JP2002096392A - Method for manufacturing laminate - Google Patents
Method for manufacturing laminateInfo
- Publication number
- JP2002096392A JP2002096392A JP2000287552A JP2000287552A JP2002096392A JP 2002096392 A JP2002096392 A JP 2002096392A JP 2000287552 A JP2000287552 A JP 2000287552A JP 2000287552 A JP2000287552 A JP 2000287552A JP 2002096392 A JP2002096392 A JP 2002096392A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- heat
- manufacturing
- laminate
- fusible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、加圧加熱成形装置
で製造される積層板の製造方法に関する。特には、電子
電気機器等に用いられるフレキシブル積層板の製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated board manufactured by a press and heat forming apparatus. In particular, the present invention relates to a method for manufacturing a flexible laminate used for electronic and electrical equipment and the like.
【０００２】[0002]
【従来の技術】近年、エレクトロニクス製品の軽量化、
小型化、高密度化に伴い、プリント基板の需要が高くな
り、特に、絶縁性フィルム上に銅箔回路を形成して成る
フレキシブルプリント基板の需要が高まっている。この
フレキシブルプリント基板の製造方法としては、一般的
には連続的に供給されるポリイミドフィルム等の絶縁性
フィルム上に連続的に供給される銅箔を熱硬化性接着剤
を用いて連続的に加熱状態で貼合わせ、この銅箔にエッ
チング等の手段により回路を形成する製造方法や、連続
的に供給される耐熱性熱可塑性接着剤があらかじめ上下
面に形成されたポリイミドフィルム等の接着フィルム
と、連続的に供給される銅箔とを連続的に加熱状態で貼
合わせ、この銅箔にエッチング等の手段により回路を形
成する製造方法等がある。2. Description of the Related Art In recent years, weight reduction of electronic products,
As miniaturization and densification have increased, demand for printed circuit boards has increased, and in particular, demand for flexible printed circuit boards formed by forming a copper foil circuit on an insulating film has been increasing. As a method of manufacturing this flexible printed circuit board, generally, a copper foil continuously supplied on an insulating film such as a polyimide film which is continuously supplied is continuously heated using a thermosetting adhesive. Laminated in a state, a manufacturing method for forming a circuit by means such as etching on this copper foil, and an adhesive film such as a polyimide film in which a heat-resistant thermoplastic adhesive that is continuously supplied is formed on the upper and lower surfaces in advance, There is a manufacturing method in which a continuously supplied copper foil is continuously bonded in a heated state, and a circuit is formed on the copper foil by means such as etching.
【０００３】このようなフレキシブルプリント基板は携
帯電話、携帯型パソコンといったものに使用される高密
度実装部品等を実装するため、寸法安定性が強く要求さ
れている。[0003] Such flexible printed circuit boards are required to have high dimensional stability in order to mount high-density mounting parts and the like used in mobile phones and portable personal computers.
【０００４】この寸法安定性は、特開平２−１３４２４
１や特開平１０−１２６０３５に記載されているように
フレキシブル積層板を製造する際の加工条件が大きく効
くことが知られている。たとえば、特開平１０−１２６
０３５には、「このフレキシブルプリント基板は上記製
造方法を採用すると張力の影響により、貼合わせ工程の
前において、絶縁性フィルムが伸ばされ、この状態で銅
箔（銅箔はほとんど伸びない）と貼合わせられる為、エ
ッチング処理をして回路を形成しフレキシブルプリント
基板にすると、エッチング処理の際の銅箔の一部の溶出
により絶縁性フィルムの伸び歪が開放されて縮む為、フ
レキシブルプリント基板が縮んでしまうという問題があ
る。また、ポリイミドフィルムと銅箔とを加熱状態で貼
合わせる際に、ポリイミドフィルムの線膨張係数は銅箔
の線膨張係数よりも大きい為に、ポリイミドフィルムは
銅箔よりも伸ばされた状態で貼合わせられる。よってエ
ッチング処理をして回路を形成しフレキシブルプリント
基板にすると、エッチング処理の際の銅箔の一部の溶出
によりポリイミドフィルムの伸び歪が開放されて縮む
為、フレキシブルプリント基板が縮んでしまうという問
題もある。」と記載されている。This dimensional stability is described in Japanese Patent Laid-Open No.
