JPH0564463B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a tape stripping method and a tape stripping device used directly in carrying out the method. [Technical Background of the Invention and Problems Therewith] A semiconductor wafer (hereinafter simply referred to as a wafer) on which a predetermined circuit pattern is formed has a tape attached to its surface to protect the circuit. Then,
The method for peeling off this tape is to apply a peeling tape with an adhesive force stronger than that of the tape by hand or by using a machine, and to peel it off by pulling the peeling tape. is being carried out. However, manual work requires a lot of manpower and has the disadvantage of poor workability. Furthermore, the method using a peeling tape has the disadvantage that the material cost is high and, as is the case with manual peeling, the adhesive of the tape remains after peeling and contaminates the wafer. Furthermore, in these methods, since the thickness of the wafer is usually as thin as 200 to 450 .mu.m, and the diameter thereof is approximately 4 to 6 mm, there is a problem that the wafer may be damaged when the tape is removed. Another method is to use chemicals to remove the tape, but in this case, the chemicals spread the glue over the entire surface of the wafer, so an extremely large amount of solvent is used to remove the spread glue. There is a need to. For this reason, workability and economy are poor. [Object of the Invention] The present invention provides a tape that prevents damage to the wafer when attached to a wafer, reduces the amount of remaining adhesive, and can be easily peeled off with high workability. It is an object of the present invention to provide a stripping method and device. [Summary of the Invention] The present invention prevents damage to the wafer by cooling the wafer to which the tape is attached to a predetermined temperature to reduce the adhesive strength of the glue, and then peeling off the tape using suction means. This is a tape peeling method that can reduce the amount of adhesive remaining and easily peel off the tape with high workability. Furthermore, the present invention prevents damage to the wafer by providing a cooling mechanism that cools the wafer to a predetermined temperature by placing the wafer with the tape attached on a wafer chuck, and a tape suction arm that peels off the tape from the cooled wafer. This tape peeling device is capable of easily peeling off the tape while reducing the amount of remaining adhesive and with high workability. [Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the description of the method of the present invention will be replaced with a description of the operation of the tape peeling device of one embodiment. FIG. 1 is an explanatory diagram showing a schematic configuration of a tape peeling device according to an embodiment of the present invention. 1 in the figure is a shield box. On one side of the shield box 1 is a supply cassette 2, which will be described later.
A pass box 3 is provided in which a pass box 3 is accommodated.
The pass box 3 is separated from the inside of the shield box 1 via a sliding door 4. A pass box 6 is similarly provided on the other opposing side of the shield box 1 via a sliding door 5. Inside this pass box 6, a storage cassette 7, which will be described later, is accommodated.
Further, a gas introduction pipe 8 for introducing N ₂ gas or dry air into the shield box 1 is attached. A similar gas introduction pipe 9 is also attached to the aforementioned pass box 6. A supply cassette 2 carried in from a pass box 3 is installed at a predetermined position within the shield box 1. Inside the supply cassette 2,
As shown in FIG. 2, a plurality of wafers 12 are housed, each having a tape 11 adhered to its surface via an adhesive layer 10. A storage cassette 7 is installed in front of the supply cassette 2 so as to face it. The storage cassette 7 accommodates processed wafers 12, which will be described later. A wafer chuck 1 for pre-cooling is installed between the supply cassette 2 and the storage cassette 7 in the shield box 1.
