JPH0570940B2 - - Google Patents
Info
- Publication number
- JPH0570940B2 JPH0570940B2 JP21831784A JP21831784A JPH0570940B2 JP H0570940 B2 JPH0570940 B2 JP H0570940B2 JP 21831784 A JP21831784 A JP 21831784A JP 21831784 A JP21831784 A JP 21831784A JP H0570940 B2 JPH0570940 B2 JP H0570940B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- cooling
- liquid
- heat transfer
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 38
- 239000007788 liquid Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 14
- 238000009835 boiling Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 description 7
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- -1 perfluorocarbon compound Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000013526 supercooled liquid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21831784A JPS6197951A (ja) | 1984-10-19 | 1984-10-19 | 半導体チツプの冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21831784A JPS6197951A (ja) | 1984-10-19 | 1984-10-19 | 半導体チツプの冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6197951A JPS6197951A (ja) | 1986-05-16 |
| JPH0570940B2 true JPH0570940B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-06 |
Family
ID=16717952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21831784A Granted JPS6197951A (ja) | 1984-10-19 | 1984-10-19 | 半導体チツプの冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6197951A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114597A (ja) * | 1988-10-24 | 1990-04-26 | Fujikura Ltd | 電子素子の冷却方法 |
-
1984
- 1984-10-19 JP JP21831784A patent/JPS6197951A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6197951A (ja) | 1986-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |