JPH0561794B2 - - Google Patents
Info
- Publication number
- JPH0561794B2 JPH0561794B2 JP6145089A JP6145089A JPH0561794B2 JP H0561794 B2 JPH0561794 B2 JP H0561794B2 JP 6145089 A JP6145089 A JP 6145089A JP 6145089 A JP6145089 A JP 6145089A JP H0561794 B2 JPH0561794 B2 JP H0561794B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- wiring board
- epoxy resin
- wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011888 foil Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 229920000647 polyepoxide Polymers 0.000 claims description 22
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 14
- 239000004814 polyurethane Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 7
- 230000000873 masking effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- XFNGYPLLARFULH-UHFFFAOYSA-N 1,2,4-oxadiazetidin-3-one Chemical compound O=C1NON1 XFNGYPLLARFULH-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- DLMVDBDHOIWEJZ-UHFFFAOYSA-N isocyanatooxyimino(oxo)methane Chemical compound O=C=NON=C=O DLMVDBDHOIWEJZ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明は、各種の電子機器等に使用する回路を
作成するため、又はカーペツト等に内蔵して使用
する面状発熱体を作成するためのフレキシブルプ
リント配線基板に関するものである。
TECHNICAL FIELD The present invention relates to a flexible printed wiring board for producing circuits for use in various electronic devices, etc., or for producing a planar heating element to be built into a carpet or the like.
従来、フレキシブルプリント配線基板として
は、ポリエステルフイルムやポリイミドフイルム
等の耐熱性合成樹脂製フイルムと、アルミニウム
箔や銅箔等の金属箔と、をポリウレタン系接着剤
で貼合したものが用いられている。このフレキシ
ブルプリント配線基板を用いて配線板を得る方法
は、金属箔上に所定のマスキングを施した後、エ
ツチング溶液に浸漬して非マスキング部分の金属
箔を溶解除去するというものである。
しかるに、ポリウレタン系接着剤はエツチング
後、マスキングを除去する際、若しくは脱脂処理
する際、その有機溶剤（トリクロルエタンやジク
ロルエタン等）に侵されやすく、金属箔即ち配線
部分が剥がれるということがあつた。配線部分が
剥がれると、結局導体部分が浮き上がつた状態に
なり、短絡しやすいという欠点を惹起するに到
る。
また、非マスキング部分即ち非配線部分におい
てはポリウレタン系接着剤が露出することになる
が、ポリウレタン系接着剤にはタツキネスがあ
る。従つて、この配線板を積み重ねて保存又は輸
送すると、配線板同士がくつつきやすく、配線板
の使用時において、配線板を一枚ずつ剥がすこと
が困難になるという欠点があつた。また、これを
無理矢理剥がすと、配線部分が損傷したり、配線
板自体が破れるという欠点が生じる。
更に、ポリウレタン系接着剤は耐熱性が充分で
なく、配線部分に導線等をハンダ付けする際、露
出しているポリウレタン系接着剤が、燃えたり或
いは焦げたりするということがあつた。従つて、
ハンダ付けの際に作業者が火傷をするという欠点
があつた。また、配線板中にゴミが残り、このゴ
ミが配線板に故障を惹起させるという欠点もあつ
た。
Conventionally, flexible printed circuit boards have been made by bonding a heat-resistant synthetic resin film such as polyester film or polyimide film with metal foil such as aluminum foil or copper foil using a polyurethane adhesive. . A method for obtaining a wiring board using this flexible printed wiring board is to mask the metal foil in a predetermined manner and then immerse it in an etching solution to dissolve and remove the unmasked portions of the metal foil. However, polyurethane adhesives are easily attacked by organic solvents (trichloroethane, dichloroethane, etc.) when removing masking or degreasing after etching, resulting in peeling of the metal foil, that is, wiring parts. When the wiring portion is peeled off, the conductor portion ends up floating, resulting in a disadvantage that short circuits are likely to occur. Furthermore, although the polyurethane adhesive is exposed in the non-masking portions, that is, the non-wiring portions, the polyurethane adhesive has tackiness. Therefore, when these wiring boards are stored or transported in a stacked manner, the wiring boards tend to stick to each other, and it becomes difficult to peel off the wiring boards one by one when the wiring boards are used. Further, if this is forcibly removed, the wiring portion may be damaged or the wiring board itself may be torn. Furthermore, polyurethane adhesives do not have sufficient heat resistance, and when soldering conductive wires and the like to wiring sections, the exposed polyurethane adhesives sometimes burn or become scorched. Therefore,
The disadvantage was that workers could get burned when soldering. Another drawback was that dust remained in the wiring board, and this dust caused the wiring board to malfunction.
