JP3231690B2 - Socket for IC package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for fixing and electrically connecting an IC package provided with a large number of terminals on a lower surface thereof. The present invention relates to a socket for an IC package which is surely electrically connected.

[0002]

2. Description of the Related Art An IC package has a BGA
A large number of terminals such as a ball grid array (PGA) or a pin array (PGA) are provided. When this IC package is mounted in an IC package socket, a terminal such as a BGA or a PGA is provided with a spring connector at the same time as fixing. The contact is made and the electrical connection is made.

A conventional example of such an IC package socket will be briefly described with reference to FIGS. 6 and 7. FIG. FIG.
FIG. 1 is a longitudinal sectional view of an example of a conventional IC package socket. FIG. 7 is a diagram for explaining the inconvenience that occurs when the IC package is pressed by swinging and closing the cover member.

[0004] First, as shown in FIG.
0 are provided with concave portions 14 for accommodating and positioning the IC package 12, and a plurality of spring connectors 18 are provided on the bottom surface thereof so as to abut solder balls 16, 16...
18 are provided. A cover member 20 is provided on the holder member 10 so as to be swingable by a swing shaft 22 so as to cover or open the upper part of the concave portion 14.
Further, a hook member 24 is swingably provided at a free end side end of the cover member 20 so that the hook member 24 can be engaged with an engagement hole 26 provided at the front end of the holder member 10. It is configured.

Therefore, the IC package 12 is mounted in the concave portion 14, and the cover member 20 is swung and closed.
The upper surface of the C package 12 is connected to the spring connectors 18, 1
8 to press the hook member 24 into the engagement hole 2
6 are connected to the solder balls 16, 16.
.. Are held in elastic contact with each other, and electrical connection is made simultaneously with fixing.

[0006]

The conventional IC package socket having the above structure has the following problems. That is, when the IC package 12 is mounted in the recess 14 and the cover member 20 is swung in the closing direction, the lower surface of the cover member 20 first contacts the swing shaft 22 side of the IC package 12 as shown in FIG. And the side of the swing shaft 22 of the IC package 12 is connected to the spring connector 1.
It is pushed down strongly against the elasticity of 8, 18, ..., but IC
The side of the package 12 opposite to the swing shaft 22 is hardly pushed down. Therefore, the IC package 12 is pushed down in a slightly oblique posture with respect to the spring connectors 18, 18,.

As a result, the spring connectors 18, 18,... Are subjected to a diagonal force by the solder balls 16, 16, and exert not only a downward force but also a lateral force on the spring connectors 18, 18,. .. May be deformed by the lateral force. Also, due to the lateral force, the solder balls 16, 16,... And the spring connectors 18, 18,. further,
When the cover member 20 is completely closed, the IC package 1
2 are evenly brought into contact with the spring connectors 18, 18,..., So that the posture of the IC package 12 with respect to the spring connectors 18, 18,. I do. Also due to this change in attitude, the solder balls 16, 16,... And the spring connectors 18, 18,. Therefore, the reliability of the electrical connection of the IC package 12 is insufficient due to damage to the spring connectors 18, 18,....

The present invention has been made in view of the circumstances of the prior art as described above, and when closing a cover member, an IC package is pressed downward so that a lateral force is not applied to a spring connector. It is another object of the present invention to provide an IC package socket capable of obtaining a reliable electric connection.

[0009]

In order to achieve the above object, an IC package socket according to the present invention is provided with a recess for accommodating and positioning an IC package in a holder member, and a contact for a terminal on a lower surface of the IC package. A plurality of spring connectors are provided on the bottom surface of the recess so as to be in contact with each other, and a cover member is provided on the holder member so as to be swingable by a swing shaft so as to cover or open the upper part of the recess. An IC package socket provided with a lock mechanism for holding the upper surface of the IC package housed in the recess with respect to the holder member in a posture of pressing downward against the elasticity of the spring connector. A second swing shaft is provided at a position facing the recess in parallel with the swing shaft, and a holding member parallel to the cover member is provided at the center. In swingably disposed by the second swing axis, the said pivot shaft side of the lower surface of the cover member I
A relief portion that does not contact the upper surface of the C package is provided so that the free end side of the lower surface of the cover member and the lower surface of the parallel holding member can be on the same plane.

The clearance on the free end side of the escape portion provided on the lower surface of the cover member is positioned parallel to the swing axis and faces the center of the concave portion, and the cover member presses the IC package. First, the edge may contact the center of the upper surface of the IC package.

