JPH0573948U - TSOP type IC socket and floating guide - Google Patents

Abstract

(57) [Abstract] [Purpose] When the floating guide 2 is inserted into the IC socket 1, the pin 1C hits the lever 2C and the lever 1
C rotates to release IC3 and pushes IC3 with the pusher to surely bring IC3 into contact with IC socket 1. [Structure] Guide pins 1A are diagonally attached to the IC socket 1, a taper guide 1B for guiding the IC 3 is formed, and a pin 1C is attached to the central portion. The floating guide 2 has a guide hole 2A into which the guide pin 1A is inserted, a concave portion 2B for holding the IC 3 is formed on the upper surface, and a lever 2C formed in a U shape is rotatably held, and the lever 2C holds the IC 3. To do. Guide pin 1 of IC socket 1 in guide hole 2A of floating guide 2
When A is inserted, the pin 1C hits the lever 2C, the lever 2C rotates, and the holding of the IC 3 is released.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 This invention relates to an IC socket and a floating guide for an autohandler for measuring a TSOP type IC.

[0002]

[Prior Art]

 Next, the structure of the IC socket and the floating guide according to the prior art will be described with reference to FIG. 6, 3 is a TSOP type IC, 8 is a carrier, 9 is a floating guide, 10 is an IC socket, and 11 is a substrate. The floating guide 9 has a guide hole 9A provided on the lower surface of the floating guide 9 and an IC 3 holding recess 9B provided on the upper surface of the floating guide 9, and the IC socket 10 has a guide attached to the IC socket 10. There is a pin 10A.

The floating guide 9 holds the IC 3 in the recess 9 B and is incorporated in the carrier 8 in a finely moved state. Therefore, the IC 3 in the floating guide 9 can finely move with respect to the carrier 8. The IC socket 10 is fixed to the substrate 11, and the guide pin 10A is inserted into the guide hole 9A. The carrier 8 is lowered from the state shown in FIG. 6, and the guide pin 10 A of the IC socket 10 is inserted into the guide hole 9 A of the floating guide 9. Incidentally, FIG. 6 is the same as FIG. 1 of the specification of Japanese Patent Application No. 3-77840.

[0004]

[Problems to be solved by the device]

 In FIG. 6, a gap between the recess 9B of the floating guide 9 and the IC 3 and a gap between the guide pin 10A and the guide hole 9A may be accumulated. For example, in the case of a fine lead pitch of 0.5 mm such as TSOP type IC, it is difficult to surely contact the IC 3 and the IC socket 10 and measure the IC 3. In this invention, the floating guide is provided with a lever for holding the IC3, the IC socket is provided with a taper guide and a pin for guiding the IC3, and when the floating guide is inserted into the IC socket 1, the pin hits the lever and the lever rotates. Then, the IC3 is released and the IC3 is pushed by the pusher to surely bring the IC3 into contact with the IC socket.

[0005]

[Means for Solving the Problems]

 In order to achieve this object, according to the present invention, guide pins 1A are diagonally attached, a tapered guide 1B for guiding an IC 3 is formed, and an IC socket 1 in which a pin 1C is attached to a central portion and a guide pin 1A. It is provided with a floating guide 2 having a guide hole 2A for inserting an IC, a concave portion 2B for holding the IC 3 formed on the upper surface thereof, a rotatably holding lever 2C formed in a U shape, and holding the IC 3 by the lever 2C. When the guide pin 1A of the IC socket 1 is inserted into the guide hole 2A of the floating guide 2, the pin 1C hits the lever 2C and the lever 2C rotates to release the holding of IC3.

[0006]

[Action]

 Next, the structure of the IC socket and the floating guide according to the present invention will be described with reference to FIG. In FIG. 1, 1 is an IC socket, 2 is a floating guide, the IC socket 1 has guide pins 1A diagonally attached to the IC socket 1, a taper guide 1B protruding from the IC socket 1, and a center. There is a pin 1C attached to the part, a guide hole 2A for inserting the guide pin 1A is formed in the floating guide 2, and a recess 2B for holding the IC 3 is formed on the upper surface, and the lever is formed in a U shape. Hold 2C rotatably. The IC 3 put in the recess 2B is held by the rotational force of the lever 2C.

Therefore, the IC 3 in the floating guide 2 does not move even if the floating guide 2 is moved. The taper guide 1B of the IC socket 1 is formed so as to fit the four corners of the IC 3, and the guide pin 1A is inserted into the guide hole 2A.

Next, a state in which the floating guide 2 is inserted into the IC socket 1 will be described with reference to FIG. FIG. 2A is a sectional view of the floating guide 2, and 1C3 is fixed in the recess 2B by a lever 2C. 2A shows a state in which the guide pin 1A is inserted into the guide hole 2A, the pin 1C hits the guide 2C, and the lever 2C is given a rotational force for releasing the IC3. When the state of FIG. 2A is changed to the state of FIG. 2A, the taper guide 1B guides the four corners of the IC3, so that the IC3 can be surely brought into contact with the IC socket 1. FIG. 3 shows a state in which the floating guide 2 and the IC socket 1 are assembled. By pressing the IC 3 with the pusher 12 of FIG. 3, the lead 3A of the IC 3 is surely brought into contact with the contact 1D of the IC socket 1, and the illustration is shown. IC3 is measured by the omitted measuring instrument.

[0009]

【Example】

 FIG. 4 is a configuration diagram of an embodiment of an IC socket 1 according to the present invention, FIG. 4A is a plan view and FIG. 4A is a sectional view. FIG. 5 is a configuration diagram of an embodiment of the floating guide 2 according to the present invention. FIG. 5A is a plan view and FIG. 5A is a sectional view. Although one set of IC sockets 1 and floating guides 2 is described in FIGS. 1 to 5, actually, a plurality of sets of IC sockets 1 and floating guides 2 are arranged, and at the same time, a plurality of ICs 3 are connected to IC sockets 1. Attach to.

[0010]

[Effect of the device]

 According to this invention, the floating guide is provided with the lever for holding the IC3, and the IC socket is provided with the taper guide and the pin for guiding the IC3. Therefore, when the floating guide is inserted into the IC socket 1, the pin hits the lever, The lever rotates to release the IC3, so that the IC3 can be accurately positioned in the IC socket while it is inside the floating guide, and the IC3 can be surely brought into contact with the IC socket by pushing the IC3 with the pusher. ..

[Brief description of drawings]

FIG. 1 is a configuration diagram of an IC socket and a floating guide according to the present invention.

FIG. 2 is a state diagram of inserting the floating guide 2 of FIG. 1 into an IC socket 1.

3 is a state diagram in which the floating guide 2 of FIG. 1 is incorporated in an IC socket 1. FIG.

FIG. 4 is a configuration diagram of an embodiment of the IC socket 1 of FIG.

5 is a configuration diagram of an embodiment of a floating guide 2 of FIG.

FIG. 6 is a configuration diagram of an IC socket and a floating guide according to a conventional technique.

[Explanation of symbols]

 1 IC Socket 1A Guide Pin 1B Taper Guide 1C Pin 2 Floating Guide 2A Guide Hole 2B Recess 2C Lever 3 IC (TSOP Type IC)

Claims (1)

[Scope of utility model registration request] 1. A guide pin (1A) is diagonally attached to form a taper guide (1B) for guiding an IC (3),
IC socket (1) with pin (1C) attached in the center
With a guide hole (2A) for inserting the guide pin (1A), a recess (2B) for holding the IC (3) is formed on the upper surface, and the lever (2C) formed in a U shape can be freely rotated. Hold and I with lever (2C)
It is equipped with a floating guide (2) that holds C (3), and when the guide pin (1A) of the IC socket (1) is inserted into the guide hole (2A) of the floating guide (2), the pin (1C) moves to the lever ( 2C), the lever (2C) rotates to release the holding of the IC (3), the socket for the TSOP type IC and the floating guide.