JPH0574937B2 - - Google Patents

Info

Publication number
JPH0574937B2
JPH0574937B2 JP59234930A JP23493084A JPH0574937B2 JP H0574937 B2 JPH0574937 B2 JP H0574937B2 JP 59234930 A JP59234930 A JP 59234930A JP 23493084 A JP23493084 A JP 23493084A JP H0574937 B2 JPH0574937 B2 JP H0574937B2
Authority
JP
Japan
Prior art keywords
wafer
microwave
temperature
sample
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59234930A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61114543A (ja
Inventor
Yoshihisa Fujisaki
Yukio Takano
Akihiko Matsuo
Takeshi Tajima
Matsuo Yamazaki
Kenjiro Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP23493084A priority Critical patent/JPS61114543A/ja
Publication of JPS61114543A publication Critical patent/JPS61114543A/ja
Publication of JPH0574937B2 publication Critical patent/JPH0574937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP23493084A 1984-11-09 1984-11-09 半導体評価装置 Granted JPS61114543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23493084A JPS61114543A (ja) 1984-11-09 1984-11-09 半導体評価装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23493084A JPS61114543A (ja) 1984-11-09 1984-11-09 半導体評価装置

Publications (2)

Publication Number Publication Date
JPS61114543A JPS61114543A (ja) 1986-06-02
JPH0574937B2 true JPH0574937B2 (enrdf_load_stackoverflow) 1993-10-19

Family

ID=16978501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23493084A Granted JPS61114543A (ja) 1984-11-09 1984-11-09 半導体評価装置

Country Status (1)

Country Link
JP (1) JPS61114543A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101506B2 (ja) * 1985-01-30 1994-12-12 三菱マテリアル株式会社 ガリウム砒素半導体ウェ−ハのel2分布測定方法
JPH02248062A (ja) * 1989-03-20 1990-10-03 Semitetsukusu:Kk 半導体材料のライフタイム計測方法及びその装置
JP5301770B2 (ja) * 2006-08-25 2013-09-25 株式会社神戸製鋼所 薄膜半導体の結晶性測定装置及びその方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53118373A (en) * 1977-03-25 1978-10-16 Mitsubishi Metal Corp Method of measuring characteristic of semiconductor by microwave
JPS59114834A (ja) * 1982-12-21 1984-07-03 Agency Of Ind Science & Technol 半導体中に含まれる深い不純物準位或いは結晶欠陥準位の測定方法

Also Published As

Publication number Publication date
JPS61114543A (ja) 1986-06-02

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