JPH055581B2 - - Google Patents
Info
- Publication number
- JPH055581B2 JPH055581B2 JP62008965A JP896587A JPH055581B2 JP H055581 B2 JPH055581 B2 JP H055581B2 JP 62008965 A JP62008965 A JP 62008965A JP 896587 A JP896587 A JP 896587A JP H055581 B2 JPH055581 B2 JP H055581B2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- printed circuit
- reflow
- circuit board
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62008965A JPS63177960A (ja) | 1987-01-20 | 1987-01-20 | リフロ−はんだ付け装置 |
| KR1019880008802A KR900002671A (ko) | 1987-01-20 | 1988-07-15 | 리플로우 납땜장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62008965A JPS63177960A (ja) | 1987-01-20 | 1987-01-20 | リフロ−はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63177960A JPS63177960A (ja) | 1988-07-22 |
| JPH055581B2 true JPH055581B2 (en, 2012) | 1993-01-22 |
Family
ID=11707388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62008965A Granted JPS63177960A (ja) | 1987-01-20 | 1987-01-20 | リフロ−はんだ付け装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS63177960A (en, 2012) |
| KR (1) | KR900002671A (en, 2012) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284764A (ja) * | 1989-04-25 | 1990-11-22 | Osaka Asahi Kagaku Kk | プリント基板の両面実装用半田付装置 |
| JPH03106260U (en, 2012) * | 1990-02-20 | 1991-11-01 | ||
| US5154338A (en) * | 1990-06-06 | 1992-10-13 | Senju Metal Industry Co., Ltd. | Solder reflow furnace |
| JPH07115166B2 (ja) * | 1991-03-26 | 1995-12-13 | 日立テクノエンジニアリング株式会社 | リフローはんだ付け方法およびその装置 |
| EP0598367B1 (en) * | 1992-11-17 | 1998-02-04 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
| JPH08250852A (ja) * | 1995-03-10 | 1996-09-27 | Senju Metal Ind Co Ltd | リフロー方法、リフロー炉およびリフロー炉用熱風式ヒーター |
| CN109424559A (zh) * | 2017-08-25 | 2019-03-05 | 张跃 | 一种水冷屏蔽风机 |
-
1987
- 1987-01-20 JP JP62008965A patent/JPS63177960A/ja active Granted
-
1988
- 1988-07-15 KR KR1019880008802A patent/KR900002671A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| KR900002671A (ko) | 1990-02-28 |
| JPS63177960A (ja) | 1988-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term |