JPH0574779A - Bump forming method - Google Patents
Bump forming methodInfo
- Publication number
- JPH0574779A JPH0574779A JP3237681A JP23768191A JPH0574779A JP H0574779 A JPH0574779 A JP H0574779A JP 3237681 A JP3237681 A JP 3237681A JP 23768191 A JP23768191 A JP 23768191A JP H0574779 A JPH0574779 A JP H0574779A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ball
- capillary tool
- bump
- capillary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はバンプ形成方法に関し、
詳しくは、ワイヤボンディング手段により、バンプ高に
ばらつきのないバンプを形成するための手段に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump forming method,
More specifically, the present invention relates to means for forming bumps with uniform bump heights by wire bonding means.
【０００２】[0002]
【従来の技術】ワイヤボンディング手段により、半導体
にバンプを形成してフリップチップを製造することが知
られている。ワイヤボンディング手段は、キャピラリツ
ールから導出されたワイヤの下端部にトーチ電極を接近
させてボールを形成し、次いでこのボールをキャピラリ
ツールの下端部により半導体の電極を押し付けてボンデ
ィングし、次いでクランパーによりワイヤをクランプし
て、ワイヤを引き上げることにより、ボールとワイヤの
接合部からワイヤを切断して、バンプを形成するもので
ある。2. Description of the Related Art It is known that bumps are formed on a semiconductor by wire bonding means to manufacture a flip chip. The wire bonding means forms a ball by bringing the torch electrode close to the lower end of the wire led out from the capillary tool, and then bonding the ball by pressing the semiconductor electrode by the lower end of the capillary tool and then by the clamper. Is clamped and the wire is pulled up to cut the wire from the joint between the ball and the wire to form a bump.
【０００３】図５は、従来手段により形成されたバンプ
を示すものであって、７′はバンプ、９は半導体であ
る。FIG. 5 shows a bump formed by conventional means, where 7'is a bump and 9 is a semiconductor.
【０００４】[0004]
【発明が解決しようとする課題】ところが上記従来のワ
イヤボンディング手段は、ワイヤを引き上げて切断する
場合のワイヤの切断箇所が安定せず、ワイヤの切れ残り
７ａが長短様々にバンプ７′から残存突出し、このため
バンプ高Ｈがばらつきやすい問題があった。However, in the above-mentioned conventional wire bonding means, when the wire is pulled up and cut, the cut portion of the wire is not stable, and the uncut portion 7a of the wire remains protruding from the bump 7'in various lengths. Therefore, there is a problem that the bump height H easily varies.
【０００５】[0005]
【課題を解決するための手段】本発明は、（ａ）キャピ
ラリツールから導出されたワイヤの下端部に、トーチ電
極によりボールを形成する工程と、（ｂ）キャピラリツ
ールを下降させて、上記ボールを半導体の電極に押し付
ける工程と、（ｃ）キャピラリツールを上昇させた後、
再度下降させることにより、ワイヤのボールからの立ち
上り部をキャピラリツールの下面によりボールの上面に
押し付ける工程と、（ｄ）キャピラリを上昇させて、ク
ランパーによりワイヤをクランプして引き上げることに
より、ワイヤとボールの接合部からワイヤを切断する工
程、とからバンプ形成方法を構成している。According to the present invention, (a) a step of forming a ball with a torch electrode at the lower end of a wire led out from a capillary tool, and (b) lowering the capillary tool to move the ball Is pressed against the semiconductor electrode, and (c) after raising the capillary tool,
By lowering it again, the rising part of the wire from the ball is pressed against the upper surface of the ball by the lower surface of the capillary tool, and (d) the capillary is lifted and the wire is clamped and lifted by the clamper And the step of cutting the wire from the joint portion of the above, and the bump forming method.
【０００６】[0006]
【作用】上記構成において、ワイヤの下端部に形成され
たボールを、キャピラリツールにより半導体の電極に押
し付けてボンディングし、次いでキャピラリツールを上
昇させた後、再度下降させることにより、キャピラリツ
ールの下面によりワイヤの立ち上り部をボールの上面に
押し付け、ボールの上面をフラットに加圧整形する。次
いでクランパーによりワイヤをクランプして引き上げる
ことにより、ワイヤとボールの接合部からワイヤを切断
する。In the above structure, the ball formed at the lower end of the wire is pressed against the electrode of the semiconductor by the capillary tool for bonding, and then the capillary tool is raised and then lowered again, so that the lower surface of the capillary tool is lowered. The rising part of the wire is pressed against the upper surface of the ball, and the upper surface of the ball is pressed and shaped into a flat shape. Next, the wire is cut from the joint between the wire and the ball by clamping and pulling the wire with a clamper.
【０００７】[0007]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００８】図１はバンプ形成装置の斜視図である。１
はホーンであり、その先端部にキャピラリツール２が保
持されている。３はキャピラリツール２に挿通されたワ
イヤ、４，５はワイヤ３をクランプするテンションクラ
ンパーとカットクランパーである。６はトーチ電極であ
って、揺動運動することにより、ワイヤ３の下端部に接
近し、電気的スパークにより、ワイヤ３の下端部にボー
ル７を形成する。８は半導体としてのウェハーであり、
後工程において、破線に沿ってダイシングすることによ
り、多数個の半導体チップ９に分割し、フリップチップ
を得る。１０はチップ９の上面に形成された電極であ
り、この電極１０に、上記ボール７をボンディングす
る。FIG. 1 is a perspective view of a bump forming apparatus. 1
Is a horn, and the capillary tool 2 is held at its tip. 3 is a wire inserted through the capillary tool 2, and 4 and 5 are a tension clamper and a cut clamper for clamping the wire 3. Reference numeral 6 denotes a torch electrode, which moves by swinging to approach the lower end of the wire 3 and forms a ball 7 at the lower end of the wire 3 by electrical spark. 8 is a wafer as a semiconductor,
In a later step, by dicing along the broken line, it is divided into a large number of semiconductor chips 9 to obtain flip chips. Reference numeral 10 denotes an electrode formed on the upper surface of the chip 9, and the ball 7 is bonded to the electrode 10.
【０００９】本装置は上記のような構成より成り、次に
図２を参照しながら、動作の説明を行う。The present apparatus has the above-mentioned structure, and its operation will be described with reference to FIG.
【００１０】キャピラリツール２から導出されたワイヤ
３の下端部にトーチ電極６を接近させ、電気的スパーク
によりワイヤ３の下端部にボール７を形成する（図２
（ａ））。次いでトーチ電極６を側方へ退去させたうえ
で、キャピラリツール２を下降させ、ボール７をチップ
９の電極１０に押し付けてボンディングする（同図
（ｂ））。次いでキャピラリツール２を上側方へわずか
に上昇させ（同図（ｃ））、次いで再度下降させること
により、キャピラリツール２の下面により、ワイヤ３を
ボール７の上面に押し付ける（同図（ｄ））。The torch electrode 6 is brought close to the lower end of the wire 3 led out from the capillary tool 2, and a ball 7 is formed at the lower end of the wire 3 by electrical spark (FIG. 2).
(A)). Then, the torch electrode 6 is laterally withdrawn, and then the capillary tool 2 is lowered to press the ball 7 against the electrode 10 of the chip 9 for bonding (FIG. 2B). Then, the capillary tool 2 is slightly moved upward (upward in the figure (c)) and then lowered again to press the wire 3 against the upper surface of the ball 7 by the lower surface of the capillary tool 2 (in the figure (d)). .
【００１１】図３は、この押し付け状態の部分拡大図で
ある。キャピラリツール２の中央には、ワイヤ３を挿通
する孔部１１が穿孔されている。キャピラリツール２は
平坦な下面１２を有しており、この下面１２により、ワ
イヤ３のボール７からの立ち上り部はボール７の上面に
押し付けられ、ボール７に埋り込むようにして合体し、
ボール７の上面は、フラットな面に加圧整形されてい
る。図中、影線部３ａは、ボール７の上面に埋り込んで
ボール７と合体したワイヤ３の立ち上り部である。FIG. 3 is a partially enlarged view of this pressing state. At the center of the capillary tool 2, a hole portion 11 for inserting the wire 3 is bored. The capillary tool 2 has a flat lower surface 12, and by this lower surface 12, the rising portion of the wire 3 from the ball 7 is pressed against the upper surface of the ball 7 and embedded so as to be embedded in the ball 7.
The upper surface of the ball 7 is pressed and shaped into a flat surface. In the figure, a shaded portion 3 a is a rising portion of the wire 3 embedded in the upper surface of the ball 7 and united with the ball 7.
【００１２】次いでキャピラリツール２は上昇し（図２
（ｅ））、次いでカットクランパー５によりワイヤ３を
クランプして、ワイヤ３を引き上げる。すると、ワイヤ
３はボール７との首細の接合部ａから切断され、バンプ
７′が形成される。Then, the capillary tool 2 is raised (see FIG. 2).
(E)) Then, the wire 3 is clamped by the cut clamper 5, and the wire 3 is pulled up. Then, the wire 3 is cut from the necked joint a with the ball 7 to form the bump 7 '.
【００１３】図４は、このようにして形成されたバンプ
７′を示すものである。バンプ７′の上面ｂは、キャピ
ラリツール２の下面１２が押し付けられたことにより、
フラットな面となっている。ｃは、首細の接合部ａの切
断により生じた突起である。この突起ｃはきわめて小さ
いものであり、バンプ高には実質的に影響しない。この
ように本手段によれば、フラットな上面ｂを有し、バン
プ高にばらつきのないバンプ７′を簡単に形成できる。
殊に本手段は、従来のバンプ形成装置をそのまま使っ
て、上記のようなバンプ７′を形成できる利点がある。FIG. 4 shows the bump 7'formed in this way. The upper surface b of the bump 7 ′ is pressed by the lower surface 12 of the capillary tool 2,
It has a flat surface. Reference numeral c is a protrusion formed by cutting the narrow necked portion a. The protrusion c is extremely small and does not substantially affect the bump height. As described above, according to the present means, it is possible to easily form the bump 7'having the flat upper surface b and having no variation in bump height.
In particular, this means has an advantage that the bump 7'as described above can be formed by using the conventional bump forming apparatus as it is.
【００１４】[0014]
【発明の効果】以上説明したように本発明は、（ａ）キ
ャピラリツールから導出されたワイヤの下端部に、トー
チ電極によりボールを形成する工程と、（ｂ）キャピラ
リツールを下降させて、上記ボールを半導体の電極に押
し付ける工程と、（ｃ）キャピラリツールを上昇させた
後、再度下降させることにより、ワイヤのボールからの
立ち上り部をキャピラリツールの下面によりボールの上
面に押し付ける工程と、（ｄ）キャピラリを上昇させ
て、クランパーによりワイヤをクランプして引き上げる
ことにより、ワイヤとボールの接合部からワイヤを切断
する工程、とからバンプ形成方法を構成しているので、
バンプ高にばらつきのないバンプを簡単に形成すること
ができる。As described above, according to the present invention, (a) a step of forming a ball with a torch electrode at the lower end of the wire led out from the capillary tool, and (b) lowering the capillary tool, A step of pressing the ball against the electrode of the semiconductor; and (c) a step of raising the capillary tool and then lowering it again to press the rising portion of the wire from the ball to the upper surface of the ball by the lower surface of the capillary tool. ) The bump forming method is composed of a step of raising the capillary, clamping the wire with a clamper and pulling it up, and cutting the wire from the joint between the wire and the ball.
It is possible to easily form bumps having uniform bump heights.
【図１】本発明の一実施例のバンプ形成装置の斜視図FIG. 1 is a perspective view of a bump forming apparatus according to an embodiment of the present invention.
【図２】同装置のバンプ形成順を示す動作図FIG. 2 is an operation diagram showing a bump formation order of the device.
【図３】同装置の腰部拡大断面図FIG. 3 is an enlarged sectional view of the waist of the device.
【図４】同装置のバンプの斜視図FIG. 4 is a perspective view of a bump of the device.
【図５】従来のバンプの側面図FIG. 5 is a side view of a conventional bump.
２ キャピラリツール ３ ワイヤ ６ トーチ電極 ７ ボール ７′ バンプ ９ 半導体 １０ 電極 2 Capillary tool 3 Wire 6 Torch electrode 7 Ball 7'Bump 9 Semiconductor 10 Electrode
Claims (1)
下端部に、トーチ電極によりボールを形成する工程と、
キャピラリツールを下降させて、上記ボールを半導体の
電極に押し付ける工程と、キャピラリツールを上昇させ
た後、再度下降させることにより、ワイヤのボールから
の立ち上り部をキャピラリツールの下面によりボールの
上面に押し付ける工程と、キャピラリを上昇させて、ク
ランパーによりワイヤをクランプして引き上げることに
より、ワイヤとボールの接合部からワイヤを切断する工
程とから成ることを特徴とするバンプ形成方法。1. A step of forming a ball with a torch electrode at a lower end of a wire led out from a capillary tool,
The step of lowering the capillary tool to press the ball against the semiconductor electrode, and raising the capillary tool and then lowering it again, press the rising part of the wire from the ball to the upper surface of the ball by the lower surface of the capillary tool. A bump forming method comprising: a step of raising the capillary; and a step of clamping the wire by a clamper and pulling it up to cut the wire from a joint portion of the wire and the ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3237681A JP2964724B2 (en) | 1991-09-18 | 1991-09-18 | Bump forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3237681A JP2964724B2 (en) | 1991-09-18 | 1991-09-18 | Bump forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0574779A true JPH0574779A (en) | 1993-03-26 |
| JP2964724B2 JP2964724B2 (en) | 1999-10-18 |
Family
ID=17018934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3237681A Expired - Fee Related JP2964724B2 (en) | 1991-09-18 | 1991-09-18 | Bump forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2964724B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012523118A (en) * | 2009-04-01 | 2012-09-27 | クリック アンド ソッファ インダストリーズ、インク． | Conductive bumps, wire loops, and methods of forming them |
-
1991
- 1991-09-18 JP JP3237681A patent/JP2964724B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012523118A (en) * | 2009-04-01 | 2012-09-27 | クリック アンド ソッファ インダストリーズ、インク． | Conductive bumps, wire loops, and methods of forming them |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2964724B2 (en) | 1999-10-18 |
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