JPH0570306B2 - - Google Patents
Info
- Publication number
- JPH0570306B2 JPH0570306B2 JP62256945A JP25694587A JPH0570306B2 JP H0570306 B2 JPH0570306 B2 JP H0570306B2 JP 62256945 A JP62256945 A JP 62256945A JP 25694587 A JP25694587 A JP 25694587A JP H0570306 B2 JPH0570306 B2 JP H0570306B2
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- temperature
- resistance
- thin film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62256945A JPH0199250A (ja) | 1987-10-12 | 1987-10-12 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62256945A JPH0199250A (ja) | 1987-10-12 | 1987-10-12 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0199250A JPH0199250A (ja) | 1989-04-18 |
| JPH0570306B2 true JPH0570306B2 (enrdf_load_stackoverflow) | 1993-10-04 |
Family
ID=17299541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62256945A Granted JPH0199250A (ja) | 1987-10-12 | 1987-10-12 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0199250A (enrdf_load_stackoverflow) |
-
1987
- 1987-10-12 JP JP62256945A patent/JPH0199250A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0199250A (ja) | 1989-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |