JPH057358B2 - - Google Patents

Info

Publication number
JPH057358B2
JPH057358B2 JP8824188A JP8824188A JPH057358B2 JP H057358 B2 JPH057358 B2 JP H057358B2 JP 8824188 A JP8824188 A JP 8824188A JP 8824188 A JP8824188 A JP 8824188A JP H057358 B2 JPH057358 B2 JP H057358B2
Authority
JP
Japan
Prior art keywords
film
single crystal
substrate
insulating film
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8824188A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01261300A (ja
Inventor
Tetsuo Nakamura
Makoto Ishida
Akira Namiki
Hideto Kanba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoko Kagaku Co Ltd
Original Assignee
Toyoko Kagaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoko Kagaku Co Ltd filed Critical Toyoko Kagaku Co Ltd
Priority to JP8824188A priority Critical patent/JPH01261300A/ja
Publication of JPH01261300A publication Critical patent/JPH01261300A/ja
Publication of JPH057358B2 publication Critical patent/JPH057358B2/ja
Granted legal-status Critical Current

Links

JP8824188A 1988-04-12 1988-04-12 減圧気相成長法によるSi基板上へのAl↓2O↓3単結晶膜のヘテロエピタキシャル成長方法 Granted JPH01261300A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8824188A JPH01261300A (ja) 1988-04-12 1988-04-12 減圧気相成長法によるSi基板上へのAl↓2O↓3単結晶膜のヘテロエピタキシャル成長方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8824188A JPH01261300A (ja) 1988-04-12 1988-04-12 減圧気相成長法によるSi基板上へのAl↓2O↓3単結晶膜のヘテロエピタキシャル成長方法

Publications (2)

Publication Number Publication Date
JPH01261300A JPH01261300A (ja) 1989-10-18
JPH057358B2 true JPH057358B2 (fr) 1993-01-28

Family

ID=13937363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8824188A Granted JPH01261300A (ja) 1988-04-12 1988-04-12 減圧気相成長法によるSi基板上へのAl↓2O↓3単結晶膜のヘテロエピタキシャル成長方法

Country Status (1)

Country Link
JP (1) JPH01261300A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU8036898A (en) 1997-06-19 1999-01-04 Asahi Kasei Kogyo Kabushiki Kaisha Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same
JP4654439B2 (ja) * 2005-09-20 2011-03-23 国立大学法人豊橋技術科学大学 金属酸化物薄膜の形成方法

Also Published As

Publication number Publication date
JPH01261300A (ja) 1989-10-18

Similar Documents

Publication Publication Date Title
US6270568B1 (en) Method for fabricating a semiconductor structure with reduced leakage current density
KR100676213B1 (ko) 실리콘에 대해 안정적인 결정질의 경계면을 구비하는반도체 구조를 제작하기 위한 방법
US8187377B2 (en) Non-contact etch annealing of strained layers
US6241821B1 (en) Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
TWI382456B (zh) 鬆弛矽化鍺層的磊晶成長
EP1043427A1 (fr) Structure semiconductrice comportant une interface en oxyde cristallin de métal alcalino-terreux entre du silicium et une couche d'oxyde monocristallin
EP1109212B1 (fr) Dispositif semiconducteur comportant une interface en oxyde cristallin de métal alcalino-terreux entre du silicium et une couche d'oxyde ou de nitrure de silicium
WO2002041378A2 (fr) Structure semi-conductrice et son procede de fabrication
US6224669B1 (en) Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
Hsieh et al. Silicon homoepitaxy by rapid thermal processing chemical vapor deposition (RTPCVD)—A review
JPH08191140A (ja) Soi基板の製造方法
US5364468A (en) Method for the growth of epitaxial metal-insulator-metal-semiconductor structures
JPH057358B2 (fr)
JPH04233277A (ja) 立方晶窒化ホウ素の層を有するトランジスター
US7169619B2 (en) Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process
KR20030051820A (ko) 고 유전 상수 재료를 가지는 반도체 구조체
JPH11233440A (ja) 半導体装置
JPH057359B2 (fr)
JPS6012775B2 (ja) 異質基板上への単結晶半導体層形成方法
JPH0294415A (ja) 基板の作成方法
JPH10242053A (ja) GaN系半導体装置および、GaN系半導体装置の製造方法
JPS5982744A (ja) Sos基板の製造法
JPH0488627A (ja) エピタキシャル層の成長法
JPH01183825A (ja) 単結晶シリコン膜の形成方法
JP2000091261A (ja) 半導体結晶の製造方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees