JPH0563120B2 - - Google Patents

Info

Publication number
JPH0563120B2
JPH0563120B2 JP62283455A JP28345587A JPH0563120B2 JP H0563120 B2 JPH0563120 B2 JP H0563120B2 JP 62283455 A JP62283455 A JP 62283455A JP 28345587 A JP28345587 A JP 28345587A JP H0563120 B2 JPH0563120 B2 JP H0563120B2
Authority
JP
Japan
Prior art keywords
integrated circuit
cold plate
heat
board
chassis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62283455A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01124300A (ja
Inventor
Shinji Mine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP62283455A priority Critical patent/JPH01124300A/ja
Priority to CA000582329A priority patent/CA1283225C/en
Priority to EP88310468A priority patent/EP0316129B1/en
Priority to DE8888310468T priority patent/DE3877522T2/de
Priority to US07/268,467 priority patent/US4884167A/en
Publication of JPH01124300A publication Critical patent/JPH01124300A/ja
Publication of JPH0563120B2 publication Critical patent/JPH0563120B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP62283455A 1987-11-09 1987-11-09 集積回路の冷却構造 Granted JPH01124300A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62283455A JPH01124300A (ja) 1987-11-09 1987-11-09 集積回路の冷却構造
CA000582329A CA1283225C (en) 1987-11-09 1988-11-04 Cooling system for three-dimensional ic package
EP88310468A EP0316129B1 (en) 1987-11-09 1988-11-08 Cooling system for three-dimensional ic package
DE8888310468T DE3877522T2 (de) 1987-11-09 1988-11-08 Kuehlungssystem fuer eine dreidimensionale integrierte schaltungspackung.
US07/268,467 US4884167A (en) 1987-11-09 1988-11-08 Cooling system for three-dimensional IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62283455A JPH01124300A (ja) 1987-11-09 1987-11-09 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
JPH01124300A JPH01124300A (ja) 1989-05-17
JPH0563120B2 true JPH0563120B2 (enrdf_load_stackoverflow) 1993-09-09

Family

ID=17665769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62283455A Granted JPH01124300A (ja) 1987-11-09 1987-11-09 集積回路の冷却構造

Country Status (1)

Country Link
JP (1) JPH01124300A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5920356B2 (ja) 2011-10-25 2016-05-18 富士通株式会社 水冷装置、水冷装置を有する電子機器、及び水冷方法

Also Published As

Publication number Publication date
JPH01124300A (ja) 1989-05-17

Similar Documents

Publication Publication Date Title
US5097385A (en) Super-position cooling
US4884167A (en) Cooling system for three-dimensional IC package
US8203842B2 (en) Open flow cold plate for immersion-cooled electronic packages
US6305463B1 (en) Air or liquid cooled computer module cold plate
EP0538833B1 (en) Integrated circuit package having a cooling mechanism
US20080084668A1 (en) Conductive heat transport cooling system and method for a multi-component electronics system
EP0031419B1 (en) Air-cooled hybrid electronic package
KR0121438B1 (ko) 반도체 장치
KR100373228B1 (ko) 전자 카트리지를 위한 열 버스 바 설계
EP3872601B1 (en) Heat dissipation device
CN1976570A (zh) 热交换组件和生产该组件的方法
EP1125482A1 (en) Stacked circuit board assembly adapted for heat dissipation
US10721838B1 (en) Stacked base heat sink with heat pipes in-line with airflow
CA2050091A1 (en) Electronic circuit and method with thermal management
JPH02201999A (ja) 電子回路部品を冷却する冷却平面装置
JP6276959B2 (ja) 相変化モジュール及びそれを搭載した電子機器装置
US20200305311A1 (en) Heatsink for multiple memory modules
JPH0661390A (ja) 半導体集積回路素子の冷却構造及びそれに使用する半導体集積回路素子冷却用基板、並びに、それを利用した計算機の半導体集積回路素子冷却構造
JPH0557756B2 (enrdf_load_stackoverflow)
JPH0563120B2 (enrdf_load_stackoverflow)
US20190035709A1 (en) Electronic modules
CN218068740U (zh) 一种内存模块的液冷装置
JP2006221912A (ja) 半導体装置
JPH01270298A (ja) 半導体素子の冷却構造
JPS63192256A (ja) 集積回路の冷却構造