JPS58202585A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board, particularly a circuit board that requires a large current, or a circuit board that has higher performance for acoustic use. The present invention relates to a method of manufacturing a printed wiring board having foil.

There are various methods for manufacturing conventional printed wiring boards, but among them, copper foil with a conductor thickness of about 35 microns is bonded to a phenolic resin board with an adhesive, etc.
A typical method is to form a necessary circuit pattern by an etching method or the like.

In the conventional method for manufacturing printed wiring boards as described above, due to limitations in the manufacturing method, it is difficult to increase the thickness of the conductor foil. They were not optimal for circuits that required current or circuits that required high performance and high quality such as audio equipment.

The present invention has been made in order to eliminate the drawbacks of the conventional ones as described in (1) above.The metal conductor foil with a mount is half-cut in the shape of an inverted circuit pattern, and a heat-sensitive or pressure-sensitive adhesive is applied to the insulating substrate. By forming a circuit pattern, placing the circuit component part of the metal conductor foil in contact with the adhesive layer, bonding by heating or applying pressure, and removing unnecessary parts of the mount and metal conductor foil. , it is an object of the present invention to provide a method for manufacturing a printed wiring board that can relatively inexpensively manufacture a printed wiring machine having a circuit portion made of a metal conductor having a thickness of about 100 microns or more.

An embodiment of the present invention will be described below with reference to the drawings.

1 to 4 are vertical cross-sectional views showing each manufacturing process in an example of manufacturing a printed wiring board for a dividing network circuit of a speaker device, and FIG. 1 shows a metal conductor foil with a mount. Figure 2 shows a state in which a patterned adhesive has been applied to an insulating board; Figure 3 shows a state in which a metal conductor foil held by a mount has been temporarily adhered to an insulating board. , FIG. 4 shows the state in which the printed wiring board is completed after removing the unnecessary parts of the mount and the metal conductor foil. In the figure, (ll
Fi metal conductor foil, "44) is a mount for holding this gold M conductor foil, (3) is a blade type for half-cutting, (4) is a metal conductor foil (
1) is the circuit configuration part, (5) is the remaining unnecessary part of i, (
6) is an insulating substrate, (the force is heat-sensitive or pressure-sensitive adhesive).

The manufacturing method is 1. As shown in Figure 1, metal conductor foil (1)
A metal conductor foil (1) with a mount (2) pasted on one side of the metal conductor foil (1) is cut from the metal conductor foil side using a blade (3), leaving only the mount (2) part. , cut out half of the pattern that makes up the circuit into an inverted shape. The metal conductor foil (1) separated by the cutting edge (3) is divided into a circuit-constituting portion (4) and an unnecessary portion (5). Next, as shown in FIG. 2, a t
Apply heat-sensitive or pressure-sensitive adhesive (by applying force such as printing,
Form adhesive (7) layer. Next, as shown in Figure 3, the metal conductor foil (1) held by the mount (2)
Invert the circuit component part (4) of the metal conductor foil (1).
The adhesive (7) on the insulating substrate (6) is placed so that it is in contact with the adhesive, and is heated or pressed in a direction from the mount (2) side using a hot press or a press to pre-bond it. At this stage, the adhesive (7) is in a semi-hardened state.

Next, as shown in Figure 4, the mount (2) and the metal conductor foil (
Remove the unnecessary part (5) of 1), leave only the circuit component part (4), and heat or pressurize it again from the metal foil (1) side in direction B. The adhesive (7) will completely harden. state, and the circuit component (4) of the metal conductor foil (lj) is glued to the adhesive (
7) to completely adhere to the insulating substrate (6)] to complete a series of steps.

In addition, in the previous hI4 embodiment, as shown in FIG.
The unnecessary part (5) of the metal conductor foil (1) is removed, and as shown in Figure 4, it is finally glued. Immediately after half-cutting (1), remove the unnecessary part (5) of the metal conductor foil (1),
It is also possible to proceed to the process shown in FIG.

In the above description, the type of adhesive is not limited as long as it is heat-sensitive or pressure-sensitive, and may be heat-sensitive or pressure-sensitive, and the application method is not limited to the printing method. The adhesion method and half-cutting method for the metal conductor foil are also not limited to those described above. Furthermore, the manufacturing method of the present invention is not limited to the printed wiring board for the circuit of the dividing network of the speaker device, but is similarly applicable to the manufacturing of other printed wiring boards.

As described above, according to the present invention, a metal conductor foil with a mount is half cut out in the shape of an inverted circuit pattern, and a heat-sensitive or pressure-sensitive adhesive is formed on an insulating substrate in the shape of a circuit pattern, and the adhesive layer is The structure is such that the circuit components of the metal conductor foil are placed in contact with each other, and the circuit components are bonded by heating or pressurizing, and unnecessary parts of the mount and the metal conductor foil are removed. Printed wiring boards with patterns can be manufactured without chemical processing such as etching, the manufacturing method is easy, and there is no need to introduce expensive specialized equipment such as the die stamping method. It has the advantage of being relatively inexpensive and producing a printed wiring board with excellent performance.

[Brief explanation of the drawing]

1 to 4 are vertical cross-sectional views showing each step of a method for manufacturing a printed wiring board according to an embodiment of the present invention. In the figure, (1) is metal conductor foil, (2) is mount, (3 is
) is the blade shape, (4) is the circuit component, (5) is the unnecessary part,
(6) is an insulating substrate, and (7) is a heat-sensitive or pressure-sensitive adhesive. In each figure, the same reference numerals indicate the same or corresponding parts. Agent Shin Kuzuno - (1 other person) /71 Figure 1 Figure 2 Figure 3 Figure 4

Claims (4)

[Claims] (1) A process of half-cutting the metal conductor foil with a mount, which is made by pasting a mount on one side of the metal conductor foil, into the reverse shape of the circuit pattern, leaving only the mount part; A process of forming a heat-sensitive or pressure-sensitive adhesive layer in the form of a circuit pattern on one side, and bonding these half-cut metal conductor foil with mount and insulating board with adhesive to the circuit component part of the metal conductor foil. A print characterized by the following steps: placing the adhesive so that they are in contact with each other and applying heat or pressure from above the mount to adhere the circuit component and the insulating substrate; and removing unnecessary parts of the mount and the metal conductor foil. Method of manufacturing wiring boards. (2) The method for manufacturing a printed wiring board according to claim 1, wherein unnecessary portions of the metal conductor foil are removed immediately after half-cutting. (3) The method for manufacturing a printed wiring board according to claim 1, wherein the unnecessary portion of the metal conductor foil is removed at the same time as the mount is removed. (4) The step of bonding the metal conductor foil and the insulating substrate includes temporary bonding before removing the mount and main bonding after removal. A method of manufacturing the printed wiring board described.