Further, when the cover mechanism is held by the lock mechanism in such a position that the upper surface of the IC package housed in the recess is pressed downward against the holder member against the elasticity of the spring connector. The free end side of the lower surface of the cover member is in contact with the upper surface of the IC package, and the tip edges of the lower surface of the parallel holding member on the swing axis side and the free end side are in contact with the upper surface of the IC package. You can also.

The lock mechanism includes an arm member having one end swingably disposed at a tip end of the holder member, and a lock lever member swingably disposed at the other end of the arm member. The lock lever member is positioned above the cover member in a state where the arm member is inserted into the engagement concave portion provided at the distal end portion of the cover member, and the lock lever member is further moved to one side. A configuration may be made in which the distal end side of the cover member is pressed downward by swinging.

Further, the spring connector is movable at one end, and is freely fitted in a hole formed in the bottom surface of the concave portion of the holder member, and is arranged so as to be movable in the axial direction and not to come out. May be.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIGS. 1A and 1B are diagrams for explaining the operation when the cover member of the embodiment of the socket for an IC package of the present invention is swung and closed, and FIG. (B) is a diagram in which the upper half of the IC package is pressed next on the free end side of the lower surface of the cover member, and (c) is simultaneously pressed on the swinging side of the lower surface of the parallel holding member. It is a figure which presses the other half of an upper surface. FIG. 2 is a plan view of one embodiment of the IC package socket of the present invention. FIG.
FIG. 3 is a side view of FIG. 2. FIG. 4 is a sectional view taken along the line AA of FIG. FIG. 5 is an enlarged view showing a state where the spring connector is in contact with the solder ball of the IC package.

First, the structure of an embodiment of the IC package socket of the present invention will be described with reference to FIGS. The holder member 30 is provided with a concave portion 34 for housing and positioning the IC package 12, and the spring connectors 18, 18 are provided on the bottom surface thereof so as to contact the solder balls 16, 16... Provided on the lower surface of the IC package 12, respectively. ... are provided. A cover member 40 is provided on the holder member 30 so as to be swingable by a swing shaft 42 so as to cover or open the upper part of the recess 34. Then, the IC at the center of the cover member 40
A square hole 44 is formed to penetrate the package 12 so as to face the package 12.
The second swing shaft 48 is arranged to be swingable by a second swing shaft 48 parallel to the second swing shaft 2. An IC is provided on the lower side of the cover member 40 on the side of the swing shaft 42.
An escape portion 50 is provided so as not to contact the upper surface of the package 12, and the edge of the escape portion 50 on the free end side is parallel to the swing shaft 42 and at the center of the recess 34, that is, at the center of the upper surface of the IC package 12. It is formed so as to face the part. Further, the distal end portions of the lower surface of the parallel holding member 46 on the swing shaft 42 side and the free end side are formed so as to be flush with the free end side of the lower surface of the cover member 40. The free end of the lower surface of the parallel holding member 46 is formed so as not to abut on the upper surface of the IC package 12 except for the leading edge, similarly to the escape portion 50 of the cover member 40.

Further, at one end of the holder member 30 opposite to the swing shaft 42, one end of an arm member 54 is swingably provided by a shaft 52 parallel to the swing shaft 42, and the other end is also swingable. The lock lever member 5 is driven by a shaft 56 parallel to the moving shaft 42.
8 is arranged to be swingable. An engaging recess 60 into which the arm member 54 can be inserted is provided at the free end of the cover member 40. The lock lever member 58 can be positioned above the cover member 40 with a gap d left between the holder member 30 and the cover member 40 with the cover member 40 closed and the arm member 54 inserted into the engagement recess 60. Is made. In addition, the lock lever member 58 acts to push down the cover member 40 by swinging it down to one side due to a difference in radius of the side abutting on the cover member 40 from the shaft 56 and lowering the cover member 40 downward. It has been done.

Here, the spring connectors 18, 18...
Indicates that the elasticity of contact with the IC package 12 is 3
Assuming that the weight is 0 g and the number is 300,
A large force of 9 kg is required to push down. Therefore, by applying the principle of leverage and the like by the arm member 54 and the lock lever member 58, it is possible to easily secure this large pressing force with a small force.

As shown in FIG. 5, a holder board 62 is provided at the bottom of the concave portion 34 to prevent the spring connectors 18, 18,... Also, a wiring board 64 is appropriately disposed on the lower surface of the holder member 30, and the solder balls 16 of the IC package 12 are connected to the wiring board 64 via spring connectors 18, 18.
Is electrically connected to Thus, the electrical operation or electrical inspection of the IC package 12 is performed. Here, if the spring connector 18 used is movable at both ends, both ends of the spring connector 18 can resiliently contact the solder ball 16 and the wiring board 64. However, the movable connector at both ends is expensive and has a small outer diameter. Is difficult to do. Therefore, as shown in FIG. 5, a one end movable type is used, and the spring connector 18 is loosely fitted into a hole formed in the bottom surface of the concave portion 34 of the holder member 30 and is movable to some extent in the axial direction. In addition, the holder board 62 restricts the upward removal, and the hole is restricted so that the downward removal is prevented. Since the spring connector 18 is movable in the axial direction in the hole, the solder ball 16 and the wiring board 64 can be elastically contacted at both ends of the spring connector 18 even if the spring connector 18 is movable. Thus, even if the dimensions between the holder member 30 and the wiring board 64 vary, the spring connector 18 is properly elastically contacted with the wiring board 64, and a reliable electrical connection is obtained.

Next, the force acting on the IC package 12 when the cover member 40 is closed in the IC package socket of the present invention having such a structure will be described with reference to FIG. First, as shown in FIG. 1A, when the cover member 40 is swung and closed, the edge of the escape portion 50 on the lower surface of the cover member 40 contacts the center of the upper surface of the IC package 12 and Press down. Then, even though the arm member 54 is inserted into the engagement concave portion 60 of the cover member 40, the distal end side of the cover member 40 faces the holder member 30 with a gap d between the holder member 30 and the lock lever member 58 in the upright state. . Here, although one end of the parallel pressing member 46 contacts the IC package 12, it does not strongly press the IC package 12. In such a state, the IC package 12 is pushed down at the center of the upper surface,
The IC package 12 includes spring connectors 18, 18.
Is pressed down evenly. Therefore, no lateral force acts on the spring connectors 18, 18,.

Further, when the lock lever member 58 is swung to one side and lowered, the distal end side of the cover member 40 is pushed down by a large force by leverage, and the distal end portion of the cover member 40 and the holder member 30 are moved downward. Gap is small. Then, the free end side of the lower surface of the cover member 40 contacts and presses down substantially half of the upper surface of the IC package 12 as shown in FIG. At the same time,
As shown in FIG. 1C, the swing shaft 42 on the lower surface of the parallel holding member 46 and the tip edge both abut on the upper surface of the IC package 12, and the swing shaft 42 on the lower surface of the parallel holding member 46 contacts the IC package. 12. Press the other half of the top of 12 down. Even when the upper surface of the IC package 12 is pressed downward on the free end side of the lower surface of the cover member 40 and on the swing shaft 42 side of the lower surface of the parallel holding member 46, the conventional lateral force does not act.

As described above, according to the IC package socket of the present invention, first, the escape portion 5 of the cover member 40 is formed.
When the center of the upper surface of the IC package 12 is pressed downward by the edge on the free end side of the cover member 0 and the cover member 40 is further pressed down by the lock lever member 58, the upper surface of the IC package 12 is respectively pressed by the cover member 40 and the parallel pressing member 46. It is pressed downward by half. Therefore, no lateral force acts on the spring connectors 18, 18, as in the prior art, and no relative displacement between the solder balls 16, 16,... And the spring connectors 18, 18,. .. And the spring connectors 18, 18... Are not damaged and a reliable electrical connection is obtained.

In the above embodiment, a BGA IC package using the solder balls 16, 16... As terminals has been described. However, the present invention is of course effective for a PGA IC package. is there. The parallel holding member 46 is provided with a relief portion on the lower surface on the distal end side opposite to the swing shaft 42 so that the IC package 12 is pressed by the lower surface on the swing shaft 42 side.
Is pressed equally with the cover member 40. However, the present invention is not limited to the above embodiment, and the lower surface of the parallel pressing member 46 may be a single plane. In addition, the parallel holding member 46 is not limited to the one that is swingably disposed in the square hole 44 provided in the cover member 40, and is freely swingably disposed in a concave portion provided on the lower surface of the cover member 40. May be. Further, the lock mechanism is not limited to the above embodiment, but may be the same as the conventional one. Furthermore, in the above embodiment, the arm member 54 and the lock lever member 58
May be swingable by an axis that is not parallel to the swing shaft 42.

[0023]

As described above, since the IC package socket of the present invention is constituted, the following special effects can be obtained.

In any of the IC package sockets according to the first and second aspects, when the cover member is closed, first, the edge on the free end side of the escape portion provided in the cover member is first IC.
Since the IC package is pressed against the spring connector by contacting the center of the upper surface of the package downward, the IC package is uniformly pressed against the spring connector, and the IC package is obliquely pressed from the end by the cover member as in the conventional example. Nothing.
Then, the IC package is pressed only downward by the cover member and the parallel pressing member, and no lateral force acts. Therefore, no lateral force acts on the spring connector and the terminal, and there is no possibility that these will be damaged. Therefore,
A reliable electrical connection can be reliably obtained.

In the socket for an IC package according to the third aspect, the cover member and the parallel pressing member include:
Since the upper surface of the IC package is pressed half by one, the IC package is pressed evenly.

Further, in the IC package socket according to the present invention, the lock mechanism comprises an arm member and a lock lever member, and the lock lever member is swung to one side to cover with a large force by leverage. Since the members can be pressed down, the terminals of the IC package can be reliably and elastically contacted with a large number of spring connectors with an appropriate contact force, so that electrical connection can be made.

In the socket for an IC package according to the fifth aspect, the spring connector is of a movable type, and is disposed so as to be movable in the axial direction in the hole of the holder member and not to come out. Therefore, both ends of the spring connector are elastically contacted with the terminal of the IC package and the wiring board. A spring connector having a movable one end is easy to manufacture with a small outer diameter and is inexpensive, and is extremely useful in the present apparatus in which a large number of the connectors are arranged at high density.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams illustrating an operation when a cover member of an IC package socket according to an embodiment of the present invention is swung and closed, and FIG. (B) is a diagram in which the upper half of the IC package is pressed next on the free end side of the lower surface of the cover member, and (c) is simultaneously pressed on the swinging side of the lower surface of the parallel holding member. It is a figure which presses the other half of an upper surface.

FIG. 2 is a plan view of an embodiment of an IC package socket according to the present invention.

FIG. 3 is a side view of FIG. 2;

FIG. 4 is a sectional view taken along the line AA of FIG. 2;

FIG. 5 is an enlarged view showing a state where a spring connector is in contact with a solder ball of an IC package.

FIG. 6 is a longitudinal sectional view of an example of a conventional IC package socket.

FIG. 7 is a diagram illustrating a problem that occurs when the IC package is pressed by swinging and closing the cover member.

[Explanation of symbols]

 10, 30 Holder member 12 IC package 14, 34 Depression 16 Solder ball 18 Spring connector 20, 40 Cover member 22, 42 Swing shaft 44 Square hole 46 Parallel holding member 48 Second swing shaft 50 Escape portion 52, 56 Shaft 54 Arm member 58 Lock lever member 60 Engagement recess

Claims (5)

(57) [Claims] A holder for receiving and positioning an IC package; a plurality of spring connectors provided on a bottom surface of the recess so as to contact terminals on a lower surface of the IC package; A member is swingably arranged by a swing shaft so as to cover or open the upper part of the concave portion, and the cover member is attached to the holder member by an upper surface of the IC package housed in the concave portion with the spring connector. I provided with a lock mechanism for holding a posture of pressing downward against the elasticity of the
In the C package socket, a second swinging shaft is provided on the cover member at a position facing the recess in parallel with the swinging shaft, and a holding member parallel to the cover member is provided at the second position.
A relief portion is provided on the swing shaft side of the lower surface of the cover member so as not to be in contact with the upper surface of the IC package, and the relief portion is provided on the lower surface of the cover member in parallel with the free end side of the lower surface of the cover member. A socket for an IC package, wherein the lower surface of the holding member is configured to be coplanar. 2. The IC package socket according to claim 1, wherein an edge on a free end side of a relief portion provided on a lower surface of the cover member is positioned parallel to the swing axis and faces a central portion of the recess. A socket for an IC package, wherein the edge first contacts the center of the upper surface of the IC package when the IC package is pressed downward by the cover member. 3. The IC package socket according to claim 1, wherein the cover member presses the upper surface of the IC package housed in the recess downward against the holder member against the elasticity of the spring connector. When held by the lock mechanism in the posture, the free end of the lower surface of the cover member contacts the upper surface of the IC package, and the leading edge of the lower surface of the parallel holding member on the swing axis side and the free end side is A socket for an IC package, wherein the socket is configured to contact an upper surface of the IC package. 4. The IC package socket according to claim 1, wherein the lock mechanism includes an arm member having one end swingably disposed at a tip end of the holder member, and an arm member disposed at the other end of the arm member. A lock lever member that is swingably disposed, and the lock lever member is positioned above the cover member in a state where the arm member is inserted into an engagement recess provided at a tip end of the cover member. A socket for an IC package, wherein the lock lever member is swung to one side to press the distal end side of the cover member downward. 5. The IC package socket according to claim 1, wherein the spring connector is movable at one end, and is freely fitted in a hole formed in a bottom surface of the concave portion of the holder member and is movable in the axial direction. A socket for an IC package characterized by being arranged so as not to come out.