JP2588710Y2 - TSOP type IC socket and floating guide - Google Patents

Description

[Detailed description of the invention]

[0001]

The present invention relates to an IC socket and a floating guide for an auto-handler for measuring a TSOP type IC.

[0002]

2. Description of the Related Art The construction of a conventional IC socket and floating guide will be described with reference to FIG. FIG.
3 is a TSOP type IC, 8 is a carrier, 9 is a floating guide, 10 is an IC socket, and 11 is a substrate. The floating guide 9 has a guide hole 9A provided on the lower surface of the floating guide 9 and a holding recess 9B for holding the IC 3 provided on the upper surface of the floating guide 9. The IC socket 10 has a guide pin attached to the IC socket 10. There is 10A.

The floating guide 9 has an IC in the recess 9B.
3 is held and incorporated into the carrier 8 in a fine movement state. Therefore, the IC 3 in the floating guide 9 can move slightly with respect to the carrier 8. IC socket 10
Is fixed to the substrate 11, and the guide pin 10A is
Inserted into A. The carrier 8 is lowered from the state of FIG.
The guide pin 10A of the IC socket 10 is inserted into the guide hole 9A of the floating guide 9. FIG. 6 is the same as FIG. 1 of the specification of Japanese Utility Model Application No. 3-77840.

[0004]

In FIG. 6, the gap between the recess 9B of the floating guide 9 and the IC 3 and the gap between the guide pin 10A and the guide hole 9A may be accumulated.
For example, when the lead pitch is as small as 0.5 mm as in the case of a TSOP type IC, it is difficult to make sure that the IC 3 and the IC socket 10 are in contact and measure the IC 3. In this invention, a floating guide is provided with a lever for holding the IC3, an IC socket is provided with a taper guide and a pin for guiding the IC3, and when the floating guide is inserted into the IC socket 1, the pin hits the lever, and the lever rotates to mount the IC3. The object is to release the IC3 and push the IC3 with a pusher so that the IC3 is securely brought into contact with the IC socket.

[0005]

In order to achieve this object, according to the present invention, a guide pin 1A is mounted diagonally, and a taper guide 1B for guiding an IC 3 is formed.
An IC socket 1 to which a pin 1C is attached at a central portion;
It has a guide hole 2A for inserting a guide pin 1A, a concave portion 2B for holding an IC 3 is formed on the upper surface, and a lever 2C formed in a U-shape is rotatably held.
When the guide pin 1A of the IC socket 1 is inserted into the guide hole 2A of the floating guide 2, the pin 1C contacts the lever 2C, and the lever 2C rotates to release the IC 3 from being held.

[0006]

Next, the structure of the IC socket and floating guide according to the present invention will be described with reference to FIG. In FIG. 1, 1 is an IC socket, 2 is a floating guide,
The socket 1 has a guide pin 1A diagonally attached to the IC socket 1, a taper guide 1B formed so as to protrude from the IC socket 1, and a pin 1C attached to the center. The floating guide 2 has a guide pin. A guide hole 2A for inserting 1A is made, and an IC
3 is formed to hold a lever 2C formed in a U-shape in a rotatable manner. The IC 3 placed in the recess 2B is held by the rotational force of the lever 2C.

Therefore, the IC 3 in the floating guide 2 does not move even if the floating guide 2 is moved. The taper guide 1B of the IC socket 1 is formed to guide the four corners of the IC 3, and the guide pin 1A is
Inserted into A.

Next, a state where the floating guide 2 is inserted into the IC socket 1 will be described with reference to FIG. FIG. 2A is a sectional view of the floating guide 2, and 1C3 is fixed in the recess 2B by a lever 2C. FIG. 2A shows a state in which the guide pin 1A is inserted into the guide hole 2A, and the pin 1C
Hits the guide 2C, and a rotational force for releasing the IC 3 is given to the lever 2C. When the state shown in FIG. 2A is changed to the state shown in FIG. 2A, the taper guide 1B guides the four corners of the IC 3, so that the IC 3 can be reliably brought into contact with the IC socket 1. FIG. 3 shows a state in which the floating guide 2 and the IC socket 1 are assembled, and the pusher 12 shown in FIG.
By pressing C3, the lead 3A of IC3 becomes I
The contact 3D of the C socket 1 is securely contacted, and the IC 3 is measured by a measuring device (not shown).

[0009]

4 is a structural view of an embodiment of the IC socket 1 according to the present invention. FIG. 4A is a plan view and FIG. 4A is a sectional view. FIG. 5 is a structural view of an embodiment of the floating guide 2 according to the present invention. FIG. 5A is a plan view and FIG. 5A is a sectional view. 1 to 5 show a set of IC sockets 1
And the floating guide 2 are described, but actually, a plurality of sets of IC sockets 1 and floating guides 2 are arranged, and a plurality of ICs 3 are mounted on the IC socket 1 at the same time.

[0010]

According to the present invention, the floating guide is provided with the lever for holding the IC3, and the IC socket is provided with the lever.
Since a taper guide and a pin for guiding C3 are provided,
When the floating guide is inserted into IC socket 1,
The pin hits the lever, and the lever rotates to release the IC3.
The IC 3 can be accurately positioned in the socket, and the IC 3 can be reliably brought into contact with the IC socket by pushing the IC 3 with the pusher.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an IC socket and a floating guide according to the present invention.

FIG. 2 is a view showing a state in which the floating guide 2 of FIG. 1 is inserted into an IC socket 1;

FIG. 3 is a state diagram in which the floating guide 2 of FIG.

FIG. 4 is a configuration diagram of an embodiment of the IC socket 1 of FIG. 1;

FIG. 5 is a configuration diagram of an embodiment of the floating guide 2 of FIG. 1;

FIG. 6 is a configuration diagram of an IC socket and a floating guide according to the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 1A Guide pin 1B Taper guide 1C Pin 2 Floating guide 2A Guide hole 2B Depression 2C Lever 3 IC (TSOP type IC)

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/66 G01R 31/26

Claims (1)

(57) [Scope of request for utility model registration] 1. A guide pin (1A) is mounted diagonally to form a taper guide (1B) for guiding an IC (3).
IC socket (1) with pin (1C) attached in the center
And a guide hole (2A) for inserting the guide pin (1A), a recess (2B) for holding the IC (3) is formed on the upper surface, and a lever (2C) formed in a U-shape can be rotated freely. Hold, and use lever (2C)
The guide pin (1A) of the IC socket (1) is inserted into the guide hole (2A) of the floating guide (2) when the guide pin (1C) is inserted into the lever (2). 2C), wherein the lever (2C) rotates to release the holding of the IC (3), and a socket for a TSOP type IC and a floating guide.