JPH0572753B2 - - Google Patents
Info
- Publication number
- JPH0572753B2 JPH0572753B2 JP3754685A JP3754685A JPH0572753B2 JP H0572753 B2 JPH0572753 B2 JP H0572753B2 JP 3754685 A JP3754685 A JP 3754685A JP 3754685 A JP3754685 A JP 3754685A JP H0572753 B2 JPH0572753 B2 JP H0572753B2
- Authority
- JP
- Japan
- Prior art keywords
- etching mask
- adhesive
- mask material
- wafer
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 claims description 74
- 239000004065 semiconductor Substances 0.000 claims description 72
- 239000000463 material Substances 0.000 claims description 50
- 239000000853 adhesive Substances 0.000 claims description 46
- 230000001070 adhesive effect Effects 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 230000007480 spreading Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 101
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60037546A JPS61198747A (ja) | 1985-02-28 | 1985-02-28 | 半導体チツプの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60037546A JPS61198747A (ja) | 1985-02-28 | 1985-02-28 | 半導体チツプの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61198747A JPS61198747A (ja) | 1986-09-03 |
| JPH0572753B2 true JPH0572753B2 (US20080005853A1-20080110-C00027.png) | 1993-10-12 |
Family
ID=12500523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60037546A Granted JPS61198747A (ja) | 1985-02-28 | 1985-02-28 | 半導体チツプの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61198747A (US20080005853A1-20080110-C00027.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400771B (zh) * | 2019-07-15 | 2021-09-17 | 浙江光特科技有限公司 | 一种用于三寸晶圆贴蜡的方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4944791A (US20080005853A1-20080110-C00027.png) * | 1972-06-28 | 1974-04-27 |
-
1985
- 1985-02-28 JP JP60037546A patent/JPS61198747A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4944791A (US20080005853A1-20080110-C00027.png) * | 1972-06-28 | 1974-04-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61198747A (ja) | 1986-09-03 |
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