JPH0557324B2 - - Google Patents
Info
- Publication number
- JPH0557324B2 JPH0557324B2 JP60240875A JP24087585A JPH0557324B2 JP H0557324 B2 JPH0557324 B2 JP H0557324B2 JP 60240875 A JP60240875 A JP 60240875A JP 24087585 A JP24087585 A JP 24087585A JP H0557324 B2 JPH0557324 B2 JP H0557324B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- powder
- slurry
- hydrazine
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24087585A JPS6299406A (ja) | 1985-10-28 | 1985-10-28 | 銅粉末の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24087585A JPS6299406A (ja) | 1985-10-28 | 1985-10-28 | 銅粉末の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6299406A JPS6299406A (ja) | 1987-05-08 |
| JPH0557324B2 true JPH0557324B2 (enrdf_load_stackoverflow) | 1993-08-23 |
Family
ID=17065993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24087585A Granted JPS6299406A (ja) | 1985-10-28 | 1985-10-28 | 銅粉末の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6299406A (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2638271B2 (ja) * | 1990-09-06 | 1997-08-06 | 住友金属工業株式会社 | 銅微粉末の製造方法 |
| US6620344B2 (en) | 1999-05-28 | 2003-09-16 | Dowa Mining Co., Ltd. | Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste |
| KR100743844B1 (ko) | 1999-12-01 | 2007-08-02 | 도와 마이닝 가부시끼가이샤 | 구리 분말 및 구리 분말의 제조 방법 |
| US6881240B2 (en) | 2000-09-18 | 2005-04-19 | Dowa Mining Co., Ltd. | Copper powder for electrically conductive paste |
| KR100405970B1 (ko) * | 2001-09-18 | 2003-11-14 | 한국과학기술연구원 | 유기용매를 이용한 카파 미분말의 합성방법 |
| KR100486604B1 (ko) * | 2002-10-30 | 2005-05-03 | (주)창성 | 습식환원법에 의한 극미세 구리분말의 제조방법 |
| JP5144022B2 (ja) * | 2006-03-24 | 2013-02-13 | 三井金属鉱業株式会社 | 銅粉の製造方法及びその製造方法で得られた銅粉 |
| JP5392884B2 (ja) * | 2007-09-21 | 2014-01-22 | 三井金属鉱業株式会社 | 銅粉の製造方法 |
| JP5872063B2 (ja) | 2012-11-26 | 2016-03-01 | 三井金属鉱業株式会社 | 銅粉 |
| JP6004034B1 (ja) * | 2015-04-21 | 2016-10-05 | 住友金属鉱山株式会社 | 銅粉末 |
| JP6908398B2 (ja) | 2017-03-08 | 2021-07-28 | 株式会社Adeka | 樹脂組成物、硬化物を形成する方法および硬化物 |
| CN113549948B (zh) * | 2021-07-28 | 2022-12-30 | 中国科学技术大学 | 一种表面氨基修饰的Cu@NH2纳米催化剂、其制备方法及应用 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5896802A (ja) * | 1981-12-04 | 1983-06-09 | Tadaharu Ogawa | 湿式還元による金属微粉末の製造方法 |
| JPS58224103A (ja) * | 1982-06-21 | 1983-12-26 | Mitsui Mining & Smelting Co Ltd | 銅微粉の製造法 |
-
1985
- 1985-10-28 JP JP24087585A patent/JPS6299406A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6299406A (ja) | 1987-05-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |