JPS6349616B2 - - Google Patents
Info
- Publication number
- JPS6349616B2 JPS6349616B2 JP55053560A JP5356080A JPS6349616B2 JP S6349616 B2 JPS6349616 B2 JP S6349616B2 JP 55053560 A JP55053560 A JP 55053560A JP 5356080 A JP5356080 A JP 5356080A JP S6349616 B2 JPS6349616 B2 JP S6349616B2
- Authority
- JP
- Japan
- Prior art keywords
- dry film
- printed wiring
- wiring board
- heating
- laminating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
本発明はプリント配線板にドライフイルムを貼
着するラミネート方法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a laminating method for attaching a dry film to a printed wiring board.
従来より通信用電子機器などに用いられるプリ
ント配線板のパターン形成方法の一つにドライフ
イルムと呼ばれる光感光性樹脂フイルムを用いる
方法がある。この方法は絶縁基板に銅箔をはり付
けたプリント配線板の銅箔面にドライフイルムを
貼着し、このドライフイルムにパターンを焼付
け、現像したのち、銅箔をエツチングしてパター
ンを形成するのである。このような方法のドライ
フイルム貼着工程には第１図に示す如きラミネー
ターが用いられている。この装置は両面に保護フ
イルムを有するドライフイルム１の一方の面の保
護フイルム２を引きはがし、ヒーターローラ３に
より該ドライフイルムの感光性樹脂を軟化させ、
次いで加圧ローラ４によりプリント配線板５の表
面に加圧しながら貼着し送りローラ６により送り
出すのである。ところがこの方法ではプリント配
線板に対するドライフイルムの密着が不充分であ
る。従つて現在の高密度回路に伴う細線パターン
を形成するとき銅箔とドライフイルムとの隙間に
エツチング液が浸入してパターン切れなどの欠陥
を生ずることがある。このため密着性の良いラミ
ネート方法の開発が要請されている。本発明はこ
の要請に基づいて案出されたものである。 2. Description of the Related Art One of the conventional methods for forming patterns on printed wiring boards used in communication electronic devices and the like is a method using a photosensitive resin film called a dry film. In this method, a dry film is pasted on the copper foil surface of a printed wiring board with copper foil pasted on an insulating substrate, a pattern is baked onto this dry film, developed, and then the copper foil is etched to form the pattern. be. A laminator as shown in FIG. 1 is used in the dry film adhesion step of this method. This device peels off the protective film 2 on one side of a dry film 1 which has protective films on both sides, softens the photosensitive resin of the dry film with a heater roller 3, and
Next, the pressure roller 4 applies pressure to the surface of the printed wiring board 5 to adhere it, and the feed roller 6 sends it out. However, with this method, the adhesion of the dry film to the printed wiring board is insufficient. Therefore, when forming fine line patterns associated with current high-density circuits, the etching solution may enter the gap between the copper foil and the dry film, causing defects such as pattern breakage. Therefore, there is a need to develop a laminating method with good adhesion. The present invention was devised based on this request.
このため本発明においては、プリント配線板に
ドライフイルムを貼着するラミネート方法におい
て、ドライフイルムを加熱し、該ドライフイルム
の感光性樹脂を軟化させながらプリント配線板に
加圧して貼着したのち、一旦室温にまで冷却し、
次いで再度加熱加圧を行なうことを特徴とするも
のである。 Therefore, in the present invention, in the laminating method of attaching a dry film to a printed wiring board, the dry film is heated and the photosensitive resin of the dry film is softened while being pressed and attached to the printed wiring board, and then, Once cooled to room temperature,
This is characterized in that heating and pressurization is then performed again.
以下、添付図面に基づいて本発明の実施例につ
き詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings.
本発明方法は第２図の工程図に示す如く、先ず
前処理として銅箔面の酸化物、油脂等を除去した
のち、一方の面の保護フイルムを除去したドライ
フイルムを加熱し、該ドライフイルムの感光性樹
脂を軟化させながら前記プリント配線板の銅箔面
に貼着する。（この場合接着剤は使用しない）こ
のときの加熱温度は120℃程度とする。次に自然
放置して室温まで冷却する。この工程までは従来
と同様であるがこの状態では第３図に示す如くプ
リント配線板５に傷あるいはごみ等による凹凸７
があるとドライフイルム１は充分に密着せず空隙
８を生じている。本発明方法は再び加熱加圧を行
ない第４図の如く空隙を除くのである。この場合
の加熱は120℃程度でよい。なお本実施例が加熱
加圧を２回行なう理由は、単に２回分の時間を合
わせて加熱すると、感光性樹脂が過度に軟化して
保護フイルムのサイドからはみ出し、該感光性樹
脂が所望の領域外に付着したり、また感光性樹脂
が所望の厚さより薄くなるという不具合を防止す
るためである。このようにドライフイルムが貼着
されたプリント板は以後30分〜３時間のホールド
タイムを取つた後、焼付現像を行ない、次いでエ
ツチングを行なつてパターンを形成するのである
が、この際ドライフイルムはプリント配線板に充
分密着しているため、微細なパターンでもパター
ン切れなどの欠陥を生ずることはない。 As shown in the process diagram of FIG. 2, the method of the present invention first involves removing oxides, oils, etc. from the surface of the copper foil as a pretreatment, and then heating the dry film from which the protective film on one side has been removed. The photosensitive resin is softened and attached to the copper foil surface of the printed wiring board. (In this case, no adhesive is used.) The heating temperature at this time is approximately 120°C. Next, leave it to cool to room temperature. Up to this step, the process is the same as the conventional one, but in this state, as shown in FIG.
