JPH0573065B2 - - Google Patents
Info
- Publication number
- JPH0573065B2 JPH0573065B2 JP60257816A JP25781685A JPH0573065B2 JP H0573065 B2 JPH0573065 B2 JP H0573065B2 JP 60257816 A JP60257816 A JP 60257816A JP 25781685 A JP25781685 A JP 25781685A JP H0573065 B2 JPH0573065 B2 JP H0573065B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- refrigerant
- chip
- pipe
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W40/47—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60257816A JPS62118553A (ja) | 1985-11-19 | 1985-11-19 | 冷媒導通管 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60257816A JPS62118553A (ja) | 1985-11-19 | 1985-11-19 | 冷媒導通管 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118553A JPS62118553A (ja) | 1987-05-29 |
| JPH0573065B2 true JPH0573065B2 (enExample) | 1993-10-13 |
Family
ID=17311520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60257816A Granted JPS62118553A (ja) | 1985-11-19 | 1985-11-19 | 冷媒導通管 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118553A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9553038B2 (en) * | 2012-04-02 | 2017-01-24 | Raytheon Company | Semiconductor cooling apparatus |
| US9472487B2 (en) * | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
| RU2581522C1 (ru) * | 2014-12-15 | 2016-04-20 | Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) | Способ охлаждения электронного оборудования с использованием конденсатора-пленкоформирователя |
| WO2020217285A1 (ja) * | 2019-04-22 | 2020-10-29 | 三菱電機株式会社 | 電子機器 |
-
1985
- 1985-11-19 JP JP60257816A patent/JPS62118553A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118553A (ja) | 1987-05-29 |
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