JPH0568860B2 - - Google Patents
Info
- Publication number
- JPH0568860B2 JPH0568860B2 JP19870384A JP19870384A JPH0568860B2 JP H0568860 B2 JPH0568860 B2 JP H0568860B2 JP 19870384 A JP19870384 A JP 19870384A JP 19870384 A JP19870384 A JP 19870384A JP H0568860 B2 JPH0568860 B2 JP H0568860B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- terminal
- resin
- conductive pattern
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 12
- 238000009413 insulation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19870384A JPS6177353A (ja) | 1984-09-25 | 1984-09-25 | 半導体整流装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19870384A JPS6177353A (ja) | 1984-09-25 | 1984-09-25 | 半導体整流装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6177353A JPS6177353A (ja) | 1986-04-19 |
| JPH0568860B2 true JPH0568860B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-29 |
Family
ID=16395615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19870384A Granted JPS6177353A (ja) | 1984-09-25 | 1984-09-25 | 半導体整流装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6177353A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2593471B2 (ja) * | 1987-03-11 | 1997-03-26 | 株式会社東芝 | 半導体装置 |
| EP1587140B1 (de) * | 2004-03-12 | 2011-09-21 | Robert Bosch Gmbh | Elektronisches Bauteil mit einer Schaltung, die mit einer Gelschicht versehen ist und Verfahren zur Herstellung des Bauteils |
-
1984
- 1984-09-25 JP JP19870384A patent/JPS6177353A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6177353A (ja) | 1986-04-19 |