JPH054889B2 - - Google Patents

Info

Publication number
JPH054889B2
JPH054889B2 JP60264449A JP26444985A JPH054889B2 JP H054889 B2 JPH054889 B2 JP H054889B2 JP 60264449 A JP60264449 A JP 60264449A JP 26444985 A JP26444985 A JP 26444985A JP H054889 B2 JPH054889 B2 JP H054889B2
Authority
JP
Japan
Prior art keywords
wiring board
molded
printed wiring
board material
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60264449A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62122722A (ja
Inventor
Toshuki Matsumae
Hideto Misawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP60264449A priority Critical patent/JPS62122722A/ja
Publication of JPS62122722A publication Critical patent/JPS62122722A/ja
Publication of JPH054889B2 publication Critical patent/JPH054889B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/34Heating or cooling presses or parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
JP60264449A 1985-11-25 1985-11-25 プリント配線板材料の製法 Granted JPS62122722A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60264449A JPS62122722A (ja) 1985-11-25 1985-11-25 プリント配線板材料の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60264449A JPS62122722A (ja) 1985-11-25 1985-11-25 プリント配線板材料の製法

Publications (2)

Publication Number Publication Date
JPS62122722A JPS62122722A (ja) 1987-06-04
JPH054889B2 true JPH054889B2 (enrdf_load_stackoverflow) 1993-01-21

Family

ID=17403350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60264449A Granted JPS62122722A (ja) 1985-11-25 1985-11-25 プリント配線板材料の製法

Country Status (1)

Country Link
JP (1) JPS62122722A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11856967B2 (en) 2014-04-17 2024-01-02 Ali Group S.R.L.—Carpigiani Method for making liquid or semi-liquid fermented milk products

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2747833B2 (ja) * 1989-02-03 1998-05-06 グラステイール・インダストリアル・ラミネーツ・インコーポレイテツド 金属箔積層体を製造する連続的な方法
DE202004011851U1 (de) 2004-07-28 2004-09-30 Peguform Gmbh & Co. Kg Kraftfahrzeug-Hecktür

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11856967B2 (en) 2014-04-17 2024-01-02 Ali Group S.R.L.—Carpigiani Method for making liquid or semi-liquid fermented milk products

Also Published As

Publication number Publication date
JPS62122722A (ja) 1987-06-04

Similar Documents

Publication Publication Date Title
JPH10315257A (ja) 真空積層装置および真空積層方法
US4302501A (en) Porous, heat resistant insulating substrates for use in printed circuit boards, printed circuit boards utilizing the same and method of manufacturing insulating substrates and printed circuit boards
US4405971A (en) Electrical circuit apparatus
JP2013101990A (ja) 封止用樹脂シートの製造方法
JPH054889B2 (enrdf_load_stackoverflow)
JP2912342B1 (ja) 多層銅張積層板の製造方法
JP2700449B2 (ja) 電子パワーデバイスのヒートシンクを電気的に絶縁するための方法および装置
JP3277195B2 (ja) 多層プリント配線板およびその製造方法
JPH0195045A (ja) 多層プリント配線板の製造方法
JPH0333095B2 (enrdf_load_stackoverflow)
JP2001308522A (ja) 多層プリント配線板の製造方法およびプリプレグ
JPS6120728A (ja) 積層板の製造方法
JPH10224032A (ja) プリント配線板のレイアップ方法
JPH0295826A (ja) 回路付き樹脂成形体の製造方法
JP2566298B2 (ja) プリント配線板の反り矯正装置
JPH01199440A (ja) 半導体装置の製造方法
JPH034017B2 (enrdf_load_stackoverflow)
JPH11314235A (ja) 積層体の製造方法
JP2002164665A (ja) 配線板成形用の真空成形装置
JPH0825385A (ja) 積層板の製造方法
JPH1034817A (ja) 積層板の製造装置
JPS60241294A (ja) 多層印刷配線板の製造方法
JPH0476784B2 (enrdf_load_stackoverflow)
JPH0722721A (ja) 金属ベース印刷配線板
JPH07314476A (ja) 積層板の製造法