JPH054889B2 - - Google Patents
Info
- Publication number
- JPH054889B2 JPH054889B2 JP60264449A JP26444985A JPH054889B2 JP H054889 B2 JPH054889 B2 JP H054889B2 JP 60264449 A JP60264449 A JP 60264449A JP 26444985 A JP26444985 A JP 26444985A JP H054889 B2 JPH054889 B2 JP H054889B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- molded
- printed wiring
- board material
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60264449A JPS62122722A (ja) | 1985-11-25 | 1985-11-25 | プリント配線板材料の製法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60264449A JPS62122722A (ja) | 1985-11-25 | 1985-11-25 | プリント配線板材料の製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62122722A JPS62122722A (ja) | 1987-06-04 |
JPH054889B2 true JPH054889B2 (enrdf_load_stackoverflow) | 1993-01-21 |
Family
ID=17403350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60264449A Granted JPS62122722A (ja) | 1985-11-25 | 1985-11-25 | プリント配線板材料の製法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62122722A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11856967B2 (en) | 2014-04-17 | 2024-01-02 | Ali Group S.R.L.—Carpigiani | Method for making liquid or semi-liquid fermented milk products |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2747833B2 (ja) * | 1989-02-03 | 1998-05-06 | グラステイール・インダストリアル・ラミネーツ・インコーポレイテツド | 金属箔積層体を製造する連続的な方法 |
DE202004011851U1 (de) | 2004-07-28 | 2004-09-30 | Peguform Gmbh & Co. Kg | Kraftfahrzeug-Hecktür |
-
1985
- 1985-11-25 JP JP60264449A patent/JPS62122722A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11856967B2 (en) | 2014-04-17 | 2024-01-02 | Ali Group S.R.L.—Carpigiani | Method for making liquid or semi-liquid fermented milk products |
Also Published As
Publication number | Publication date |
---|---|
JPS62122722A (ja) | 1987-06-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH10315257A (ja) | 真空積層装置および真空積層方法 | |
US4302501A (en) | Porous, heat resistant insulating substrates for use in printed circuit boards, printed circuit boards utilizing the same and method of manufacturing insulating substrates and printed circuit boards | |
US4405971A (en) | Electrical circuit apparatus | |
JP2013101990A (ja) | 封止用樹脂シートの製造方法 | |
JPH054889B2 (enrdf_load_stackoverflow) | ||
JP2912342B1 (ja) | 多層銅張積層板の製造方法 | |
JP2700449B2 (ja) | 電子パワーデバイスのヒートシンクを電気的に絶縁するための方法および装置 | |
JP3277195B2 (ja) | 多層プリント配線板およびその製造方法 | |
JPH0195045A (ja) | 多層プリント配線板の製造方法 | |
JPH0333095B2 (enrdf_load_stackoverflow) | ||
JP2001308522A (ja) | 多層プリント配線板の製造方法およびプリプレグ | |
JPS6120728A (ja) | 積層板の製造方法 | |
JPH10224032A (ja) | プリント配線板のレイアップ方法 | |
JPH0295826A (ja) | 回路付き樹脂成形体の製造方法 | |
JP2566298B2 (ja) | プリント配線板の反り矯正装置 | |
JPH01199440A (ja) | 半導体装置の製造方法 | |
JPH034017B2 (enrdf_load_stackoverflow) | ||
JPH11314235A (ja) | 積層体の製造方法 | |
JP2002164665A (ja) | 配線板成形用の真空成形装置 | |
JPH0825385A (ja) | 積層板の製造方法 | |
JPH1034817A (ja) | 積層板の製造装置 | |
JPS60241294A (ja) | 多層印刷配線板の製造方法 | |
JPH0476784B2 (enrdf_load_stackoverflow) | ||
JPH0722721A (ja) | 金属ベース印刷配線板 | |
JPH07314476A (ja) | 積層板の製造法 |