このため、本発明者はポリウレタン系接着剤に
代えて、耐溶剤性や耐熱性等に優れた接着剤で、
合成樹脂製フイルムと金属箔とを貼合することを
試みた。しかし、このような接着剤は、一般的に
高温で貼合しなければならず、高温貼合の際、合
成樹脂製フイルムが収縮を起こし、得られたフレ
キシブルプリント配線基板にはシワが生じるとい
う新たな欠点を生じるに到つた。
そこで、本発明は耐溶剤性や耐熱性等に優れた
接着剤を接着剤として用いるのではなく、上記し
た各種の欠点を回避するためのものとして用い、
また接着剤としては従来と同様のポリウレタン系
接着剤を用いることにより、上記の各種の欠点及
び新たに生起する欠点が生じないようにしたもの
である。
Therefore, in place of polyurethane adhesives, the present inventors developed adhesives with excellent solvent resistance and heat resistance.
An attempt was made to bond a synthetic resin film and metal foil. However, such adhesives generally have to be laminated at high temperatures, and when laminated at high temperatures, the synthetic resin film shrinks, causing wrinkles in the resulting flexible printed wiring board. A new drawback has arisen. Therefore, the present invention does not use an adhesive with excellent solvent resistance and heat resistance as an adhesive, but uses it as an adhesive to avoid the various drawbacks described above.
Furthermore, by using the same polyurethane adhesive as in the past, the various drawbacks mentioned above and new defects are avoided.
即ち、本発明は、合成樹脂製フイルムと金属箔
とをポリウレタン系接着剤で貼合したフレキシブ
ルプリント配線基板において、該金属箔とポリウ
レタン系接着剤との間にエポキシ系樹脂層が介在
されてなることを特徴とするフレキシブルプリン
ト配線基板に関するものである。
本発明において、合成樹脂製フイルムとして
は、耐熱性に優れ且つ柔軟性の良好なものが主と
して用いられ、例えばポリエチレンテレフタレー
トやポリブチレンテレフタレート等のポリエステ
ルフイルム、ポリフエニレンサルフアイドフイル
ム、ポリカーボネート系フイルム、芳香族系ポリ
アミドフイルム、ポリイミド系フイルム、フツ素
樹脂系フイルム等が用いられる。また、合成樹脂
製フイルムの厚さは、25〜200μ程度である。
金属箔としては、一般的にアルミニウム箔又は
銅箔が用いられる。この金属箔の厚さは、５〜
100μ程度である。
合成樹脂製フイルムと金属箔とは、従来公知の
ポリウレタン系接着剤で貼合されるわけである
が、本発明において重要な点は、この際金属箔と
ポリウレタン系接着剤との間にエポキシ系樹脂層
が介在することである。エポキシ系樹脂として
は、エポキシ−フエノール樹脂、エポキシ−ユリ
ア樹脂、エポキシ−イソシアネート樹脂、エポキ
シ−メラミン樹脂、エポキシアミノ−アクリル変
性樹脂等とその硬化剤とを組み合わせたものが用
いられる。
なお、ポリウレタン系樹脂としては、従来公知
のものが用いられる。
本発明に係るフレキシブルプリント配線基板の
製造方法は以下のとおりである。
まず、金属箔にエポキシ系樹脂溶液を所望の厚
さに塗布する。エポキシ系樹脂溶液は、各種のエ
ポキシ樹脂とその硬化剤とよりなるものである。
また、塗布方法としては、ロールコーターによる
方法、グラビアコーターによる方法等が用いられ
る。塗布した後、例えば100〜200℃程度の温度範
囲内で、且つ10〜120秒程度の時間で、エポキシ
系樹脂を硬化する。このようにして得られたエポ
キシ系樹脂層を具えた金属箔を得る。
次いで、このエポキシ系樹脂層にウレタン系接
着剤を塗布し、直ちに合成樹脂製フイルムをウレ
タン系接着剤に当接して、金属箔と合成樹脂製フ
イルムとを貼合する。なお、合成樹脂製フイルム
とウレタン系接着剤を当接する場合、温度60〜
100℃程度で一対の加圧ロール間を通せばよい。
以上、合成樹脂製フイルムの片面に金属箔が貼
合される場合を、主にして説明したが、本発明に
おいて合成樹脂製フイルムの両面に金属箔を貼合
してもよいことは勿論である。
That is, the present invention provides a flexible printed wiring board in which a synthetic resin film and a metal foil are bonded together with a polyurethane adhesive, in which an epoxy resin layer is interposed between the metal foil and the polyurethane adhesive. The present invention relates to a flexible printed wiring board characterized by the following. In the present invention, synthetic resin films that have excellent heat resistance and good flexibility are mainly used, such as polyester films such as polyethylene terephthalate and polybutylene terephthalate, polyphenylene sulfide films, polycarbonate films, Aromatic polyamide films, polyimide films, fluororesin films, etc. are used. Further, the thickness of the synthetic resin film is approximately 25 to 200μ. As the metal foil, aluminum foil or copper foil is generally used. The thickness of this metal foil is 5~
It is about 100μ. The synthetic resin film and the metal foil are pasted together using a conventionally known polyurethane adhesive, but the important point in the present invention is that an epoxy adhesive is used between the metal foil and the polyurethane adhesive. The resin layer is present. As the epoxy resin, a combination of an epoxy-phenol resin, an epoxy-urea resin, an epoxy-isocyanate resin, an epoxy-melamine resin, an epoxy-amino-acrylic modified resin, and a curing agent thereof is used. Note that as the polyurethane resin, conventionally known ones are used. The method for manufacturing a flexible printed wiring board according to the present invention is as follows. First, an epoxy resin solution is applied to a metal foil to a desired thickness. The epoxy resin solution consists of various epoxy resins and their curing agents.
Further, as a coating method, a method using a roll coater, a method using a gravure coater, etc. are used. After coating, the epoxy resin is cured within a temperature range of, for example, about 100 to 200°C and for about 10 to 120 seconds. A metal foil provided with the epoxy resin layer thus obtained is obtained. Next, a urethane adhesive is applied to this epoxy resin layer, and the synthetic resin film is immediately brought into contact with the urethane adhesive to bond the metal foil and the synthetic resin film. In addition, when contacting a synthetic resin film and a urethane adhesive, the temperature should be 60~
It is sufficient to pass it between a pair of pressure rolls at about 100°C. The above explanation has mainly focused on the case where metal foil is laminated on one side of a synthetic resin film, but it goes without saying that metal foil may be laminated on both sides of a synthetic resin film in the present invention. .
