JPS63318796A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPS63318796A JPS63318796A JP15511487A JP15511487A JPS63318796A JP S63318796 A JPS63318796 A JP S63318796A JP 15511487 A JP15511487 A JP 15511487A JP 15511487 A JP15511487 A JP 15511487A JP S63318796 A JPS63318796 A JP S63318796A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit pattern
- film
- adhesives
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000011888 foil Substances 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229920001721 polyimide Polymers 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 3
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000002699 waste material Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野） 本発明は回路基板の製造法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing a circuit board.
従来の回路基板の通常の製造法は、絶縁シート上に導電
性の箔たとえば銅箔等をラーネートし、その上に回路パ
ターンをスクリーン印刷により印刷し、次いで印刷した
回路パターンだけを残すように余分な箔部分をエンジン
グで除去して回路を形成する方法である。The usual manufacturing method for conventional circuit boards is to laanate a conductive foil, such as copper foil, on an insulating sheet, print a circuit pattern on it by screen printing, and then remove excess material so that only the printed circuit pattern remains. In this method, a circuit is formed by removing the foil portion using engraving.
周知の通り回路１＆仮としては、基板自体が柔軟性を有
しないものの他に、所謂Ｆ Ｐ Ｃ（Ｆｌｅｘｉｂｌｅ
Ｐｒｌｎｔｅｄ Ｃ１ｒｃｕｉｔ）と呼ばれる柔軟乃至
可撓性を冑する回路基板があり、更には主にパワーモジ
エールに良く使用されるヒートシンク付きの混成集積回
路基板（）ｉ Ｉ Ｃ）も開発されている。As is well known, the circuit 1 &
There is a flexible or flexible circuit board called Prlnted C1rcuit, and furthermore, a hybrid integrated circuit board with a heat sink that is often used mainly in power modules has also been developed.
ＦＰＣでは絶縁シートに柔軟乃至可撓性を有せしめるた
めに導電性の薄い箔、通常は銅箔をラミネートすると共
に絶縁シートとしてたとえばエポキシ樹脂含浸ガラスク
ロス積層板を使用するものである。またＨＩＣでは発生
する熱量を考慮して耐熱性のあるポリイミド等の耐熱性
樹脂シートを絶縁シートとして使用し、更に放熱のため
のＡＩ。In FPC, a conductive thin foil, usually a copper foil, is laminated to give the insulating sheet flexibility or flexibility, and an epoxy resin-impregnated glass cloth laminate, for example, is used as the insulating sheet. In addition, in consideration of the amount of heat generated in HIC, heat-resistant resin sheets such as heat-resistant polyimide are used as insulation sheets, and AI is used for heat dissipation.
Ｃｕ ＳＰ ｅ等から成るヒートシンク層を設けている
ものである。A heat sink layer made of Cu SP e or the like is provided.
そしていずれの回路基板でも通常は上記した製法で製造
されることが極めて多い。All types of circuit boards are usually manufactured using the above-mentioned manufacturing method.
しかしながらこの方法に依ると次の様な難点がある。即
ち先ず第一に余分な導電性箔をエンジングで溶かして除
去するために極めて無駄が多く惹いてはコスト高となる
０次いで第二番目の難点として排液中に銅の如き重金属
を含むエッジンダ液が含まれるために、これをそのま々
放棄することは出来ず、排液処理のための余分な設備が
必要と〔発明が解決しようとする問題点〕
本発明が解決しようとする問題点は、上記従来の回路基
板の製造法に於ける上記難点を解消することであり、こ
れを換言すば、銅箔等の導電性箔の無駄を無くし、且つ
排液処理を特に必要としないこの種回路基板の新しい製
造法を開発することである。However, this method has the following drawbacks. First of all, the extra conductive foil is removed by melting it with an engine, which is very wasteful and increases the cost.Secondly, the second problem is that the waste liquid contains heavy metals such as copper. Since it contains liquid, it cannot be completely discarded, and extra equipment is required to treat the waste liquid. [Problems to be Solved by the Invention] Problems to be Solved by the Invention The purpose of this method is to eliminate the above-mentioned difficulties in the conventional circuit board manufacturing method. In other words, this method eliminates the waste of conductive foil such as copper foil, and does not require any special drainage treatment. The objective is to develop a new manufacturing method for circuit boards.
（問題点を解決するための手段〕
この問題点は、接着剤によって前もって回路パターンを
絶縁基板上に形成し、この＋ｈに導体粉末をその回路パ
ターン上に付着させて回路を形成することによって解決
される。(Means for solving the problem) This problem can be solved by forming a circuit pattern in advance on an insulating substrate using adhesive, and then depositing conductive powder on the circuit pattern to form a circuit. be done.
即ち本発明は 絶縁シートに回路パターンを接着剤で形
成し、次いでその上に導電製粉末を付着させた後加熱し
工導体回路を形成することを特徴とする回路基板の製造
法にかかるものである。That is, the present invention relates to a method for manufacturing a circuit board, which is characterized in that a circuit pattern is formed on an insulating sheet using an adhesive, and then a conductive powder is attached thereon and then heated to form a conductive circuit. be.
本発明に於いては、絶縁シート上に接着剤を用いて回路
パターンを先ず形成し、次いでその上に導電粉末を付着
させることにより回路を形成するので、導体の余剰部分
を除去する必要がなく、無駄無く導体材料を使用するこ
とが出来、従来の如き導電箔の無駄を無くすことが可能
となる。In the present invention, the circuit is formed by first forming the circuit pattern on the insulating sheet using an adhesive and then adhering conductive powder thereon, so there is no need to remove the excess portion of the conductor. Therefore, the conductive material can be used without waste, and it is possible to eliminate the waste of conductive foil as in the past.
また余分な導電箔部分をエンジングで除去する必要が全
（ないので、排液処理という余分な操作や設備が不要と
なり工業上極めて有利となる。In addition, since there is no need to remove the excess conductive foil portion by enginging, there is no need for extra operations and equipment such as drainage treatment, which is extremely advantageous industrially.
加えて従来方法に於いては、回路パターンとして立体的
なものを製造する際には、回路パターンを形成後、折り
曲げ加工等を施していたが、この従来方法では折り曲げ
加工等を施すと形成された導電回路を剥離するという難
点があったが本発明法に依るとこの難点も解消すること
が出来る。即ち予め絶縁シートを立体となした後、ある
いは立体状絶縁体に接着剤で回路パターンを形成してお
き、その上から導電性粉末をたとえば吹き付け、流動浸
漬等により付着させることが出来るので、回路形成後折
り曲げる必要がなく、導体の剥離等が生じない。In addition, in the conventional method, when manufacturing a three-dimensional circuit pattern, the circuit pattern was formed and then subjected to a bending process. However, this problem can be overcome by the method of the present invention. In other words, after forming an insulating sheet into a three-dimensional shape in advance, or by forming a circuit pattern on a three-dimensional insulator with adhesive, conductive powder can be applied onto it by spraying, fluid dipping, etc., so that the circuit pattern can be formed. There is no need to bend the conductor after formation, and peeling of the conductor does not occur.
本発明に於いて使用される絶縁シートとしては従来から
この種分野に於いて使用されて来たものがいずれも使用
出来、たとえば好ましい具体例としてポリエステルフィ
ルム、ポリイミドフィルム等、誘電率が小さく高周波回
路に好適なポリエーテルスルホンフィルム、ポリエーテ
ルケトンフィルム、ポリエーテルイミドフィルム等、更
には各種セラミック板、エポキシ含浸ガラスクロス積層
板等を例示出来る。これ等絶縁シートは得られる回路基
板の使用目的に合わせて適宜に選択して使用され、たと
えばＦＰＣ用としては、エポキシ含浸ガラスクロス積層
板、ポリイミドフィルム等をまたＨＩＣ用としては、耐
熱性の大きいポリイミド等を使用すれば良い、また必要
に応じこれ等フィルムに他の材料たとえばＡ １ ｓ
Ｆ ｅ ｓ Ｃｕ等を裏打ちして使用しても良い、これ
等裏打ち材を使用したものは特にＨＩＣとして好適であ
る。As the insulating sheet used in the present invention, any insulating sheet that has been conventionally used in this type of field can be used. For example, preferred specific examples include polyester film, polyimide film, etc., which have a low dielectric constant and are used in high frequency circuits. Suitable examples include polyether sulfone film, polyether ketone film, polyetherimide film, etc., as well as various ceramic plates, epoxy-impregnated glass cloth laminates, etc. These insulating sheets are appropriately selected and used depending on the purpose of use of the obtained circuit board. For example, for FPC, epoxy-impregnated glass cloth laminates, polyimide films, etc. are used, and for HIC, materials with high heat resistance are used. Polyimide etc. may be used, and if necessary, other materials such as A 1 s may be used for these films.
It may be used with a backing such as F e S Cu, and those using such a backing material are particularly suitable as HIC.
これ等絶縁シート上に接着剤でもって回路パターンを形
成するが、この際使用される接着剤としては各種の接着
剤が使用出来るが特にエポキシ系接着剤またはエポキシ
樹脂をゴム、フェノール樹脂等で変性した接着剤が好ま
しく、その具体例としてｒＡＨ−３３３Ｊ及びｒＡＨ−
３６６Ｊ （いずれも三井鉱油化学社製）を例示出来
る。接着剤を用いて回路パターンを形成する手段は同等
限定されず、回路パターンが形成出来る手段であればど
の様な手段でも良く、また使用する接着剤の量として充
分に絶縁シート上に導体粉末が付着するに充分な量で良
い。A circuit pattern is formed on these insulating sheets with an adhesive. Various adhesives can be used at this time, but in particular, epoxy adhesives or epoxy resins modified with rubber, phenolic resin, etc. Preferred adhesives include rAH-333J and rAH-
366J (both manufactured by Mitsui Mining and Oil Chemicals) can be exemplified. The means for forming a circuit pattern using an adhesive is not equally limited; any means that can form a circuit pattern may be used, and the amount of adhesive used is such that the conductor powder is sufficiently coated on the insulating sheet. Just enough amount to stick.
本発明に於いては、次いでこの上に導体粉末を付着させ
るが、この際の手段も特に限定されない。In the present invention, conductor powder is then deposited thereon, but the means for doing so is not particularly limited.
但し立体絶縁体の場合には、上記した通り吹き付けや流
動浸漬法に依るのが好ましい、導体粉末としては、導電
性のある粉末が広く使用され、たとえばＣｕ、ＡＩ、Ａ
ｕ粉の１種または２種以上の混合粉末を代表例として挙
げることが出来る。この際の粉末の粒度は通常１μ−〜
３０μｍ程度であるが、これよりも微粒となっていても
良い。However, in the case of three-dimensional insulators, it is preferable to use the spraying or fluidized dipping method as described above.As the conductor powder, conductive powders are widely used, such as Cu, AI, A
A typical example is a mixed powder of one or more types of U powder. The particle size of the powder at this time is usually 1 μ-~
Although the particle size is approximately 30 μm, it may be finer than this.
かくして回路が一応形成された後、これを加熱して充分
に一体化させて電気回路を形成することが出来る。この
際の加熱は接着剤が充分に硬化するに必要な温度で良い
。Once the circuit has been formed in this way, it can be heated to fully integrate it to form an electrical circuit. The heating at this time may be at a temperature necessary to sufficiently cure the adhesive.
以下に実施例を挙げて本発明をより具体的に説明する。 EXAMPLES The present invention will be described in more detail with reference to Examples below.
実施例１
２５μｍの厚みのポリイミドフィルム上に「ＡＨ−３３
３４を用いて回路パターンを描き、１２０℃で５分間乾
燥後、流動浸漬法により平均粒径ｌＯμ■〜１５μ■の
銅粉を均一に付着させ、１８０℃で４０分加熱して回路
基板を製造した。Example 1 “AH-33
After drying at 120℃ for 5 minutes, copper powder with an average particle size of 10μ■ to 15μ■ was applied uniformly using the fluidized dipping method, and the circuit board was manufactured by heating at 180℃ for 40 minutes. did.
