JPH056943A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To provide an optical semiconductor device having a number of leads without problems in resin molding property such as bubbles and resin uneveness. CONSTITUTION:Resin is molded in a recess shape on a lead frame 7 so that an outer wall 8, which is higher than the thickness of a semiconductor element 6, is formed at the periphery of an element mounting part 6. An upper plate 10 having the hole whose area is larger than the photoelectric converting part of the semiconductor element 6 is additionally provided at the recess part of the outer wall 9. An outer package 9 is formed by using a material having high adhesion with the lead frame 7 such as phenol-based resin. Therefore, the optical semiconductor device having a number of leads can be provided. Since the upper plate 10 has the hole whose area is larger than the photoelectric conversion part of the semiconductor element 6, the upper part of the photoelectric conversion part of the semiconductor element 6 has the structure without the resin. Therefore, problems of the detects of the resin mold such as bubbles and resin uneveness do not occur.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device having a lead frame and an envelope integrally molded with resin.

[0002]

2. Description of the Related Art In industrial equipment requiring high reliability, an optical semiconductor device having an envelope integrally molded with a lead frame by a resin is used.

5 and 6 are a plan view and a side sectional view of a conventional optical semiconductor device. In FIGS. 5 and 6, the conventional optical semiconductor device has a structure in which the semiconductor element 1 is installed in the element mounting portion 3 of the lead frame 2 and is entirely molded with the resin 4. In this configuration, since the molding on the semiconductor element 1 having the photoelectric conversion portion and the molding on the upper and lower sides of the lead frame are performed by the same resin 4, a light transmissive resin is used as the resin 4.

[0004]

In the configuration of the conventional optical semiconductor device, when the entire lead frame 2 having a large number of leads is resin-sealed, good moldability of the resin 4 is difficult and bubbles, resin unevenness, and the like occur. There was a frequent problem. Further, since the adhesion between the lead frame 2 and the resin 4 is insufficient, the lead pitch is restricted, or the semiconductor element 1 is improved for improving the adhesion.
There was a problem in terms of mountability and cost because another resin needs to be formed around the area.

An object of the present invention is to provide an optical semiconductor device having good resin moldability and good adhesion between the lead frame and the resin.

[0006]

In order to solve the above-mentioned problems, an optical semiconductor device of the present invention has an entire lower surface of a lead frame on which a semiconductor element is mounted and a mounting portion of the semiconductor element on the upper surface of the lead frame. And an outer wall having a hollow peripheral portion formed by resin molding, and an upper plate having a hole larger than the photoelectric conversion portion of the semiconductor element is provided above the semiconductor element on the outer wall.

[0007]

According to the present invention, since the semiconductor device mounted on the lead frame has a cavity above the photoelectric conversion portion, there is no problem of resin unevenness and lead pitch, and it is particularly effective for a multi-pin type envelope having a large number of leads. Therefore, the resin moldability and adhesion were good, and it became possible to significantly reduce the appearance defects.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 are a plan view and a side sectional view of an optical semiconductor device according to a first embodiment of the present invention.

1 and 2, an optical semiconductor device according to the present invention has an element mounting portion 5 on which a semiconductor element 6 is mounted, the entire lower surface of a lead frame 7, and an element mounted above the lead frame 7. A recessed envelope 9 composed of the mounting portion 5 and an outer wall 8 having a cavity surrounding the semiconductor element 6 and having a thickness higher than that of the semiconductor element 6 is resin-molded with a phenol-based resin. This is a hollow structure in which an upper plate 10 having a hole having a larger area than the conversion portion is attached to the outer wall 8. In such a system, the space above the photoelectric conversion section is a space without resin, and the structure does not cause the problem of defective appearance such as resin unevenness and bubbles.

FIG. 3 is a side sectional view of an optical semiconductor device according to the second embodiment of the present invention. The difference from the first embodiment is that the upper plate 11 is provided above the semiconductor element 6 with a light-transmissive depression 12 having a larger area than the photoelectric conversion portion of the semiconductor element 6, and the depression 12 is mirror-polished. This means that the structure has improved light transmittance. In such a configuration, the upper portion of the photoelectric conversion portion is the upper plate 11 having a good moldability, and the structure does not cause the problem of poor appearance such as resin unevenness and bubbles.

FIG. 4 is a side sectional view of an optical semiconductor device according to the third embodiment of the present invention. The difference from the first and second embodiments is that a semiconductor element is not provided with an upper plate on the outer wall 8 and is electrically connected to at least the photoelectric conversion portion of the semiconductor element 6 in the hollow portion surrounded by the outer wall 8 and the lead frame 7. The pad portion 6 is covered with the protective resin 13. In such a configuration, since the resin molding method can be adopted as the protective resin 13 at a low temperature with less bubbles and resin unevenness, the upper portion of the photoelectric conversion portion of the semiconductor element 6 has a structure with good moldability.

In the third embodiment, the upper plate 10 having a hole having a larger area than the photoelectric conversion portion of the semiconductor element 6 in the outer wall 8 or a light-transmissive recessed portion mirror-polished with a larger area than the photoelectric conversion portion. Even if the upper plate 11 having the is attached, the same effect can be obtained.

[0014]

INDUSTRIAL APPLICABILITY The optical semiconductor device according to the present invention is particularly effective for a multi-pin type envelope having a large number of leads and a large-sized envelope, and greatly reduces appearance defects related to resin moldability and adhesion. It was made. Attach an upper plate with a hole with a larger area than the photoelectric conversion part of the semiconductor element, or an upper plate with a recessed part that is mirror-polished with a larger area than the photoelectric conversion part to the outer wall of the envelope integrally molded with resin on the lead frame According to the configuration, it is possible to provide a new optical semiconductor device which does not cause a problem of defective appearance such as resin unevenness and bubbles. Moreover, by covering the semiconductor element with the protective resin, a more reliable optical semiconductor device can be provided.

[Brief description of drawings]

FIG. 1 is a plan view showing an optical semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a side sectional view showing an optical semiconductor device according to a first embodiment of the present invention.

FIG. 3 is a side sectional view showing an optical semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a side sectional view showing an optical semiconductor device according to a third embodiment of the present invention.

FIG. 5 is a plan view showing a conventional optical semiconductor device.

FIG. 6 is a side sectional view showing a conventional optical semiconductor device.

[Explanation of symbols]

6 Semiconductor element 7 lead frame 8 outer wall 9 envelope 10, 11 Upper plate 13 Protective resin

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] January 27, 1992

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 5

[Correction method] Change

[Correction content]

[Figure 5]

Claims (3)

[Claims] 1. A resin molding of an entire lower surface of a lead frame on which a semiconductor element is mounted, and an outer wall on the upper surface of the lead frame in which a mounting portion and a peripheral portion of the semiconductor element are hollow,
An optical semiconductor device, wherein an upper plate having a hole larger than a photoelectric conversion portion of the semiconductor element is provided above the semiconductor element on the outer wall. 2. A resin molding of an entire lower surface of a lead frame on which a semiconductor element is mounted and an outer wall of the upper surface of the lead frame in which a mounting portion of the semiconductor element and a peripheral portion thereof are hollow,
An optical semiconductor device, wherein a recessed portion larger than the photoelectric conversion portion of the semiconductor element is provided at a position above the semiconductor element, and an upper plate obtained by mirror-polishing the recessed portion is attached to the outer wall. 3. A resin molding of the entire lower surface of a lead frame on which a semiconductor element is mounted and an outer wall on the upper surface of the lead frame where the semiconductor element mounting portion and the peripheral portion are hollow.
At least a photoelectric conversion portion of the semiconductor element in the cavity and a pad portion of the semiconductor element electrically connected to the lead frame are protected by a light transmissive resin.