It is known that the processing conditions for producing a flexible laminate are significantly effective, as described in JP-A-10-26035 and JP-A-10-126035. For example, Japanese Patent Application Laid-Open No. H10-126
035 states, "If this manufacturing method is adopted, the flexible printed circuit board is stretched under the influence of tension before the laminating step, and the copper foil (the copper foil hardly grows) is laminated in this state. When the flexible printed circuit board is formed by performing an etching process to form a flexible printed circuit board, the elongation strain of the insulating film is released due to the elution of a part of the copper foil during the etching process, and the flexible printed circuit board shrinks. In addition, when the polyimide film and the copper foil are bonded together in a heated state, the polyimide film has a larger linear expansion coefficient than the copper foil, and thus the polyimide film is larger than the copper foil. Therefore, when a circuit is formed by etching and a flexible printed circuit board is formed, Since the portion of the elution of the copper foil during the quenching process elongation strain of the polyimide film shrinks is opened, it is described that there is a problem in that. "Will shrink flexible printed circuit board.
【０００５】しかしながら、この特開平２−１３４２４
１では、プラズマ処理を施すこと、および、積層を６０
〜１２０℃の低温度でおこなうこととなっており、プラ
ズマ処理は、製品のコストアップにつながる原因となる
問題、プラズマ処理をインラインでおこなえない問題、
１２０℃より高い温度で積層する時には効果を発揮しな
い等の問題があった。However, Japanese Patent Application Laid-Open No. Hei.
In 1, a plasma treatment is performed, and
It is supposed to be performed at a low temperature of up to 120 ° C., and the plasma processing is a problem that leads to an increase in product cost, a problem that the plasma processing cannot be performed in-line,
When laminating at a temperature higher than 120 ° C., there is a problem that the effect is not exhibited.
【０００６】また、特開平１０−１２６０３５では、５
０〜１２０℃の低温度で貼り合わせることとなってお
り、１２０℃より高い温度で積層する時には効果を発揮
しない等の問題があった。In Japanese Patent Application Laid-Open No. H10-126035, 5
Lamination is performed at a low temperature of 0 to 120 ° C., and there is a problem that the effect is not exhibited when laminating at a temperature higher than 120 ° C.
【０００７】[0007]
【発明が解決しようとする課題】本発明は前記問題点に
鑑み、寸法変化率の良好なフレキシブル基板材料とし
て、高温での熱ラミネートで作製できる積層板を提供す
ることを目的とする。SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a laminated board which can be produced by thermal lamination at a high temperature as a flexible substrate material having a good dimensional change rate.
【０００８】[0008]
【課題を解決するための手段】本発明者らは、このフレ
キシブル積層板の金属材料除去後の寸法変化の発生は、
積層後の積層板内部の接着層の内部歪みによるものであ
ると考えた。つまり、熱融着性の被積層材料と金属材料
とを高温で貼り合わせる際、熱融着性の被積層材料の弾
性率が低くなり、金属材料表面と融着し貼り合わされ
る。この時、熱融着性の被積層材料の貼り合わせるまで
の張力が高い場合、熱融着性の被積層材料は進行方向
（ＭＤ方向）に引き伸ばされる形となり、さらに加熱温
度により熱融着性の被積層材料の弾性率が低くなってい
るため、ＭＤ方向に歪んだまま金属材料と貼り合わされ
ることとなる。そのため、金属材料を除去すると、内部
歪みが開放され、寸法変化率となって現れる。これを解
決するためには、熱融着性の被積層材料の貼り合わせま
での張力を小さくすることである。Means for Solving the Problems The present inventors have found that the occurrence of dimensional change after removing the metal material of this flexible laminate is as follows.
This was considered to be due to internal strain of the adhesive layer inside the laminated plate after lamination. That is, when the heat-fusible laminated material and the metal material are bonded at a high temperature, the elastic modulus of the heat-fusible laminated material is reduced, and the heat-fusible laminated material is fused and bonded to the surface of the metal material. At this time, if the tension until the heat-sealing material to be laminated is high, the heat-sealing material to be laminated is stretched in the advancing direction (MD direction). Because the elastic modulus of the material to be laminated is low, the material to be laminated is bonded to the metal material while being distorted in the MD direction. Therefore, when the metal material is removed, the internal strain is released, which appears as a dimensional change rate. In order to solve this, it is necessary to reduce the tension until lamination of the heat-fusible materials to be laminated.
【０００９】また、熱融着性の被積層材料と金属材料の
線膨張係数差も影響しており、同じ温度で貼り合わせて
も、熱融着性の被積層材料の方が線膨張係数が大きいた
め、貼り合わせ温度で金属材料よりも大きく伸び、その
温度で固定され、冷却後、金属材料よりも大きく縮み、
これによっても内部歪みが発生し、寸法変化率となって
現れれる。これを解決するためには、金属材料の貼り合
わせまでの張力を大きくしてやり、貼り合わせの前に熱
融着性の被積層材料より線膨張係数の小さい金属材料を
なるべく伸ばしてやることである。Further, the difference in linear expansion coefficient between the heat-fusible laminated material and the metal material also has an effect. Even when the heat-fusible laminated materials are bonded at the same temperature, the linear expansion coefficient of the heat-fusible laminated material is lower. Because it is large, it expands more than the metal material at the bonding temperature, it is fixed at that temperature, after cooling it shrinks more than the metal material,
This also causes internal strain, which appears as a dimensional change rate. In order to solve this, it is necessary to increase the tension until the metal materials are bonded, and to stretch the metal material having a smaller linear expansion coefficient than the thermally fusible laminated material before bonding.