厚さ9μのアルミニウム箔の片面にエポキシ系
樹脂溶液（田中インキ(株)製；AVON）をグラビ
アコータ法で塗布し、厚さ3μのエポキシ系樹脂
層をアルミニウム箔の片面に設けた。
このエポキシ系樹脂層上にウレタン系接着剤
（東洋モートン(株)製；アドコート）を、厚さ5μに
なるように、グラビアコーター法で塗布した。そ
の後、厚さ38μのポリエチレンテレフタレートフ
イルム（東レ(株)製；ルミラー）をウレタン系接着
剤上に重ね、直ちにこの積層物を温度70℃に加熱
された一対の加熱ロール間に通して、アルミニウ
ム箔とポリエチレンテレフタレートフイルムとを
貼合して、フレキシブルプリント配線基板を得
た。
このフレキシブルプリント配線基板のアルミニ
ウム箔上に、所定の図柄で光硬化型感光性樹脂を
塗布し、紫外線を照射してこの感光性樹脂を硬化
させてマスキングを施した。これを、エツチング
溶液（40％の塩化第二鉄溶液）中に浸漬し、40℃
で１分間処理し、非マスキング部分のアルミニウ
ム箔部分（非配線部分）を溶解除去して、更にマ
スキング除去処理及び脱脂処理としてジクロルエ
タンとトリクロルエタンとの混合溶液にデイツピ
ングし、乾燥してフレキシブルプリント配線基板
を得た。
このようにして得られた配線板は、配線部分の
アルミニウム箔には浮き上がりが見られず、非配
線部分に露出しているエポキシ系樹脂層はタツキ
ネスも殆ど無く、更に配線部分にハンダ付けを行
つてもエポキシ系樹脂層が燃えたり或いは焦げた
りすることは無かつた。
An epoxy resin solution (manufactured by Tanaka Ink Co., Ltd.; AVON) was coated on one side of a 9μ thick aluminum foil using a gravure coater method, and a 3μ thick epoxy resin layer was provided on one side of the aluminum foil. On this epoxy resin layer, a urethane adhesive (manufactured by Toyo Morton Co., Ltd.; Adcoat) was applied to a thickness of 5 μm using a gravure coater method. Then, a polyethylene terephthalate film (manufactured by Toray Industries, Inc.; Lumirror) with a thickness of 38 μm was layered on top of the urethane adhesive, and the laminate was immediately passed between a pair of heated rolls heated to 70°C to remove aluminum foil. and a polyethylene terephthalate film to obtain a flexible printed wiring board. A photocurable photosensitive resin was applied in a predetermined pattern onto the aluminum foil of this flexible printed wiring board, and the photosensitive resin was cured by irradiation with ultraviolet rays to perform masking. This was immersed in an etching solution (40% ferric chloride solution) at 40°C.
for 1 minute to dissolve and remove the non-masking aluminum foil portion (non-wiring portion), and then dip in a mixed solution of dichloroethane and trichloroethane for masking removal and degreasing, and dry to form flexible printed wiring. I got the board. In the wiring board thus obtained, no lifting was observed in the aluminum foil in the wiring area, there was almost no tackiness in the epoxy resin layer exposed in the non-wiring area, and the wiring area was soldered. However, the epoxy resin layer did not burn or become scorched.
以上説明したように、本発明に係るフレキシブ
ルプリント配線基板は、金属箔−エポキシ系樹脂
層−ウレタン系接着剤−合成樹脂製フイルムの順
に積層されてなるものであるため、配線板とした
ときに非配線部分にはエポキシ系樹脂層が露出し
ている。
エポキシ系樹脂層は耐溶剤性に優れているた
め、配線板作成の際のマスキング除去処理時及び
脱脂処理時において、それらの有機溶剤でエポキ
シ系樹脂が侵されることが少ない。従つて、配線
部分における金属箔が浮き上がることを防止で
き、配線板を電子機器等に組み込んだとき、短絡
を防止しうるという効果を奏する。
また、エポキシ系樹脂層は高温で硬化するた
め、活性基の残留が少なく、タツキネスが殆ど無
い。従つて、得られた配線板の非配線部分にエポ
キシ系樹脂層が露出していても、その部分にタツ
キネスが殆ど無く、配線板を積み重ねて保存又は
輸送しても、配線板同士が相互にくつつきにく
い。依つて、積み重ねた配線板を使用時におい
て、一枚ずつ良好に剥離でき、剥離時に配線部分
が損傷したり、配線板自体が破れるのを防止しう
るという効果を奏する。
更に、エポキシ系樹脂層は耐熱性に優れている
ため、配線部分に導線等をハンダ付けする際に
も、非配線部分に露出しているエポキシ系樹脂層
が燃えたりあるいは焦げたりすることが少ない。
従つて、ハンダ付けの際に作業者を火傷の危険か
ら回避し、また配線板中にゴミが残留しにくいの
で配線板に故障を惹起させにくいてという効果を
奏する。
なお、本発明に係るフレキシブルプリント配線
基板は、ウレタン系接着剤を用い、且つ比較的低
温で処理して、金属箔と合成樹脂製フイルムとを
貼合することができるので、合成樹脂製フイルム
が収縮しにくく、従つて金属箔にシワが生じにく
く、均一な品質を維持しうるという効果を奏す
る。
As explained above, the flexible printed wiring board according to the present invention is formed by laminating metal foil, epoxy resin layer, urethane adhesive, and synthetic resin film in this order. The epoxy resin layer is exposed in non-wiring areas. Since the epoxy resin layer has excellent solvent resistance, the epoxy resin is less likely to be attacked by these organic solvents during masking removal treatment and degreasing treatment during wiring board production. Therefore, it is possible to prevent the metal foil in the wiring portion from lifting up, and when the wiring board is incorporated into an electronic device or the like, there is an effect that short circuits can be prevented. Furthermore, since the epoxy resin layer is cured at high temperature, there are few active groups remaining and there is almost no tackiness. Therefore, even if the epoxy resin layer is exposed in the non-wiring area of the obtained wiring board, there is almost no tackiness in that area, and even if the wiring boards are stacked and stored or transported, the wiring boards will not touch each other. It's hard to scratch. Therefore, when the stacked wiring boards are used, they can be easily peeled off one by one, and the wiring parts are prevented from being damaged or the wiring boards themselves are prevented from being torn during peeling. Furthermore, since the epoxy resin layer has excellent heat resistance, the epoxy resin layer exposed in non-wiring areas is unlikely to burn or burn when soldering conductors, etc. to wiring areas. .
Therefore, it is possible to avoid the danger of burns to the operator during soldering, and since dust is less likely to remain in the wiring board, it is less likely to cause a failure in the wiring board. The flexible printed wiring board according to the present invention can be bonded to a metal foil and a synthetic resin film by using a urethane adhesive and processing at a relatively low temperature. It is difficult to shrink, therefore, wrinkles are not easily generated in the metal foil, and uniform quality can be maintained.
Claims (1)
ン系接着剤で貼合したフレキシブルプリント配線
基板において、該金属箔とポリウレタン系接着剤
との間にエポキシ系樹脂層が介在されてなること
を特徴とするフレキシブルプリント配線基板。1. A flexible printed wiring board in which a synthetic resin film and a metal foil are bonded together with a polyurethane adhesive, characterized in that an epoxy resin layer is interposed between the metal foil and the polyurethane adhesive. Flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6145089A JPH02239691A (en) | 1989-03-13 | 1989-03-13 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6145089A JPH02239691A (en) | 1989-03-13 | 1989-03-13 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02239691A JPH02239691A (en) | 1990-09-21 |
| JPH0561794B2 true JPH0561794B2 (en) | 1993-09-07 |
Family
ID=13171401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6145089A Granted JPH02239691A (en) | 1989-03-13 | 1989-03-13 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02239691A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048800A (en) * | 2005-08-08 | 2007-02-22 | Nippon Foil Mfg Co Ltd | Antenna coil for ic card and manufacturing method therefor |
-
1989
- 1989-03-13 JP JP6145089A patent/JPH02239691A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048800A (en) * | 2005-08-08 | 2007-02-22 | Nippon Foil Mfg Co Ltd | Antenna coil for ic card and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02239691A (en) | 1990-09-21 |
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