JPH0563120B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for an integrated circuit mounted on a three-dimensionally mounted substrate.

[Conventional technology]

In recent years, improvements in the degree of integration of semiconductor elements, the increase in the size of printed wiring boards and ceramic substrates, and the increase in the number of mounted elements per board have dramatically improved the packaging density of integrated circuits. On the other hand, there is a need for higher performance and more efficient cooling technology to cope with the increased total heat generation of integrated circuits. Particularly in the field of large machines, water cooling methods, typified by conduction cooling methods, are being actively employed, in which the heat dissipation surface of an integrated circuit is thermally coupled to a cold plate having a coolant flow path.

For example, a cooling structure using liquid as a refrigerant as shown in FIG. 3 has been proposed. That is, a heat conduction rod 53 is pressed against the integrated circuit 52 mounted on the substrate 51 by a spring 54, and the heat generated in the integrated circuit 52 is transferred from the heat conduction rod 53 to the minute gap 59 to the cold plate 55. cold plate 5
5 is cooled by a refrigerant injected from a refrigerant inlet 57 and discharged from an outlet 58 via a refrigerant flow path 56.

[Problem that the invention seeks to solve]

However, the conventional cooling structure described above is based on a planar mounting method in which a cold plate is formed in a module unit in which integrated circuits are functionally assembled.
Therefore, it is difficult to use it for three-dimensional mounting, where the conditions for mounting pitch between boards are strict. Furthermore, as the size of the board increases, maintainability deteriorates and manufacturing costs also increase.

SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated circuit cooling structure that improves the above-mentioned drawbacks by allowing a cold plate in a chassis to efficiently radiate heat from an integrated circuit on a three-dimensional mounting board.

[Means for solving problems]

The integrated circuit cooling structure of the present invention includes a board having integrated circuits mounted on one or both sides, and a hole provided at a position corresponding to the integrated circuit opposite the component mounting surface of the board arranged in a row in a chassis. a cold plate having a refrigerant flow path therein and fixed in the chassis; and a heat conductor having one end in contact with a heat dissipation surface of the integrated circuit inserted into a hole of the cold plate while keeping a minute distance from the inner wall of the hole. Rotation of pressing one end of the heat conduction rod against the heat dissipation surface of the integrated circuit, which is connected to the other end of the heat conduction rod by a leaf spring and penetrates through the cold plate parallel to the substrate surface. It is composed of a shaft.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention. Further, FIG. 2 is a sectional view taken along line AA in FIG. 1.

In FIG. 1, a substrate 1 has integrated circuits 2 mounted on both sides, and is arranged in rows in a chassis 3 alternately with cold plates 4 in the shape of a silkworm shelf. Chassis 3
The cold plate 4 fixed to the refrigerant inlet 5
It is cooled by a refrigerant injected from the outlet 6 and discharged from the outlet 6.

In FIG. 2, the boards 1 are guided and inserted into a card guide 18 and arranged in a row in the chassis 3, and cold plates 4 are arranged on the component mounting surface of the board 1, that is, on both sides of the board 1 here. The cold plate 4 is provided with holes 12 at positions corresponding to the respective integrated circuits 2, and further provided with coolant channels 7. The heat conduction rod 8 is inserted into the hole 12 of the cold plate.
The integrated circuit 2 is inserted into the integrated circuit 2 while keeping a small distance from the inner wall thereof, and its end surface is in thermal contact with the heat dissipation surface of the integrated circuit 2.

The rotating shaft 19 is provided to pass through the inside of the cold plate 4 in parallel to the substrate surface, and is connected to the other end surface of the heat conductive rod 8 by a leaf spring 21. The leaf spring 21 presses the heat conductive rod 8 against the integrated circuit 2 when the rotating shaft is in the state 19a.
19b by rotating the rotating shaft in the direction of arrow 20.
In this state, the contact between the heat conductive rod 8 and the integrated circuit 2 is released, and the insertion and removal of the board 1 becomes possible.

The heat generated by the integrated circuit 2 is transferred from the heat conduction rod 8 to the minute interval 10 to the cold plate 4, but the heat conduction rod 8 is pressed by the leaf spring 21 and comes into contact with each integrated circuit, so that it is not mounted on the board. It is possible to easily absorb variations in the mounting height of integrated circuits. Further, since the contact between the heat conductive rod and the integrated circuit can be released by the rotating shaft, it is possible to replace the board while leaving the cold plate in the chassis. Therefore, the weight of the board can be reduced, and there is no need to shut off the refrigerant system during maintenance and replacement.

〔Effect of the invention〕

As explained above, according to the present invention, by breaking the contact between the cold plate and the substrate using a rotating shaft connected via a heat conductive rod and a leaf spring,
It is possible to insert and remove the board while leaving the cold plate inside the chassis. In other words, it is possible to realize three-dimensional packaging in which maintenance and replacement of the board can be performed without cutting off the refrigerant.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view taken along line AA in FIG. 1, and FIG. 3 is a sectional view showing a conventional example of a cooling structure for an integrated circuit. DESCRIPTION OF SYMBOLS 1... Board, 2... Integrated circuit, 3... Chassis, 4... Cold plate, 5... Refrigerant inlet, 6... Refrigerant outlet, 8... Heat conduction rod, 10...
...Minute interval, 12...hole, 19...rotating shaft, 21...plate spring.

Claims (1)

[Claims] 1 A board with an integrated circuit mounted on one or both sides, and a hole provided at a position corresponding to the integrated circuit opposite to the component mounting surface of the board arranged in a row in a chassis and having a refrigerant flow path therein. a cold plate fixed in a chassis; a heat conduction rod having one end in contact with the heat dissipation surface of the integrated circuit inserted into a hole of the cold plate while keeping a minute distance from the inner wall of the hole; and other heat conduction rods. and a rotary shaft that presses one end of the heat conductive rod against a heat radiation surface of the integrated circuit that is connected to the end of the heat conductive rod by a leaf spring and that extends through the inside of the cold plate parallel to the substrate surface. Integrated circuit cooling structure.