【００１０】具体的には、 １）熱融着性の被積層材料と金属材料を含む複数の被積
層材料を加熱加圧成形装置により貼り合わせてなる積層
板の製造方法であって、該装置の加圧面と被積層材料と
の間に保護材料を配置して、２００℃以上の加熱加圧成
形を行い、冷却後に該保護材料を積層板から剥離して積
層板を製造する方法において、加熱加圧成形装置により
貼り合わされる前までの熱融着性の被積層材料に作用す
る張力を該熱融着性の被積層材料が安定的に直進する必
要最低限とし、金属材料の張力を該熱融着性の被積層材
料の張力の３倍以上とすることを特徴とする積層板の製
造方法。 ２）前記積層材料を連続的に加熱加圧して貼り合わせて
なることを特徴とする１）記載の積層板の製造方法。 ３）前記熱融着性の被積層材料の張力が０．１〜３．０
Ｎ／ｍｍ2であることを特徴とする１）または２）に記
載の積層板の製造方法。 ４）２種以上の被積層材料を貼り合わせることを特徴と
する１）乃至４）のいずれか１つに記載の積層板の製造
方法。 ５）前記被積層材料として、厚みが５０μｍ以下の金属
箔を用いることを特徴とする１）乃至５）のいずれか１
つに記載の積層板の製造方法。 ６）前記保護材料が非熱可塑性のポリイミドフィルムか
らなり、その厚みが５０μｍ以上であることを特徴とす
る１）乃至５）のいずれか１つに記載の積層板の製造方
法。 ７）前記熱融着性の被積層材料として、熱可塑性ポリイ
ミドを５０重量％以上含有する接着材料を用いることを
特徴とする１）乃至６）のいずれか１つに記載の積層板
の製造方法。 ８）加圧加熱成形装置が、熱ロールラミネート機または
ダブルベルトプレス機であることを特徴とする１）乃至
７）のいずれか１つに記載の積層板の製造方法。 ９）ロール状に巻かれた長尺シート状物を、被積層材料
または保護材料の少なくとも一方として用いることを特
徴とする１）乃至８）のいずれか１つに記載の積層板の
製造方法。 １０）熱融着性の被積層材料と金属材料が貼り合わされ
た積層版の金属材料を除去後、１５０℃で３０分間加熱
後の寸法変化率の絶対値が、ＭＤ方向及びＴＤ方向とも
に０．１０％以下であることを特徴とする１）乃至９）
のいずれか１つに記載の積層板の製造方法。[0010] Specifically, 1) A method for manufacturing a laminated board in which a plurality of materials to be laminated including a heat-fusible material to be laminated and a metal material are bonded by a heating and pressing molding apparatus. In a method of manufacturing a laminated plate by disposing a protective material between the pressing surface and the material to be laminated, performing heat-press molding at a temperature of 200 ° C. or higher, and peeling the protective material from the laminated plate after cooling. The tension acting on the heat-fusible material to be laminated before being bonded by the pressure molding apparatus is set to the minimum necessary for the heat-fusible material to be laminated to proceed stably straight, and the tension of the metal material is reduced to the minimum. A method for manufacturing a laminated board, wherein the tension is three times or more the tension of a heat-fusible material to be laminated. 2) The method for producing a laminate according to 1), wherein the laminate material is continuously bonded by heating and pressing. 3) The tension of the heat-fusible laminated material is 0.1 to 3.0.
N / mm 2 , wherein the method for producing a laminate according to 1) or 2) above. 4) The method for producing a laminate according to any one of 1) to 4), wherein two or more kinds of materials to be laminated are bonded. 5) As the material to be laminated, a metal foil having a thickness of 50 μm or less is used.
5. A method for producing a laminate according to any one of the above. 6) The method for manufacturing a laminate according to any one of 1) to 5), wherein the protective material is made of a non-thermoplastic polyimide film, and has a thickness of 50 μm or more. 7) The method for producing a laminate according to any one of 1) to 6), wherein an adhesive material containing 50% by weight or more of a thermoplastic polyimide is used as the heat-fusible material to be laminated. . 8) The method for producing a laminate according to any one of 1) to 7), wherein the press-heating and forming apparatus is a hot roll laminator or a double belt press. 9) The method for producing a laminated plate according to any one of 1) to 8), wherein the long sheet-like material wound into a roll is used as at least one of a material to be laminated and a protective material. 10) The absolute value of the dimensional change after heating at 150 ° C. for 30 minutes after removing the metal material of the laminated plate in which the heat-fusible material to be laminated and the metal material are bonded to each other is 0.1 mm in both the MD and TD directions. 10% or less 1) to 9)
The method for producing a laminate according to any one of the above.
【００１１】[0011]
【発明の実施の形態】以下、本発明の詳細について説明
する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below.
【００１２】本発明の製造方法で得られる積層板の用途
は特に限定されるものではないが、主として電子電気用
のフレキシブル積層板として用いられるものである。な
お、本発明でいう被積層材料とは最終的に積層板として
一体化されるシート状または板状の材料をさし、熱融着
性の被積層材料とは加熱による融着によって被積層材料
どうしを接着する機能を有する被積層材料をさす。ま
た、保護材料とは積層板の非構成材料をさす。多段で加
熱加圧成形を行うなどの方法を採る場合においては、保
護材料は加熱加圧成形装置の加圧面に接触せずに、ある
いは隣接せずに配置され得る。Although the use of the laminate obtained by the production method of the present invention is not particularly limited, it is mainly used as a flexible laminate for electronic and electric use. In the present invention, the material to be laminated refers to a sheet-like or plate-like material that is finally integrated as a laminated plate, and the heat-fusible material to be laminated is a material to be laminated by heating. A material to be laminated having a function of bonding together. The protective material refers to a non-constituent material of the laminate. In the case of employing a method such as performing heating and pressing in multiple stages, the protective material may be disposed without contacting or adjacent to the pressing surface of the heating and pressing device.
【００１３】本発明に用いられる熱融着性の被積層材料
としては、熱可塑性樹脂フィルム、熱融着性の接着シー
ト、熱可塑性樹脂含浸紙、熱可塑性樹脂含浸ガラスクロ
ス等が挙げられるが、フレキシブル積層板用としては熱
可塑性樹脂フィルム、熱融着性の接着シートが好まし
い。熱可塑性樹脂フィルムとしては耐熱性を有するもの
が好ましく、例えば、熱可塑性ポリイミド、熱可塑性ポ
リアミドイミド、熱可塑性ポリエーテルイミド、熱可塑
性ポリエステルイミド等の成形物が挙げられ、熱可塑性
ポリイミド、熱可塑性ポリエステルイミドが特に好適に
用いられ得る。これらの耐熱性の熱可塑性樹脂を５０％
以上含有する熱融着性の接着シートも本発明には好まし
く用いられ、特にエポキシ樹脂やアクリル樹脂のような
熱硬化性樹脂等を配合した熱融着性の接着シートの使用
も好ましい。また各種特性の向上のために熱融着性シー
トには種々の添加剤が配合されていても構わない。Examples of the heat-fusible material to be laminated used in the present invention include a thermoplastic resin film, a heat-fusible adhesive sheet, a thermoplastic resin-impregnated paper, a thermoplastic resin-impregnated glass cloth, and the like. For a flexible laminate, a thermoplastic resin film and a heat-fusible adhesive sheet are preferable. As the thermoplastic resin film, those having heat resistance are preferable, for example, molded products such as thermoplastic polyimide, thermoplastic polyamide imide, thermoplastic polyether imide, and thermoplastic polyester imide, and the like, thermoplastic polyimide, thermoplastic polyester An imide can be used particularly preferably. 50% of these heat-resistant thermoplastic resins
The heat-fusible adhesive sheet containing the above is also preferably used in the present invention, and particularly, the use of a heat-fusible adhesive sheet containing a thermosetting resin such as an epoxy resin or an acrylic resin is also preferable. Further, various additives may be blended in the heat-fusible sheet for improving various properties.
【００１４】耐熱性接着材料の構成については特に規定
しないが、ある程度の剛性と十分な絶縁特性・接着性を
有するものでは、接着剤層１層からなるものでも構わな
い。また、接着材料の剛性を得るために接着剤層の中心
部に剛性のある非熱可塑性のポリイミドフィルムを使用
して３層構造としてもよい。The constitution of the heat-resistant adhesive material is not particularly limited, but may be composed of one adhesive layer as long as it has a certain degree of rigidity and sufficient insulating properties and adhesiveness. In order to obtain the rigidity of the adhesive material, a three-layer structure may be used by using a rigid non-thermoplastic polyimide film at the center of the adhesive layer.