実施例２
０．５鶴の厚みのＡＩ板にｒＡＨ−３３３Ｊを用いて２
５μｍの厚さのポリイミドフィルムを貼り合わせた後、
同じ接着剤を用いて回路パターンを描き、１２０℃で５
分間乾燥した０次いで曲げ加工を施した後、実施例１と
同様に処理して導体回路を製造した。Example 2 Using rAH-333J on an AI plate with a thickness of 0.5
After laminating a 5 μm thick polyimide film,
Draw a circuit pattern using the same adhesive and heat it at 120℃ for 5 minutes.
After drying for a minute and then bending, the same process as in Example 1 was carried out to produce a conductor circuit.
本発明法に依れば、極めて容易に節単にしがち排液処理
も不要で導体の無駄なく、導体回路を製造することが出
来る。このため極めて産業上の利益は大きい。According to the method of the present invention, a conductor circuit can be manufactured very easily and economically, without requiring drainage treatment and without wasting conductors. Therefore, the industrial benefits are extremely large.
（以上）(that's all)
Claims (1)
いでその上に導電製粉末を付着させた後加熱して導体回
路を形成することを特徴とする回路基板の製造法。(1) A method for manufacturing a circuit board, which comprises forming a circuit pattern on an insulating sheet with an adhesive, then adhering a conductive powder thereon, and then heating it to form a conductor circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15511487A JPS63318796A (en) | 1987-06-22 | 1987-06-22 | Manufacture of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15511487A JPS63318796A (en) | 1987-06-22 | 1987-06-22 | Manufacture of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63318796A true JPS63318796A (en) | 1988-12-27 |
Family
ID=15598892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15511487A Pending JPS63318796A (en) | 1987-06-22 | 1987-06-22 | Manufacture of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63318796A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02180089A (en) * | 1988-12-30 | 1990-07-12 | Canon Inc | Forming method for conductive circuit |
-
1987
- 1987-06-22 JP JP15511487A patent/JPS63318796A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02180089A (en) * | 1988-12-30 | 1990-07-12 | Canon Inc | Forming method for conductive circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW507510B (en) | Method of manufacturing multi layered printed circuit board using adhesive film | |
| US4555414A (en) | Process for producing composite product having patterned metal layer | |
| RU2214698C2 (en) | Heat removing facility, electric system including heat removing facility, process of manufacture of heat removing facility and of electric component | |
| EP0152634B1 (en) | Method for manufacture of printed wiring board | |
| US7259333B2 (en) | Composite laminate circuit structure | |
| JPS63199497A (en) | Multilayer printed interconnection board | |
| US5779836A (en) | Method for making a printed wiring board | |
| JPS63318796A (en) | Manufacture of circuit board | |
| NL7906603A (en) | METHOD FOR MANUFACTURING A MULTIPLE LAYERING A CARDBOARD | |
| JPS58153390A (en) | Substrate material for printed circuit and method of producing same | |
| JPH0199289A (en) | Wiring board and manufacture thereof | |
| JPH10284814A (en) | Circuit pattern and its formation | |
| JPH08125294A (en) | Metal base board and manufacture thereof | |
| JPS5921095A (en) | Method of producing multilayer printed circuit board | |
| JPS62189796A (en) | Manufacture of multilayer printed wiring board | |
| JP2002290036A (en) | Method of manufacturing wiring board | |
| JPH1034649A (en) | Manufacture of prepreg in circuit board | |
| JPS62122295A (en) | Highly conductive electric circuit and manufacture of the same | |
| JPS641955B2 (en) | ||
| JP2002353032A (en) | Multilayer build-up printed board and its producing method | |
| JP2003158371A (en) | Circuit board and manufacturing method therefor | |
| JPS62186589A (en) | Manufacture of circuit board | |
| JPH0220155B2 (en) | ||
| JPS61276292A (en) | Circuit transfer body and transfer method | |
| JPH0451079B2 (en) |