JP3791898B2 - Lamination method - Google Patents

Description

[0001]
  The present inventionOf the final process of suspension board with circuitLamination method for laminating a film on a substrate,Of the final process of suspension board with circuitDry on substrateFilm resistThe present invention relates to a laminating method for laminating and the like.
[0002]
[Prior art]
Conventionally, in the middle of the manufacturing process of a wired circuit board such as a flexible printed circuit board or a suspension board with circuit, for example, a metal support layer made of stainless steel foil, an insulating layer made of polyimide film, or a copper foil, etc. When a conductor circuit pattern is formed by plating on a variety of substrates in which a conductor layer or the like is laminated as a single layer or a multilayer, or when a predetermined pattern is formed by etching, a plating resist, an etching resist, etc. After laminating a dry film resist on a substrate and processing the laminated dry film resist into a predetermined pattern, the dry film resist is covered with other parts that are not plated or etched. Using as a resist, plating or It is or etching.
[0003]
In the process of laminating such a dry film resist on a base material, there is a case where bubbles are accumulated between the laminated dry film resist and the base material, resulting in a defective pattern shape.
[0004]
Therefore, as a method of laminating a dry film resist on a substrate so that such bubble accumulation does not occur, conventionally, for example, using a vacuum laminator equipped with a heat roll, under a reduced pressure atmosphere, by a heat roll, A method of applying pressure while heating, for example, a method of applying pressure while heating in a multi-stage with a plurality of heat rolls under a normal pressure atmosphere using a multi-stage laminator having a plurality of heat rolls, for example, drying on a substrate. There has been proposed a method of laminating a film resist and holding it for a certain period of time in a high temperature and high pressure atmosphere using an autoclave.
[0005]
[Problems to be solved by the invention]
However, in the method using a vacuum laminator provided with a heat roll, the occurrence of bubble accumulation can be reduced, but depending on the pattern, a large bubble accumulation may occur. In the method using a multi-stage laminator, the bubble accumulation is certainly reduced in the second stage than in the first stage, but the effect is small. Furthermore, in the method using an autoclave, the accumulation of bubbles can be considerably reduced, but the processing takes time, and the amount that can be processed at one time is small.
[0006]
On the other hand, in recent years, the density and size of printed circuit boards have been increased, and accordingly, base materials composed of a metal support layer, an insulating layer, or a conductor layer are required to have various specifications. For example, in many cases, it is necessary to laminate a dry film resist on a substrate having a step exceeding several tens of μm. In such a case, the dry film resist is formed in the step portion. In many cases, it is extremely difficult to efficiently reduce the bubble accumulation by the above-described method because the bubble accumulation occurs without being adhered well on the substrate.
[0007]
  The present invention has been made in view of such circumstances, and its intended place is:Of the final process of suspension board with circuitAn object of the present invention is to provide a laminating method capable of realizing good lamination by reducing bubble accumulation generated between a film and a substrate with a simple configuration in a step of laminating a film on a substrate.
[0008]
[Means for Solving the Problems]
  In order to achieve the above object, the present invention provides:Of the final process of suspension board with circuitA laminating method for laminating a film on a substrate,In the base material, a base insulating layer is formed on a metal supporting layer, a conductor layer is formed on the base insulating layer, the conductor layer is covered with a cover insulating layer, and the upper surface of the metal supporting layer and the A step of 10 to 50 μm is formed between the upper surface of the cover insulating layer,Under reduced pressure atmosphereThe film is at least on the stepAgain,To laminate in a direction perpendicular to the step,The first step of pressing while heating, and the base material on which the film is stacked in the first step, within 200 seconds after the lamination of the film in the first step, under atmospheric pressure,In a direction perpendicular to the step,It is characterized by including a second step of pressing while heating or heating.
[0009]
  In such a method, in the first step, the substrate is used under a reduced pressure atmosphere.At least on the stepAfter the film is overlaid onLaminate in the direction perpendicular to the step,Since the pressure is applied while heating, if a bubble pool is generated between the film and the substrate, the inside of the bubble pool is in a suction state. And in the second step, within 200 seconds after laminating the film in the first step, under atmospheric pressure atmosphere,In a direction perpendicular to the step,If the pressure is applied while heating or heating, the film covering the bubble pool flows and adheres well to the substrate. Therefore, in this laminating method, even if bubble accumulation occurs between the film and the substrate, the bubble accumulation can be efficiently reduced by a simple method, and a good lamination can be realized. Can do.
