs.

The bubble pool 35 generated in this way is
For example, as shown in FIG. 2C, when the upper film 5 and the lower film 7 are processed into a predetermined pattern to form the etched portion 38 of the metal support layer 31 on the lower film 7, the etched portion When it overlaps 38,
Since the periphery of the etched portion 38 is not covered with the upper film 5, as shown in FIG.
When the metal support layer 31 is etched into a predetermined pattern, the periphery of the etched portion 38 is also etched, resulting in a pattern shape defect.

Further, since such a bubble pool 35 is generated when the first heat roll 9 rides on the step 36 as described above, for example, in the suspension 30 with a circuit as shown in FIG. 37
This is particularly likely to occur in a portion 39 perpendicular to the lamination direction, and hardly occurs in a portion 40 along the laminating direction 37 and a portion 41 inclined with respect to the laminating direction 37.

Next, in this method, as a second step, at normal pressure atmosphere, the upper film 5 and the lower film 7 are heated to a temperature higher than the softening point, for example, about 90 to 130 ° C., preferably about 100 to 110 ° C. The substrate 1 on which the upper film 5 and the lower film 7 are laminated by the upper roll 17 and the lower roll 18 of the heated second heat roll 2
While pressing 0, the base material 10 is pressed while being heated while being fed. The pressing force of the second heat roll 2 is set to be, for example, 0.2 to 0.5 MPa.

As described above, when the upper film 5 and the lower film 7 are pressed while being heated to the softening point or higher under the normal pressure atmosphere, the upper film 5 and the lower film 7 are pressed.
Flows again due to the heat, so that the bubble reservoir 35 generated near the step 36 is crushed by the relaxation of the residual stress because the inside of the bubble reservoir 35 is in a state of being pulled,
For example, as shown in FIG. 3C, the contraction is performed to such an extent that the formation of the pattern is not affected.

Therefore, according to such a laminating method, even if a bubble pool 35 is formed between the upper film 5 and the lower film 7 and the base material 10, particularly, in the vicinity of the step 36, the bubble is not removed. The pool 35 can be efficiently reduced by a simple method, and a good laminate can be realized. Therefore, a good pattern can be formed during plating or etching.

Further, in such a laminating method, in the second step, in particular, the upper film 5 may be caused to flow to shrink the bubble reservoir 35. For example, instead of the second heat roll 2, As shown in FIG.
The blower 19 may be used as the heating means and the hot air heater, and heating may be performed without applying pressure. That is,
In the laminating apparatus shown in FIG. 5, the blower 19 is disposed above the substrate 10 on the downstream side in the winding direction of the substrate 10 with respect to the vacuum laminator 1. The blower 19 has a configuration in which the outlet 20 for the warm air is directed downward, and blows the warm air toward the upper film 5.

Therefore, when the laminating apparatus shown in FIG. 5 is used, in the second step, in a normal pressure atmosphere,
By the blower 19, the softening point of the upper film 5 or more, for example, about 150 to 200 ° C, preferably about 160 to 1
Warm air heated to 80 ° C. is blown from the outlet 20 to the upper film 5 of the substrate 10. Then,
Since the upper film 5 flows again by heat, the step 3
The bubble pool 35 generated in the vicinity of 6 is crushed by the relaxation of the residual stress because the inside of the bubble pool 35 is in a state of the pressure reduction, and as described above, for example, as shown in FIG. It is shrunk to the extent that it does not affect the formation of the pattern.

Further, for example, instead of the second heat roll 2, an infrared or far infrared heater 21 may be used as a heating means as shown in FIG. That is, FIG.
In the laminating apparatus shown in FIG. 1, the heater 21 is disposed above the substrate 10 on the downstream side in the winding direction of the substrate 10 with respect to the vacuum laminator 1. This heater 2
Reference numeral 1 denotes an infrared or far-infrared radiating surface 22 that faces downward and emits infrared or far-infrared rays toward the upper film 5.

Therefore, when the laminating apparatus shown in FIG. 6 is used, in the second step, in a normal pressure atmosphere,
The heater 21 emits infrared rays or far-infrared rays
0 is irradiated on the upper film 5. Then, since the upper film 5 flows again when the temperature becomes equal to or higher than the softening point due to heat, the bubble reservoir 35 generated near the step 36 is
Since the inside is in a state of pressure reduction, it is crushed by relaxation of residual stress, and for example, as described above, for example,
As shown in FIG. 3C, the contraction is performed to such an extent that the pattern formation is not affected.

In this method, in the vacuum laminator 1, the upper film 5 is provided on the upper and lower sides of the base material 10.
After laminating the lower film 7 and the lower film 7, it is preferable to press while heating by the second heat roll 2 (or heat by the blower 19 or the heater 21) as soon as possible. After the upper film 5 and the lower film 7 are overlaid and laminated on the upper and lower sides of the base material 10, after a certain period of time, air penetrates the upper film 5 from the atmosphere and air enters the bubble reservoir 35, 2 Even when pressed with heating by the heat roll 2 (or heated by the blower 19 or the heater 21), the bubble reservoir 35 may not be satisfactorily shrunk.

Therefore, more specifically, in the vacuum laminator 1, the upper film 5 and the lower film 7 are superposed and laminated on the upper and lower sides of the base material 10, and then within 10 minutes, and further, Within a second, press (or blower 1) while heating with the second heat roll 2
9 or heater 21).

In the second step, the blower 19
However, the air bubbles 35 can be more contracted by applying pressure while heating using the second heat roll 2 than by performing only heating using the heater 21 for infrared rays or far infrared rays. When the infrared or far-infrared heater 21 is used, those devices do not come into contact with the base material, so that maintenance becomes easy.

Further, in such a laminating method, for example, when the cover insulating layer 34 is laminated on the conductor layer 33 having a predetermined conductor circuit pattern, in addition to the base material 10 described above, the conductor circuit pattern is not formed. It is also possible to efficiently reduce the air bubble pool 35 (see FIG. 7) generated therebetween, and to realize a good laminate in a portion between the conductor circuit patterns.

In the above description, the upper film 5 and the lower film 7 are laminated on both sides of the base material 10. However, depending on the purpose and use, only one of them may be laminated. In the apparatus, the base material 10 only needs to be able to pass through the vacuum laminator 1 and the second heat roll 2 (or the blower 19 or the heater 21). By means of the substrate 10
May be conveyed to the vacuum laminator 1 and the second heat roll 2 (or the blower 19 or the heater 21).

[0048]

The present invention will be described more specifically with reference to the following Examples and Comparative Examples, but the present invention is not limited to the Examples and Comparative Examples.

Example 1 A solution of a polyamic acid resin was applied on a stainless steel foil having a thickness of 25 μm, dried, and then imidized at 350 ° C. to form a base insulating layer made of polyimide having a thickness of 10 μm. . Next, on the base insulating layer, a thickness of 10
After a conductor layer made of copper having a thickness of μm is formed as a predetermined conductor circuit pattern by a semi-additive method, a solution of a polyamic acid resin is applied on the conductor layer, dried, and then dried.
By imidizing at 50 ° C., a cover insulating layer made of polyimide having a thickness of 4 μm was formed. This substrate is
A step of 24 μm was formed, corresponding to the substrate shown in FIG.

Next, a dry film resist was laminated on both sides of the substrate using a laminating apparatus shown in FIG. That is, first, in a vacuum laminator, a dry film resist was laminated on both surfaces of a substrate under a reduced pressure atmosphere. The lamination conditions at this time are as follows.

Dry film resist: softening point 100-
Hot melt resin-based dry film resist at 115 ° C. Degree of vacuum in vacuum chamber: 1.5 KPa Surface temperature of first heat roll: about 110 ° C. Pressure of first heat roll: 0.4 MPa Transport speed of take-up roll: 0. 5 m / min. Thereafter, air bubbles generated in the substrate on which the dry film resist was laminated were observed with an optical microscope. The diameter of the bubble pool was about 140 μm. Also, when this substrate was submerged in water and a hole was made in the portion of the air bubble reservoir in the dry film resist, the interior was filled with water, so that the air bubble reservoir was in a state of pressure reduction. Could be confirmed.

Next, the substrate on which the dry film resist was laminated was pressed by a second heat roll while heating under the following conditions.

Surface temperature of the second heat roll: about 110 ° C. Pressure of the second heat roll: 0.4 MPa Transport speed of the take-up roll: 0.5 m / min. Then, air bubbles in the substrate on which the dry film resist is laminated The pool was observed with an optical microscope. The diameter of the bubble reservoir was about 30 μm, and it was confirmed that the diameter was reduced to about 1/5.

The heating and pressing by the second heat roll are separately performed continuously in a laminator using a vacuum laminator.
Seconds later, the sheet was pressed while being heated by the second heat roll.

Example 2 A dry film resist was laminated on a substrate by the same operation as in Example 1 except that the laminating apparatus shown in FIG. 5 was used. The hot air temperature of the blower is about 170 ° C
The processing time was about 60 seconds. Further, similarly to Example 1, the bubble accumulation in the substrate on which the dry film resist was laminated was observed with an optical microscope. The diameter of the bubble reservoir was about 37 μm.

Example 3 A dry film resist was laminated on a substrate by the same operation as in Example 1 except that the laminating apparatus shown in FIG. 6 was used. The heater uses an infrared heater,
The processing time was about 60 seconds. Further, similarly to Example 1, the bubble accumulation in the substrate on which the dry film resist was laminated was observed with an optical microscope. The diameter of the bubble reservoir was about 37 μm.

Comparative Example 1 A dry film resist was laminated on both surfaces of the same substrate as in Example 1 using a commercially available multi-stage laminator apparatus. In addition, this multi-stage laminator is provided with two heat rolls, and lamination is performed under normal pressure atmosphere.
Pressing while heating with each heat roll,
Performed by repeating twice. Then, similarly to Example 1, the bubble accumulation in the substrate on which the dry film resist was laminated was observed with an optical microscope. The bubble pools were present in many places, some of which exceeded 200 μm in diameter.

COMPARATIVE EXAMPLE 2 A dry film resist was laminated on both sides of the same substrate as in Example 1 using a commercially available laminator apparatus, and then a 50 ° C., 0.5 M
It was kept at Pa. Then, as in Example 1, when the bubble accumulation in the substrate on which the dry film resist was laminated was observed with an optical microscope, it took a long time of one hour or more before the bubble accumulation disappeared.

[0059]

As described above, when the laminating method of the present invention is performed using the laminating apparatus of the present invention, even if air bubbles are generated between the film and the substrate,
The bubble accumulation can be efficiently reduced by a simple method, and a good laminate can be realized. Therefore, even if the substrate has a step, the film can be satisfactorily laminated at the step.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing one embodiment of a laminating apparatus of the present invention.

FIGS. 2A and 2B are process diagrams for explaining a final step of manufacturing a suspension board with circuit; FIG. 2A is a cross-sectional view of a main part showing a base material of the final step of the suspension board with circuit;
(B) is a fragmentary cross-sectional view showing a step of laminating the upper film and the lower film on both surfaces of the substrate, and (c).
Is a cross-sectional view of a main part showing a step of processing the upper film and the lower film into a predetermined pattern, and (d) is a step of etching the metal support layer into a predetermined pattern using the upper film and the lower film as a resist. It is principal part sectional drawing which shows.

3A and 3B are main-part plan views for explaining a process in which air bubble accumulation occurs in a final step of manufacturing the suspension board with circuit shown in FIG. 2; FIG. 3A is a linear plan view along a step; Main part plan view showing a state in which a gap has occurred, (b)
FIG. 4 is a cross-sectional view of a main part showing a state in which a linear gap becomes a round bubble pool, and FIG. 4C is a cross-sectional view of a main part showing a state in which the bubble pool is contracted.

FIG. 4 is a plan view of an essential part for explaining a relationship between a portion of the suspension board with circuit where bubbles are generated and a laminating direction.

5 is a laminating apparatus (second embodiment) different from that of FIG.
FIG. 3 is a schematic configuration diagram illustrating a blower provided in place of a heat roll).

FIG. 6 shows a laminating apparatus (second embodiment) different from that of FIG.
FIG. 3 is a schematic configuration diagram illustrating an infrared or far-infrared heater instead of a heat roll.

FIG. 7 is an essential part cross-sectional view for explaining a state where air bubbles are generated between conductor circuit patterns.

[Explanation of symbols]

 2 Second heat roll 4 Vacuum tank 5 Upper film 7 Lower film 9 First heat roll 10 Base material 19 Blower 21 Infrared or far infrared heater 36 Step

Claims (7)

[Claims] 1. A laminating method for laminating a film on a substrate, comprising: a first step of laminating the film on the substrate in a reduced-pressure atmosphere, and pressing the film while heating, and the first step In the substrate on which the film was layered,
Under normal pressure atmosphere, press while heating, or
A laminating method comprising a second step of heating. 2. The laminating method according to claim 1, wherein a step is formed on the base material, and the film is overlaid on at least the step in the first step. 3. The laminating method according to claim 1, wherein in the first step and the second step, pressing is performed while heating using a heat roll. 4. The method according to claim 1, wherein in the first step, heating and pressing are performed using a heat roll, and in the second step, heating is performed using a warm air heater, an infrared ray or a far infrared ray heater. The lamination method according to claim 1 or 2, wherein 5. A laminating apparatus for laminating a film on a substrate, comprising: a decompression tank in which pressure is reduced in the tank; and a laminating apparatus provided in the decompression tank, wherein the film is stacked on the substrate and heated. A first laminating apparatus having a heating and pressing means for pressing while pressing, a heating and pressing means for heating and pressing the substrate on which the film is stacked by the first laminating apparatus under normal pressure, or for heating. Second with heating means
A laminating apparatus, comprising: a laminating apparatus. 6. The laminating apparatus according to claim 5, wherein the heating and pressing means provided in the first laminating apparatus and the second laminating apparatus is a heat roll. 7. The heating and pressing means provided in the first laminating apparatus is a heat roll, and the heating means provided in the second laminating apparatus is one of a hot air heater, an infrared heater and a far infrared heater. The laminating apparatus according to claim 5, characterized in that: