JPH0566016B2 - - Google Patents

Info

Publication number
JPH0566016B2
JPH0566016B2 JP3036487A JP3648791A JPH0566016B2 JP H0566016 B2 JPH0566016 B2 JP H0566016B2 JP 3036487 A JP3036487 A JP 3036487A JP 3648791 A JP3648791 A JP 3648791A JP H0566016 B2 JPH0566016 B2 JP H0566016B2
Authority
JP
Japan
Prior art keywords
support plate
cavity
resin
mold
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3036487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04211139A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP3036487A priority Critical patent/JPH04211139A/ja
Publication of JPH04211139A publication Critical patent/JPH04211139A/ja
Publication of JPH0566016B2 publication Critical patent/JPH0566016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP3036487A 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法 Granted JPH04211139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3036487A JPH04211139A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3036487A JPH04211139A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12204784A Division JPS612348A (ja) 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH04211139A JPH04211139A (ja) 1992-08-03
JPH0566016B2 true JPH0566016B2 (enrdf_load_stackoverflow) 1993-09-20

Family

ID=12471182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3036487A Granted JPH04211139A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH04211139A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH04211139A (ja) 1992-08-03

Similar Documents

Publication Publication Date Title
US5331205A (en) Molded plastic package with wire protection
US5935502A (en) Method for manufacturing plastic package for electronic device having a fully insulated dissipator
US3531856A (en) Assembling semiconductor devices
CN107078127B (zh) 电力用半导体装置及其制造方法
US3574815A (en) Method of fabricating a plastic encapsulated semiconductor assembly
JP2558413B2 (ja) リードフレーム上へのプラスチック部材の形成方法
JPS6227750B2 (enrdf_load_stackoverflow)
JPH04147814A (ja) 樹脂封入成形用金型
JPH04102338A (ja) 樹脂封止型半導体装置の製造方法及び製造装置
KR100591718B1 (ko) 수지-밀봉형 반도체 장치
JPH04306865A (ja) 半導体装置及びその製造方法
US4910581A (en) Internally molded isolated package
JPH0210572B2 (enrdf_load_stackoverflow)
JPH0566016B2 (enrdf_load_stackoverflow)
JPH0566017B2 (enrdf_load_stackoverflow)
JPH0244147B2 (enrdf_load_stackoverflow)
JP2555931B2 (ja) 半導体装置の製造方法
US20240178007A1 (en) Method of manufacturing semiconductor devices and corresponding semiconductor device
JPH0378779B2 (enrdf_load_stackoverflow)
JPH0135478Y2 (enrdf_load_stackoverflow)
JPH0213461B2 (enrdf_load_stackoverflow)
JPH0415942A (ja) 半導体装置
JPH0328067B2 (enrdf_load_stackoverflow)
JPH0744195B2 (ja) 樹脂封止型半導体装置の製造方法
JP2003203935A (ja) 半導体装置の封止方法およびそれに用いる封止装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees