WO2000020167A3 - Method and apparatus for automatically polishing magnetic disks and other substrates - Google Patents

Method and apparatus for automatically polishing magnetic disks and other substrates Download PDF

Info

Publication number
WO2000020167A3
WO2000020167A3 PCT/US1999/023182 US9923182W WO0020167A3 WO 2000020167 A3 WO2000020167 A3 WO 2000020167A3 US 9923182 W US9923182 W US 9923182W WO 0020167 A3 WO0020167 A3 WO 0020167A3
Authority
WO
WIPO (PCT)
Prior art keywords
disk
substrate
polishing
polish
flip
Prior art date
Application number
PCT/US1999/023182
Other languages
French (fr)
Other versions
WO2000020167A2 (en
WO2000020167A9 (en
Inventor
Roger O Williams
Jeff Howard
Tarlochan Singh
Nathan Jones
James R Aven
Leroy J Serpa
Lawrence Lee
Mike Vantuyl
Lindsey Hamilton
Sean O'donnell
Michael J Herrmann
Kevin Thompson
Jon F Nystedt
Matt Richardson
Original Assignee
Exclusive Design Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exclusive Design Co Inc filed Critical Exclusive Design Co Inc
Priority to AU65086/99A priority Critical patent/AU6508699A/en
Publication of WO2000020167A2 publication Critical patent/WO2000020167A2/en
Publication of WO2000020167A9 publication Critical patent/WO2000020167A9/en
Publication of WO2000020167A3 publication Critical patent/WO2000020167A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers

Abstract

A substrate polishing apparatus for sequentially polishing both sides of a substrate, such as a magnetic disk, and method therefor, are provided. The apparatus according to the present invention may be conveniently considered in terms of it's subassemblies. The apparatus includes a cassette/disk handling robot (104), a disk flip and rinse station (106), an orbiter (110) including disk polish heads (112), a main gantry robot (108) and a magazine (114) having a polish platen (116) and supplying a polish tape or web tape (115) on which the substrate is polished. The disk flip and rinse station (106) receives a substrate from the cassette/disk handling robot (104) and subsequently releases the substrate back to the cassette/disk handling robot (104). The main gantry robot (108) moves the orbiter (110) and the disk polish head (112) to retrieve the substrate from the disk flip and rinse station (106) for polishing and to release the substrate back to the disk flip and rinse station (106) after polishing. The method according to the invention generally comprises the steps of polishing the first side of a substrate, automatically inverting the substrate and polishing the second side.
PCT/US1999/023182 1998-10-05 1999-10-05 Method and apparatus for automatically polishing magnetic disks and other substrates WO2000020167A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU65086/99A AU6508699A (en) 1998-10-05 1999-10-05 Method and apparatus for automatically polishing magnetic disks and other substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16765198A 1998-10-05 1998-10-05
US09/167,651 1998-10-05

Publications (3)

Publication Number Publication Date
WO2000020167A2 WO2000020167A2 (en) 2000-04-13
WO2000020167A9 WO2000020167A9 (en) 2000-09-14
WO2000020167A3 true WO2000020167A3 (en) 2007-05-24

Family

ID=22608233

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/023182 WO2000020167A2 (en) 1998-10-05 1999-10-05 Method and apparatus for automatically polishing magnetic disks and other substrates

Country Status (3)

Country Link
JP (1) JP2000187832A (en)
AU (1) AU6508699A (en)
WO (1) WO2000020167A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6573522B2 (en) 2001-06-27 2003-06-03 Applied Matrials, Inc. Locator pin integrated with sensor for detecting semiconductor substrate carrier
EP2149831B1 (en) 2008-07-31 2012-02-01 Siemens Aktiengesellschaft Control method for a composite of several multi-axle handling devices arranged behind or beside each other and data storage medium, control system and composite
TWI410527B (en) * 2010-05-06 2013-10-01 Taiwan Semiconductor Mfg Electroplating apparatus and method for plating conducting layer on substrate
CN109290927B (en) * 2018-10-16 2020-10-30 海盐创通技术服务有限公司 Line burnishing device
CN113182965A (en) * 2021-03-24 2021-07-30 浙江杭摩欧亿汽车零部件有限公司 Brake block processing is with surperficial burring mechanism
CN113159894B (en) * 2021-04-27 2023-04-14 杭州卓惟机械有限公司 Computer dress designing device
CN114779051B (en) * 2022-04-29 2023-06-20 深圳格芯集成电路装备有限公司 Chip press-testing device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616063A (en) * 1993-09-21 1997-04-01 Kabushiki Kaisya Toshiba Polishing apparatus
US5803799A (en) * 1996-01-24 1998-09-08 Ontrak Systems, Inc. Wafer polishing head
WO1998045090A1 (en) * 1997-04-04 1998-10-15 Obsidian, Inc. Polishing media magazine for improved polishing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616063A (en) * 1993-09-21 1997-04-01 Kabushiki Kaisya Toshiba Polishing apparatus
US5803799A (en) * 1996-01-24 1998-09-08 Ontrak Systems, Inc. Wafer polishing head
WO1998045090A1 (en) * 1997-04-04 1998-10-15 Obsidian, Inc. Polishing media magazine for improved polishing

Also Published As

Publication number Publication date
WO2000020167A2 (en) 2000-04-13
AU6508699A (en) 2000-04-26
JP2000187832A (en) 2000-07-04
WO2000020167A9 (en) 2000-09-14

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