【００１５】熱融着性の被積層材料の作製方法について
は特に規定しないが、接着剤層１層からなる場合、ベル
トキャスト法、押出法等により製膜することができる。
また、耐熱性接着材料の構成が接着層／コアフィルム／
接着層というような３層からなる場合、コアフィルムの
両面に接着剤層を、片面ずつ、もしくは両面同時に塗布
する方法、特に、ポリイミド系の接着剤を使用する場
合、ポリアミック酸で塗布し、次いでイミド化する方法
と、そのまま可溶性ポリイミド樹脂を塗布・乾燥させる
方法がある。その他に、接着層／コアフィルム／接着層
のそれぞれの樹脂を共押出しして、一度に耐熱性接着材
料を製膜する方法等がある。Although there is no particular limitation on the method of producing the heat-fusible material to be laminated, when it is composed of one adhesive layer, it can be formed by a belt casting method, an extrusion method or the like.
The composition of the heat-resistant adhesive material is adhesive layer / core film /
When consisting of three layers such as an adhesive layer, a method of applying an adhesive layer on both sides of the core film, one side at a time, or both sides at the same time, particularly, when using a polyimide-based adhesive, apply with a polyamic acid, There are a method of imidization and a method of applying and drying a soluble polyimide resin as it is. In addition, there is a method of coextruding each resin of the adhesive layer / core film / adhesive layer to form a heat-resistant adhesive material at a time.
【００１６】本発明用いられる前記熱融着性の被積層材
料以外の被積層材料について特に限定しないが、２種以
上の被積層材料、より好ましくは、金属箔、プラスチッ
クフィルム、樹脂含浸紙、樹脂含浸ガラスクロス、およ
び樹脂含浸ガラス不織布より選択される２種以上の被積
層材料、特には金属箔とプラスチックフィルムを貼り合
わせることが好ましい。The material to be laminated other than the heat-fusible material to be laminated used in the present invention is not particularly limited, but is preferably two or more materials to be laminated, more preferably a metal foil, a plastic film, a resin-impregnated paper, or a resin. It is preferable to bond two or more kinds of materials to be laminated selected from an impregnated glass cloth and a resin-impregnated glass nonwoven fabric, in particular, a metal foil and a plastic film.
【００１７】金属箔については、銅箔が好ましく、５０
μｍ以下の銅箔がより好ましい。特に３５μｍ以下の銅
箔が更に好ましい。また、銅箔の種類としては圧延銅
箔、電解銅箔、ＨＴＥ銅箔等が挙げられ特に制限はな
く、これらの表面に接着剤が塗布されていても構わな
い。The metal foil is preferably a copper foil.
A copper foil of μm or less is more preferred. Particularly, a copper foil of 35 μm or less is more preferable. Examples of the type of copper foil include rolled copper foil, electrolytic copper foil, HTE copper foil, and the like. There is no particular limitation, and an adhesive may be applied to these surfaces.
【００１８】プラスチックフィルムとしては、熱硬化性
樹脂フィルム、熱硬化性樹脂をＢステージ化した接着シ
ート、熱可塑性樹脂フィルム、熱融着性の接着材料、非
熱可塑性樹脂フィルム等が挙げられる。非熱可塑性樹脂
フィルムの代表例としてはポリイミドフィルムが挙げら
れる。プラスチックフィルムには必要に応じて、片面ま
たは両面に接着剤が塗布されていても構わないし、既に
積層成形されたフィルムを更に本発明にかかる積層成形
に供しても構わない。Examples of the plastic film include a thermosetting resin film, an adhesive sheet obtained by converting a thermosetting resin into a B-stage, a thermoplastic resin film, a heat-fusible adhesive material, and a non-thermoplastic resin film. A typical example of the non-thermoplastic resin film is a polyimide film. An adhesive may be applied to one or both surfaces of the plastic film, if necessary, or a film that has already been laminated and formed may be further subjected to the lamination according to the present invention.
【００１９】加熱加圧成形装置については、被積層材料
を加熱して圧力を加えてラミネートする装置であれば特
にこだわらず、例えば、単動プレス装置、多段プレス装
置、真空プレス装置、多段真空プレス装置、オートクレ
ーブ装置、熱ロールラミネート機、ダブルベルトプレス
機等が挙げられ、これらのうち熱ロールラミネート機、
ダブルベルトプレス機が好ましく用いられ得る。特に被
積層材料、保護材料としてロール状に巻かれた長尺シー
ト状物をこれらの装置と組み合わせて用いると、積層板
の連続製造が可能となり生産性の向上に繋がる。加熱方
法について、所定の温度で加熱することができるもので
あれば特にこだわらず、熱媒循環方式、熱風加熱方式、
誘導加熱方式等が挙げられる。加熱温度は２００℃以上
が好ましいが、電子部品実装のために積層板が雰囲気温
度２４０℃の半田リフロー炉を通過する用途に供される
場合には、それに応じたＴｇを有する熱融着シートを使
用するため２４０℃以上の加熱が好ましい。加圧方式に
ついても所定の圧力を加えることができるものであれば
特にこだわらず、油圧方式、空気圧方式、ギャップ間圧
力方式等が挙げられ、圧力は特に限定されない。The heating and press forming apparatus is not particularly limited as long as it is an apparatus for heating a material to be laminated and applying pressure to perform lamination. For example, a single-acting press, a multi-stage press, a vacuum press, a multi-stage vacuum press Equipment, an autoclave device, a hot roll laminating machine, a double belt press machine and the like. Among these, the hot roll laminating machine,
A double belt press can be preferably used. In particular, when a long sheet-like material wound in a roll shape is used in combination with these devices as a material to be laminated and a protective material, continuous production of a laminated plate becomes possible, leading to an improvement in productivity. The heating method is not particularly limited as long as it can be heated at a predetermined temperature, a heating medium circulation system, a hot air heating system,
An induction heating method and the like can be mentioned. The heating temperature is preferably 200 ° C. or higher. However, when the laminate is used for passing electronic components through a solder reflow furnace at an ambient temperature of 240 ° C., a heat-fused sheet having a Tg corresponding to the temperature is used. Heating at 240 ° C. or higher is preferred for use. The pressurizing method is not particularly limited as long as a predetermined pressure can be applied. Examples thereof include a hydraulic method, a pneumatic method, and a gap pressure method, and the pressure is not particularly limited.
【００２０】前記保護材料は、加工時の温度に耐え得る
ものでなければならず、例えば２５０℃で加工する場合
は、それ以上の耐熱性を有するポリイミドフィルムや銅
箔、アルミニウム箔、ＳＵＳ箔といった金属箔等が有効
である。また、一般に市販されているポリイミドフィル
ムを使用する場合、ラミネート後の積層板のシワ形成を
抑制するという点から、保護材料の厚みは７５μｍ以上
が好ましい。The protective material must be able to withstand the temperature during processing. For example, when processing at 250 ° C., a polyimide film, copper foil, aluminum foil, SUS foil or the like having higher heat resistance is used. A metal foil or the like is effective. When a commercially available polyimide film is used, the thickness of the protective material is preferably 75 μm or more from the viewpoint of suppressing the formation of wrinkles in the laminated plate after lamination.
【００２１】保護材料を剥離する際の積層板の温度は、
熱可塑性樹脂を被積層材料として使用する場合には、そ
のＴｇ以下の温度が好ましい。より好ましくはＴｇより
も５０℃以上低い温度、更に好ましくはＴｇよりも１０
０℃以上低い温度である。最も好ましくは室温まで冷却
された時点で保護材料を積層板から剥離するのが好まし
い。The temperature of the laminate at the time of peeling the protective material is as follows:
When a thermoplastic resin is used as the material to be laminated, the temperature is preferably equal to or lower than its Tg. More preferably, the temperature is at least 50 ° C. lower than Tg, even more preferably 10 ° C. lower than Tg.
The temperature is lower than 0 ° C. Most preferably, the protective material is peeled from the laminate at the point of cooling to room temperature.
【００２２】本発明においては、前記保護材料を繰り返
し使用することができる。熱ロールラミネート機の前後
に被積層材料の繰出・巻取装置を設置するのはもちろん
のこと、保護材料用の繰出・巻取装置を併設することに
よって、一度ラミで利用された保護材料を巻取装置で巻
取り、繰出側に再度設置することで、保護材料を再利用
することができる。巻き取る際に、端部位置検出装置と
巻取位置修正装置を設置して、精度よく保護材料の端部
を揃えて巻き取っても構わない。In the present invention, the above-mentioned protective material can be used repeatedly. In addition to installing the feeding and winding device for the material to be laminated before and after the hot roll laminating machine, by installing the feeding and winding device for the protective material in parallel, the protective material once used for lamination can be wound. The protective material can be reused by winding it up with the take-up device and installing it again on the payout side. At the time of winding, an end position detecting device and a winding position correcting device may be installed, and the ends of the protective material may be precisely aligned and wound.
【００２３】加熱加圧成形装置により貼り合わされる前
までの熱融着性の被積層材料に作用する張力は、該熱融
着性の被積層材料が安定的に直進する必要最低限とす
る。具体的には、熱融着性の被積層材料の張力が０．１
〜３．０Ｎ／ｍｍ2の範囲で調整される。また、金属材
料の張力は、該熱融着性の被積層材料の張力の３倍以上
が好ましい。The tension acting on the heat-fusible material to be laminated before being bonded by the heat-pressing molding apparatus is the minimum necessary for the heat-fusible material to be laminated to proceed stably straight. Specifically, the tension of the heat-fusible laminated material is 0.1
It is adjusted in the range of up to 3.0 N / mm 2 . The tension of the metal material is preferably three times or more the tension of the heat-fusible material to be laminated.