If there is, the dry film 1 will not adhere sufficiently and a void 8 will be created. In the method of the present invention, heating and pressurization is performed again to remove voids as shown in FIG. In this case, heating may be about 120°C. The reason why heating and pressurizing is performed twice in this example is that simply heating the two times together will soften the photosensitive resin excessively and cause it to protrude from the side of the protective film. This is to prevent problems such as adhesion to the outside or the photosensitive resin becoming thinner than the desired thickness. After a hold time of 30 minutes to 3 hours, the printed board with the dry film pasted in this way is subjected to printing and development, and then etching to form a pattern. Since it is in close contact with the printed wiring board, defects such as pattern breakage do not occur even with minute patterns.
以上説明した如く本発明のドライフイルムのラ
ミネート方法は、再加熱加圧を行なうことにより
プリント配線板に対するドライフイルムの密着を
充分に行ない、エツチング時におけるパターンの
欠陥の発生を防止することを可能としたものであ
る。 As explained above, the dry film laminating method of the present invention makes it possible to sufficiently adhere the dry film to the printed wiring board by reheating and pressurizing it, thereby preventing pattern defects from occurring during etching. This is what I did.
第１図は従来のラミネータの１例の模式図、第
２図は本発明にかかる実施例のドライフイルムの
ラミネート方法の工程図、第３図はプリント配線
板に１回の加熱加圧によりドライフイルムを貼着
したところを示した断面図、第４図は再加熱加圧
を行なつた後のドライフイルムを貼着したプリン
ト配線板の断面図である。
１…ドライフイルム、２…保護フイルム、３…
ヒータローラ、４…加圧ローラ、５…プリント配
線板、６…送りローラ、７…プリント配線板の凹
凸、８…空隙。
Fig. 1 is a schematic diagram of an example of a conventional laminator, Fig. 2 is a process diagram of a dry film laminating method according to an embodiment of the present invention, and Fig. 3 is a schematic diagram of a dry film laminating method according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of the printed wiring board to which the dry film has been pasted after being reheated and pressurized. 1...Dry film, 2...Protection film, 3...
Heater roller, 4...Pressure roller, 5...Printed wiring board, 6...Feed roller, 7...Irregularities of printed wiring board, 8...Gap.
Claims (1)
ラミネート方法において、 ドライフイルムを加熱し、該ドライフイルムの
感光性樹脂を軟化させながらプリント配線板に加
圧して貼着したのち、一旦室温にまで冷却し、次
いで再度加熱加圧を行なうことを特徴とするドラ
イフイルムのラミネート方法。[Claims] 1. In a laminating method for attaching a dry film to a printed wiring board, the dry film is heated and the photosensitive resin of the dry film is softened while being pressed and attached to the printed wiring board, and then A dry film laminating method characterized by once cooling to room temperature and then heating and pressurizing again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5356080A JPS56150548A (en) | 1980-04-24 | 1980-04-24 | Method of laminating dry film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5356080A JPS56150548A (en) | 1980-04-24 | 1980-04-24 | Method of laminating dry film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56150548A JPS56150548A (en) | 1981-11-21 |
| JPS6349616B2 true JPS6349616B2 (en) | 1988-10-05 |
Family
ID=12946191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5356080A Granted JPS56150548A (en) | 1980-04-24 | 1980-04-24 | Method of laminating dry film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56150548A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008047786A (en) * | 2006-08-21 | 2008-02-28 | Fuji Electric Device Technology Co Ltd | Insulating film forming method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4927733A (en) * | 1988-12-23 | 1990-05-22 | E. I. Du Pont De Nemours And Company | Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5456683A (en) * | 1977-10-13 | 1979-05-07 | Sekisui Plastics | Double layer sheet and method of making same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5047967U (en) * | 1973-08-30 | 1975-05-12 |
-
1980
- 1980-04-24 JP JP5356080A patent/JPS56150548A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5456683A (en) * | 1977-10-13 | 1979-05-07 | Sekisui Plastics | Double layer sheet and method of making same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008047786A (en) * | 2006-08-21 | 2008-02-28 | Fuji Electric Device Technology Co Ltd | Insulating film forming method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56150548A (en) | 1981-11-21 |
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