[0011]
  If a step is formed on the base material, even if the film is stacked on the base material and heated and pressed, the film does not adhere well on the base material at the low step portion, and air bubbles are inevitably collected. Even in such a case, according to the laminating method of the present invention, in the second step, the film is brought into close contact with the substrate to efficiently reduce such bubble accumulation. Can do. Therefore, in the laminating method of the present invention, a step of 10 to 50 μm is formed.Of the final process of suspension board with circuitEven if it is a base material, a film can be favorably laminated in the level | step-difference part.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
  FIG. 1 illustrates the present invention.Used for laminating methodIt is a schematic block diagram which shows one Embodiment of a laminating apparatus.
[0017]
  In FIG.Is trueSky Laminator 1And secondTwo heat rolls 2 and a winding roll 3 for winding the base material 10 on which the upper film 5 and the lower film 7 are laminated, from the upstream side in the winding direction of the base material 10 along the downstream side, Sequentially provided.
[0018]
  Vacuum laminator 1Is trueAn empty tank 4, an upper winding roll 6 around which an upper film 5 is wound, and a lower winding roll 8 around which a lower film 7 is wound.And second1 heat roll 9.
[0019]
The vacuum chamber 4 is connected to a vacuum pump (not shown) so that the interior of the vacuum chamber is depressurized, and the upstream passage port 11 and the downstream passage port 12 for allowing the base material 10 to pass through are connected to the front wall of the main body. Openings are formed in the rear wall and the rear wall, respectively. An upstream vacuum seal roll 13 and a downstream vacuum seal roll 14 for maintaining the degree of vacuum in the vacuum chamber 4 are provided in the vicinity of the upstream side of the upstream passage port 11 and the downstream side of the downstream side passage port 12. Each is provided.
[0020]
The upper winding roll 6 and the lower winding roll 8 are opposed to each other in the vertical direction at a predetermined interval with the base material 10 passing through the vacuum chamber 4 interposed therebetween. An upper film 5 for laminating the upper side of the substrate 10 is wound on the upper winding roll 6, and a lower side of the substrate 10 is laminated on the lower winding roll 8. The lower film 7 is wound.
[0021]
The first heat roll 9 includes a pair of an upper roll 15 and a lower roll 16 that face each other, and is arranged on a straight line that connects the upstream passage port 11 and the downstream passage port 12 in the vacuum chamber 4. The upper roll 15 and the lower roll 16 are heated by a heater (not shown), and in the heated state, the base material 10 is sandwiched and the base material 10 is fed and heated and pressed. ing.
[0022]
Moreover, the upper film 5 is drawn out from the upper winding roll 6 disposed above the upper roll 15, and the lower winding roll disposed below the lower roll 16. The lower film 7 from 8 is drawn out. Then, the upper roll 5 is pressed in a state where the upper film 5 is superimposed on the upper side of the base material 10, and the lower roll 16 is pressed in a state where the lower film 7 is superimposed on the lower side of the base material 10. Is configured to do.
[0023]
The second heat roll 2 is disposed on the downstream side in the winding direction of the base material 10 with respect to the vacuum laminator 1 and includes a pair of upper roll 17 and lower roll 18 facing each other. The upper roll 17 and the lower roll 18 are heated by a heater (not shown). In the heated state, the base material 10 on which the upper film 5 and the lower film 7 are laminated is sandwiched, and the base material 10 is sandwiched. It is configured to press while heating while feeding.
[0024]
Moreover, the winding roll 3 is arrange | positioned with respect to the 2nd heat roll 2 in the downstream in the winding direction of the base material 10, the upper film 5 and the lower film 7 are laminated | stacked by the vacuum laminator 1, and 2nd The base material 10 that is pressed while being heated is wound up by the heat roll 2.
[0025]
  Next, using such a laminatorBaseA method of laminating the upper film 5 and the lower film 7 on the material 10 will be described.
[0026]
  As the substrate 10,Of the final process of suspension board with circuitA substrate is used.
[0027]
Moreover, as the upper film 5 and the lower film 7, for example, a dry resist such as a plating resist for forming a conductor circuit pattern by plating on the base material 10 or an etching resist for patterning the base material 10 by etching is used. A film resist or the like is used. Such a dry film resist is formed of, for example, a photosensitive hot melt resin having a softening point of 80 to 130 ° C., preferably 100 to 115 ° C., and is exposed and developed in a later step. A material that can be processed into a predetermined pattern is used.
[0028]
Moreover, as the upper film 5 and the lower film 7, in addition to the dry film resist, for example, an insulating film for forming a base insulating layer 32 and a cover insulating layer 34, which will be described later, and each layer of the base material 10 are bonded. Various films constituting the substrate 10 such as a pressure-sensitive adhesive film may be used.
[0029]
  Also this wayThe figureAs shown in 2 (a), in the final process of manufacturing a suspension board with circuitSuitableCan be used. That is, in FIG. 2A, this base material 10 is a base material in the final process of the suspension board with circuit, and a base insulating layer 32 is formed in a predetermined pattern on the metal support layer 31, and the base insulation is formed. A conductor layer 33 is formed as a predetermined conductor circuit pattern on the layer 32, and the conductor layer 33 is covered with a cover insulating layer 34. Between the upper surface of the metal support layer 31 and the upper surface of the cover insulating layer 34. Includes the thickness of the base insulating layer 32, the conductor layer 33, and the cover insulating layer 34.10-50 μmA large step 36 is formed.
[0030]
In the final step of the suspension board with circuit, as shown in FIG. 2B, after laminating the upper film 5 and the lower film 7 made of dry film resist on both surfaces of the base material 10, c) After the upper film 5 and the lower film 7 are processed into a predetermined pattern by a photolithographic method of exposing and developing, as shown in FIG. 2D, the upper film 5 and the lower film 7 are processed as shown in FIG. The metal support layer 31 is etched into a predetermined pattern using the film 7 as a resist.
[0031]
  First, in this method, as a first step, the inside of the vacuum chamber 4 of the vacuum laminator 1 is set to a reduced pressure atmosphere of, for example, 10 KPa or less, preferably 1.5 KPa or less. The upper film 5 is preferably placed on the upper side of the substrate 10 with the upper roll 15 heated to about 100 to 110 ° C.At least on the stepIn a state of being superimposed onLaminate in the direction perpendicular to the step,While pressing while heating, the lower film 7 was superposed on the lower side of the substrate 10 with the lower roll 16 heated to about 80 to 120 ° C., preferably about 100 to 110 ° C., for example. By pressing while heating in the state, the upper film 5 and the lower film 7 are laminated on the upper side and the lower side of the base material 10 to be laminated. The pressing force of the first heat roll 9 is set to be 0.2 to 0.5 MPa, for example.
[0032]
  Further, in the base material 10 on which the upper film 5 and the lower film 7 are superposed in this manner, in particular, as shown in FIG.10-50 μmIn the base material 10 having the large level difference 36, the surface of the metal support layer 31, which is a low part in the vicinity of the level difference 36, even if the upper film 5 is pressed on the base material 10 while being heated by the first heat roll 9. In this case, the upper film 5 does not adhere well, and as shown in FIG.
[0033]
  That is, such a bubble pool35For example, as shown in FIG. 3A, when the first heat roll 9 rides on the step 36 during lamination, the hardness of the first heat roll 9, the laminating direction 37 of the upper film 5 with respect to the step 36, etc. As a result, the upper film 5 is not sufficiently filled up to the corners of the step 36, and as a result, a linear gap 42 along the step 36 remains in the vicinity of the step 36, and then FIG. As shown in FIG. 4, when the first heat roll 9 rides on the step 36, the upper film 5 is pushed back, and the linear gap is rounded by the action of surface tension. And since the upper film 5 laminated | stacked on the level | step difference 36 will be cooled immediately if it sends out from the 1st heat roll 9, the upper film 5 will flow, with the bubble pool 35 which becomes the inside of the drawing pressure state produced. The residual stress is generated at the portion covering the bubble reservoir 35.
[0034]
For example, as shown in FIG. 2 (c), the bubble pool 35 generated in this way is formed by processing the upper film 5 and the lower film 7 into a predetermined pattern and forming the metal support layer 31 on the lower film 7. When the etching portion 38 is formed, if it overlaps with the etching portion 38, the periphery of the etching portion 38 is not covered with the upper film 5, so that the metal support layer 31 is formed as shown in FIG. When etching into a predetermined pattern, the periphery of the etched portion 38 is also etched, resulting in a defective pattern shape.