【００２４】以下実施例を記載して本発明をより詳細に
説明する。Hereinafter, the present invention will be described in more detail by way of examples.
【００２５】[0025]
【実施例】（実施例１〜４）Ｔｇ１９０℃の２５μｍの
熱可塑性ポリイミドフィルム（鐘淵化学工業株式会社製
ＰＩＸＥＯ ＴＰ−Ｔ）の両側に１８μｍの圧延銅
箔、さらにその両側に保護材料としてポリイミドフィル
ム（鐘淵化学工業株式会社製 アピカル１２５ＡＨ）
を、熱ロールラミネート機を用いて、ラミ温度３００
℃、ラミ圧力５０ｋｇｆ／ｃｍ、ラミ速度２ｍ／ｍｉｎ
の条件で耐熱性フレキシブル積層板を作製した。その時
のフィルム、銅箔の張力と寸法変化率を表１に示す。寸
法変化率が絶対値で０．１０％以内の耐熱性フレキシブ
ル積層板を作製することができた。Examples (Examples 1 to 4) Rolled copper foil of 18 μm on both sides of a thermoplastic polyimide film (PIXEO TP-T manufactured by Kaneka Chemical Industry Co., Ltd.) of Tg 190 ° C. and 25 μm, and polyimide on both sides as a protective material Film (Apical 125AH manufactured by Kanegabuchi Chemical Industry Co., Ltd.)
Using a hot roll laminator at a laminating temperature of 300
° C, Lami pressure 50kgf / cm, Lami speed 2m / min
A heat-resistant flexible laminate was produced under the following conditions. Table 1 shows the tension and dimensional change of the film and copper foil at that time. A heat-resistant flexible laminate having a dimensional change of 0.10% or less in absolute value could be produced.
【００２６】なお、寸法変化率は、ＪＩＳ Ｃ６４７１
（６．１１寸法安定性）に準じておこなった。The dimensional change rate is based on JIS C6471.
(6.11 dimensional stability).
【００２７】（比較例１〜３）実施例１と同様の加工条
件で、耐熱性フレキシブル積層板を作製した。その時の
フィルム、銅箔の張力と寸法変化率を表１に示す。寸法
変化率は絶対値で０．１０％を越えるものとなった。(Comparative Examples 1 to 3) Under the same processing conditions as in Example 1, heat-resistant flexible laminates were produced. Table 1 shows the tension and dimensional change of the film and copper foil at that time. The dimensional change rate exceeded 0.10% in absolute value.
【００２８】[0028]
【表１】 [Table 1]
【００２９】[0029]
【発明の効果】本発明による積層板の製造方法を用いる
ことによって、寸法変化率良好なフレキシブル積層板を
得ることが出来る。By using the method for manufacturing a laminate according to the present invention, a flexible laminate having a good dimensional change can be obtained.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F211 AA40 AD03 AG01 AG03 AH36 AR04 TA03 TA13 TC05 TD11 TN09 TN60 TQ03 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F211 AA40 AD03 AG01 AG03 AH36 AR04 TA03 TA13 TC05 TD11 TN09 TN60 TQ03
Claims (10)
複数の被積層材料を加熱加圧成形装置により貼り合わせ
てなる積層板の製造方法であって、該装置の加圧面と被
積層材料との間に保護材料を配置して、２００℃以上の
加熱加圧成形を行い、冷却後に該保護材料を積層板から
剥離して積層板を製造する方法において、加熱加圧成形
装置により貼り合わされる前までの熱融着性の被積層材
料に作用する張力を該熱融着性の被積層材料が安定的に
直進する必要最低限とし、金属材料の張力を該熱融着性
の被積層材料の張力の３倍以上とすることを特徴とする
積層板の製造方法。1. A method of manufacturing a laminated board comprising laminating a plurality of materials to be laminated including a heat-fusible material to be laminated and a metal material by a heating and pressing molding apparatus, wherein the pressing surface of the apparatus is A method for manufacturing a laminated plate by disposing a protective material between the laminated material and heating and pressing at a temperature of 200 ° C. or higher, and then separating the protective material from the laminated plate after cooling, using a heating and pressing molding device The tension acting on the heat-fusible laminated material before bonding is minimized to the minimum necessary for the heat-fusible laminated material to proceed stably straight, and the tension of the metal material is reduced to the heat-fusible material. A method for manufacturing a laminate, wherein the tension is at least three times the tension of a material to be laminated.
り合わせてなることを特徴とする請求項１記載の積層板
の製造方法。2. The method for manufacturing a laminate according to claim 1, wherein said laminate material is continuously bonded by heating and pressing.