3 and a wafer chuck 14 serving as a cooling and stripping table are installed in this order. A conveying means 15 consisting of a pull-out belt is provided between the supply cassette 2, the wafer chuck 13 for pre-cooling, the wafer chuck 14 serving as a cooling and stripping table, and the storage cassette 7, so as to convey the wafers 12 between them. It's summery. In each wafer chuck 13 and 14,
As shown in FIG. 3, a cooling mechanism consisting of a refrigerant pipe 16 through which a refrigerant such as liquid nitrogen circulates is connected to a suction pipe 18 for reducing the pressure in the wafer mounting section 17 and fixing the wafer 12. . A tape suction arm 19 is provided above the wafer chuck 14 without a cooling and stripping table so as to be movable up and down so as to face the wafer placement section 17. According to the tape peeling device 20 configured in this way, the respective wafer chucks 13,
14 is cooled to, for example, 0 to -50°C by circulating a predetermined refrigerant through the refrigerant pipe 16. This temperature may be any temperature as long as it reduces the adhesive force of the adhesive layer 10 of the tape 11 attached to the wafer 12. Further, at this time, the wafer mounting section 17 is set to a reduced pressure state by the suction pipe 18. Next, a supply cassette 2 containing a plurality of wafers 12 with tapes 11 attached to their surfaces as shown in FIG. 2 before processing is placed from the pass box 3 to a predetermined position within the shield box 1. Then,
The wafer 12 is pulled out from the supply cassette 2 by the transport means 15 and fixed onto a wafer chuck 13 for pre-cooling. Here, the wafer 12 is cooled down and the tape 11 and glue layer 1 on its surface are
0 is curved from the wafer surface and peeled off at its end. This is because the glue layer 10 is cooled and loses its predetermined adhesive strength. Tape 11 like this
The wafer 12 with the glue layer 10 curved is transferred onto the next wafer chuck 14 by the transfer means 15. Next, the tape suction arm 19 is lowered, and the tape 11 on the wafer 12 is suctioned and peeled off from the wafer 12 together with the adhesive layer 10 by a suction mechanism (not shown). The wafer 12 from which the tape 11 has been peeled off in this manner is transferred to the supply cassette 7 by the transport means 15. From then on, repeat the same operation to supply supply cassette 2.
The tape 11 is removed from all of the wafers 12 in the cassette 7, and the wafers 12 after processing are removed from the storage cassette 7.
When the tape is filled, the storage cassette 7 and the tape are carried into the pass box 6 which is maintained in a predetermined atmosphere, and the tape removing operation is completed. In this way, the adhesive force of the glue layer 10 is reduced by cooling, and the end portions of the tape 11 and the glue layer 10 are contracted by cooling, and the tape 11 is removed by the tape suction arm 19. Since the peeling operation is performed, the tape 11 can be easily peeled off without damaging the wafer 12. Moreover,
Since the glue layer 10 has been cooled and solidified, the wafer 1
By minimizing the amount of glue remaining on the surface of the wafer 2, contamination of the wafer 12 can be prevented. Furthermore, these tape peeling operations can be performed by an automated mechanism, thereby significantly improving work efficiency. [Effects of the Invention] As explained above, the tape peeling method and device according to the present invention can remove the tape attached to a wafer by preventing damage to the wafer, reducing the amount of remaining adhesive, and reducing the amount of adhesive applied to the wafer. It can be easily peeled off due to its workability.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing a schematic configuration of an embodiment of the present invention, FIG. 2 is an explanatory diagram showing a wafer before processing, FIG. 3 is an explanatory diagram showing a schematic configuration of a wafer chuck, and FIG. FIG. 2 is an explanatory diagram showing the state of a cooled wafer. 1... Shield box, 2... Supply cassette, 3... Pass box, 4... Sliding door,
5...Sliding door, 6...Pass box, 7...
... Storage cassette, 8 ... Gas introduction pipe, 9 ... Gas introduction pipe, 10 ... Glue layer, 11 ... Tape, 12 ...
...Wafer, 13...Wafer chuck, 14...Wafer chuck, 15...Transporting means, 16...Refrigerant pipe, 17...Wafer mounting section, 18...Suction pipe, 1
9... Tape suction arm, 20 ... Tape peeling device.

Claims (1)

[Scope of Claims] 1. A step of cooling an unprocessed wafer to which a tape is attached to a predetermined temperature to reduce the adhesion force of the glue of the tape, and removing the adhesion force from the tape using a suction means. A method for peeling off a tape, comprising: a step of peeling off using a tape. 2. A supply cassette for supplying wafers with tapes attached before processing; a storage cassette provided at a predetermined interval opposite to the supply cassette for accommodating the wafers after processing; A wafer chuck provided at a predetermined position between the cassettes, a cooling mechanism connected to the wafer chuck, a tape suction arm provided so as to be movable up and down facing the wafer placement surface of the wafer chuck, the supply cassette and the wafer chuck. 1. A tape stripping device comprising: a wafer storage cassette; and a transport means for transporting the wafer between the wafer chuck and the storage cassette.