[0035]
Further, as described above, since such a bubble reservoir 35 is generated when the first heat roll 9 rides on the step 36, in the suspension 30 with circuit 30 as shown in FIG. This is particularly likely to occur in the portion 39 that is orthogonal to the other, and is unlikely to occur in the portion 40 along the other lamination direction 37 or the portion 41 that is inclined with respect to the lamination direction 37.
[0036]
  Next, in this method, as a second step, the film was heated to a softening point or higher of the upper film 5 and the lower film 7, for example, about 90 to 130 ° C., preferably about 100 to 110 ° C. in a normal pressure atmosphere. While sandwiching the base material 10 on which the upper film 5 and the lower film 7 are laminated with the upper roll 17 and the lower roll 18 of the second heat roll 2, while feeding the base material 10,In the direction perpendicular to the step,Press while heating. The pressing force of the second heat roll 2 is set to be 0.2 to 0.5 MPa, for example.
[0037]
Thus, in the normal pressure atmosphere, if the upper film 5 and the lower film 7 are pressed while being heated above the softening point of the upper film 5 and the lower film 7, the upper film 5 and the lower film 7 flow again due to heat, so the vicinity of the step 36. Since the bubble reservoir 35 generated in FIG. 3 is in an attractive state, the bubble reservoir 35 is crushed by the relaxation of the residual stress, and has no influence on the pattern formation as shown in FIG. 3C, for example. To be shrunk.
[0038]
Therefore, according to such a laminating method, even if the bubble pool 35 is generated between the upper film 5 and the lower film 7 and the base material 10, especially in the vicinity of the step 36, the bubble pool 35 is reduced. By a simple method, it can be reduced efficiently and a good laminate can be realized. Therefore, a good pattern can be formed during plating or etching.
[0039]
  In such a laminating method, in the second step, in particular, the upper film 5 may be flowed and the bubble reservoir 35 may be contracted. For example, instead of the second heat roll 2, FIG. As shown, the blower 19 is used as the heating means and hot air heater without applying pressure.In a direction perpendicular to the stepIt may be only heated. That is, in the laminating apparatus shown in FIG. 5, the blower 19 is disposed above the base material 10 on the downstream side in the winding direction of the base material 10 with respect to the vacuum laminator 1. The blower 19 is configured such that the hot air outlet 20 faces downward and the hot air is blown toward the upper film 5.
[0040]
Therefore, in the case where the laminating apparatus shown in FIG. 5 is used, in the second step, in the normal pressure atmosphere, the blower 19 causes the upper film 5 to have a softening point or higher, for example, about 150 to 200 ° C., preferably about Hot air heated to 160 to 180 ° C. is blown from the outlet 20 to the upper film 5 of the substrate 10. Then, since the upper film 5 flows again due to heat, the bubble reservoir 35 generated in the vicinity of the step 36 is crushed by the relaxation of the residual stress because the inside thereof is in a suction state, and the same as above. For example, as shown in FIG. 3C, the film is contracted to such an extent that the pattern formation is not affected.
[0041]
Further, for example, instead of the second heat roll 2, as shown in FIG. 6, an infrared or far-infrared heater 21 may be used as a heating means. That is, in the laminating apparatus shown in FIG. 6, the heater 21 is arranged above the base material 10 on the downstream side in the winding direction of the base material 10 with respect to the vacuum laminator 1. The heater 21 has an infrared or far-infrared radiation surface 22 facing downward, and is configured to emit infrared or far-infrared toward the upper film 5.
[0042]
Therefore, when the laminating apparatus shown in FIG. 6 is used, in the second step, the upper film 5 of the substrate 10 is irradiated with infrared rays or far infrared rays by the heater 21 in a normal pressure atmosphere. Then, since the upper film 5 flows again when the softening point is exceeded by heat, the bubble pool 35 generated in the vicinity of the step 36 is crushed by the relaxation of the residual stress because the inside thereof is in a suction state. In the same manner as described above, for example, as shown in FIG.
[0043]
In this method, in the vacuum laminator 1, the upper film 5 and the lower film 7 are stacked on the upper side and the lower side of the base material 10, and then pressed while being heated by the second heat roll 2 as soon as possible. Preferably (or heated by the blower 19 or the heater 21). After the upper film 5 and the lower film 7 are stacked and laminated on the upper side and the lower side of the base material 10, when a certain time has passed, the upper film 5 penetrates from the atmosphere and air enters the bubble reservoir 35, Even if it is pressed (or heated by the blower 19 or the heater 21) while being heated by the two heat rolls 2, the bubble reservoir 35 may not be contracted satisfactorily.
[0044]
  Therefore, more specifically, in the vacuum laminator 1, the upper film 5 and the lower film 7 are stacked and laminated on the upper side and the lower side of the base material 10, and then within 200 seconds by the second heat roll 2.In a direction perpendicular to the step,It presses (or heats with the blower 19 or the heater 21), heating.
[0045]
  In the second step, the second heat roll 2 is used rather than only the heating using the blower 19 or the infrared or far infrared heater 21.In the direction perpendicular to the step,The air pressure can be more contracted by pressurizing while heating. However, when the blower 19 or the infrared or far-infrared heater 21 is used, these devices do not come into contact with the base material, so maintenance is performed. Becomes easier.
[0047]
  In the above description, the upper film 5 and the lower film 7 are laminated on both surfaces of the base material 10, but depending on the purpose and application,Upper film 5In this laminating apparatus, the substrate 10 only needs to be able to pass through the vacuum laminator 1 and the second heat roll 2 (or the blower 19 or the heater 21), and is wound up by the take-up roll 3. It may replace with a structure and you may make it convey the base material 10 to the vacuum laminator 1 and the 2nd heat roll 2 (or the blower 19 or the heater 21) using the conveyance means of the other base material 10. FIG.
[0048]
【Example】
Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to the examples and comparative examples.
[0049]
Example 1
A base insulating layer made of polyimide having a thickness of 10 μm was formed by coating a solution of polyamic acid resin on a stainless steel foil having a thickness of 25 μm, followed by drying and imidization at 350 ° C. Next, a conductor layer made of copper having a thickness of 10 μm is formed as a predetermined conductor circuit pattern on the insulating base layer by a semi-additive method, and then a polyamic acid resin solution is applied on the conductor layer and dried. Thereafter, imidization was performed at 350 ° C. to form a cover insulating layer made of polyimide having a thickness of 4 μm. This base material corresponds to the base material shown in FIG. 2A, and a step of 24 μm was formed.
[0050]
Next, a dry film resist was laminated on both surfaces of the substrate using a laminating apparatus shown in FIG. That is, first, a dry film resist was laminated on both surfaces of a substrate in a vacuum laminator under a reduced pressure atmosphere. The laminating conditions at this time are as follows.
[0051]
Dry film resist: hot-melt resin dry film resist having a softening point of 100 to 115 ° C.
Degree of vacuum in the vacuum chamber: 1.5 KPa
Surface temperature of the first heat roll: about 110 ° C
First heat roll pressure: 0.4 MPa
Winding roll transport speed: 0.5 m / min
Then, the bubble accumulation which generate | occur | produced in the base material with which the dry film resist was laminated | stacked was observed with the optical microscope. The diameter of the bubble reservoir was about 140 μm. In addition, when this substrate is submerged in water and a hole is made in the bubble reservoir portion in the dry film resist, the inside of the bubble is filled with water, so that the bubble reservoir is in a state of suction. I was able to confirm.
[0052]
Subsequently, the base material on which the dry film resist was laminated was pressed with the second heat roll while heating under the following conditions.
[0053]
Surface temperature of the second heat roll: about 110 ° C
Second heat roll pressure: 0.4 MPa
Winding roll transport speed: 0.5 m / min
Then, the bubble accumulation in the base material with which the dry film resist was laminated | stacked was observed with the optical microscope. It was confirmed that the diameter of the bubble reservoir was about 30 μm and contracted to about 1/5.
[0054]
In addition, the heating and pressing by the second heat roll were separately performed in succession on the lamination with the vacuum laminator, and after being sent out from the vacuum laminator, the pressing was performed while heating with the second heat roll after about 200 seconds.
[0055]
Example 2
A dry film resist was laminated to the base material by the same operation as in Example 1 except that the laminating apparatus shown in FIG. 5 was used. The hot air temperature of the blower was about 170 ° C., and the treatment time was about 60 seconds. Further, in the same manner as in Example 1, the bubble accumulation in the base material on which the dry film resist was laminated was observed with an optical microscope. The diameter of the bubble reservoir was about 37 μm.
[0056]
Example 3
Except for using the laminating apparatus shown in FIG. 6, the dry film resist was laminated to the base material by the same operation as in Example 1. The heater used was an infrared heater, and the processing time was about 60 seconds. Further, as in Example 1, bubble accumulation in the base material on which the dry film resist was laminated was observed with an optical microscope. The diameter of the bubble reservoir was about 37 μm.
[0057]
Comparative Example 1
A dry film resist was laminated on both surfaces of the same substrate as in Example 1 using a commercially available multi-stage laminator apparatus. In addition, this multistage laminator was equipped with two heat rolls, and the lamination was performed by repeating pressing twice while heating with each heat roll in a normal pressure atmosphere. Thereafter, in the same manner as in Example 1, bubble accumulation in the substrate on which the dry film resist was laminated was observed with an optical microscope. There were many bubble pools, some of which exceeded 200 μm in diameter.
[0058]
Comparative Example 2
A dry film resist was laminated on both surfaces of the same substrate as in Example 1 using a commercially available laminator apparatus, and then held at 50 ° C. and 0.5 MPa using a commercially available autoclave. Then, as in Example 1, when the bubble accumulation in the base material on which the dry film resist was laminated was observed with an optical microscope, it took a long time of 1 hour or more until the bubble accumulation disappeared.
[0059]
【The invention's effect】
  As described above, when the laminating apparatus of the present invention is used to carry out the laminating method of the present invention, even if bubble accumulation occurs between the film and the substrate, the bubble accumulation can be reduced by a simple method. Can be reduced efficiently, and a good laminate can be realized. for that reason,10-50 μmA step is formedOf the final process of suspension board with circuitEven if it is a base material, a film can be favorably laminated in the level | step-difference part.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing an embodiment of a laminating apparatus used in a laminating method of the present invention.
FIG. 2 is a process diagram for explaining a final process of manufacturing a suspension board with circuit,
(A) is principal part sectional drawing which shows the base material of the last process of a suspension board with a circuit,
(B) is a fragmentary cross-sectional view showing a process of laminating the upper film and the lower film on both surfaces of the substrate;
(C) is a fragmentary cross-sectional view showing a process of processing the upper film and the lower film into a predetermined pattern;
(D) is principal part sectional drawing which shows the process of etching a metal support layer into a predetermined pattern by using an upper film and a lower film as a resist.
3 is a plan view of an essential part for explaining a process in which bubble accumulation occurs in a final process of manufacturing the suspension board with circuit shown in FIG. 2;
(A) is a principal part top view which shows the state which the linear gap along the level | step difference produced,
(B) is a cross-sectional view of the main part showing a state in which the linear gap becomes a round bubble pool;
(C) is principal part sectional drawing which shows the state by which the bubble pool was shrink | contracted.
FIG. 4 is a plan view of a main part for explaining the relationship between a portion where bubble accumulation occurs in a suspension board with circuit and a laminating direction.
FIG. 5 is a schematic configuration diagram showing a laminating apparatus (including a blower instead of a second heat roll) of an embodiment different from FIG.
6 is a schematic configuration diagram showing a laminating apparatus (equipped with an infrared or far-infrared heater instead of the second heat roll) of an embodiment different from FIG.The
[Explanation of symbols]
2 Second heat roll
4 Vacuum chamber
5 Upper film
7 Lower film
9 First heat roll
10 Base material
19 Blower
21 Infrared or far infrared heater
36 steps

Claims (1)

A laminating method for laminating a film on a base material in a final process of a suspension board with circuit ,
In the base material, a base insulating layer is formed on a metal supporting layer, a conductor layer is formed on the base insulating layer, the conductor layer is covered with a cover insulating layer, and the upper surface of the metal supporting layer and the A step of 10 to 50 μm is formed between the upper surface of the cover insulating layer,
A first step of pressing while heating so that the film is laminated at least on the step and laminated in a direction perpendicular to the step in a reduced-pressure atmosphere; and
While heating the base material on which the film is overlapped in the first step within 200 seconds after the film is laminated in the first step, in a direction perpendicular to the step , in a normal pressure atmosphere. A laminating method comprising a second step of pressing or heating.

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