１〜３．０Ｎ／ｍｍ 2であることを特徴とする請求項１
または２に記載の積層板の製造方法。3. The heat-fusible material to be laminated has a tension of 0.
1 to 3.0 N / mm Two2. The method according to claim 1, wherein
Or the method for producing a laminate according to 2.
とを特徴とする請求項１乃至４のいずれか１項に記載の
積層板の製造方法。4. The method for manufacturing a laminated board according to claim 1, wherein two or more kinds of materials to be laminated are bonded together.
ｍ以下の金属箔を用いることを特徴とする請求項１乃至
請求項５のいずれか１項に記載の積層板の製造方法。5. The material to be laminated has a thickness of 50 μm.
The method for manufacturing a laminated board according to any one of claims 1 to 5, wherein a metal foil having a thickness of m or less is used.
ィルムからなり、その厚みが５０μｍ以上であることを
特徴とする請求項１乃至請求項５のいずれか１項に記載
の積層板の製造方法。6. The method according to claim 1, wherein said protective material is made of a non-thermoplastic polyimide film, and has a thickness of 50 μm or more. .
塑性ポリイミドを５０重量％以上含有する接着材料を用
いることを特徴とする請求項１乃至請求項６のいずれか
１項に記載の積層板の製造方法。7. The method according to claim 1, wherein an adhesive material containing 50% by weight or more of a thermoplastic polyimide is used as the heat-sealable material to be laminated. A method for manufacturing a laminate.
ト機またはダブルベルトプレス機であることを特徴とす
る請求項１乃至請求項７のいずれか１項に記載の積層板
の製造方法。8. The method for producing a laminate according to claim 1, wherein the press-heating and forming apparatus is a hot roll laminator or a double belt press.
被積層材料または保護材料の少なくとも一方として用い
ることを特徴とする請求項１乃至請求項８のいずれか１
項に記載の積層板の製造方法。9. A long sheet material wound in a roll shape,
9. The method according to claim 1, wherein the material is used as at least one of a laminated material and a protective material.
13. The method for producing a laminate according to the above item.
り合わされた積層版の金属材料を除去後、１５０℃で３
０分間加熱後の寸法変化率の絶対値が、ＭＤ方向及びＴ
Ｄ方向ともに０．１０％以下であることを特徴とする請
求項１乃至請求項９のいずれか１項に記載の積層板の製
造方法。10. After removing the metal material of the laminated plate in which the heat-fusible material to be laminated and the metal material are bonded, at 150 ° C.
The absolute value of the dimensional change after heating for 0 minutes
The method for manufacturing a laminated board according to any one of claims 1 to 9, wherein the content is 0.10% or less in both the D direction.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000287552A JP2002096392A (en) | 2000-09-21 | 2000-09-21 | Method for manufacturing laminate |
| US10/129,037 US7101455B1 (en) | 1999-11-01 | 2000-10-30 | Method and device for manufacturing laminated plate |
| PCT/JP2000/007656 WO2001032418A1 (en) | 1999-11-01 | 2000-10-30 | Method and device for manufacturing laminated plate |
| KR1020027003851A KR100724046B1 (en) | 1999-11-01 | 2000-10-30 | Method and device for manufacturing laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000287552A JP2002096392A (en) | 2000-09-21 | 2000-09-21 | Method for manufacturing laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002096392A true JP2002096392A (en) | 2002-04-02 |
Family
ID=18771279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000287552A Withdrawn JP2002096392A (en) | 1999-11-01 | 2000-09-21 | Method for manufacturing laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002096392A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005350668A (en) * | 2004-05-13 | 2005-12-22 | Kaneka Corp | Adhesive film, flexible metal-clad laminate, and process for producing the same |
| JP2006052389A (en) * | 2004-07-15 | 2006-02-23 | Kaneka Corp | Adhesive film, flexible metal-clad laminate, and method for producing the same laminate |
| JP2006137114A (en) * | 2004-11-12 | 2006-06-01 | Kaneka Corp | Manufacturing method of flexible metal stretched laminate and flexible metal stretched laminate obtained by the method |
-
2000
- 2000-09-21 JP JP2000287552A patent/JP2002096392A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005350668A (en) * | 2004-05-13 | 2005-12-22 | Kaneka Corp | Adhesive film, flexible metal-clad laminate, and process for producing the same |
| JP2006052389A (en) * | 2004-07-15 | 2006-02-23 | Kaneka Corp | Adhesive film, flexible metal-clad laminate, and method for producing the same laminate |
| JP2006137114A (en) * | 2004-11-12 | 2006-06-01 | Kaneka Corp | Manufacturing method of flexible metal stretched laminate and flexible metal stretched laminate obtained by the method |
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