JPH0548372U - Flexible circuit board connection structure - Google Patents

Flexible circuit board connection structure

Info

Publication number
JPH0548372U
JPH0548372U JP10521091U JP10521091U JPH0548372U JP H0548372 U JPH0548372 U JP H0548372U JP 10521091 U JP10521091 U JP 10521091U JP 10521091 U JP10521091 U JP 10521091U JP H0548372 U JPH0548372 U JP H0548372U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
conductive metal
metal member
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10521091U
Other languages
Japanese (ja)
Other versions
JP2544126Y2 (en
Inventor
孝信 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP1991105210U priority Critical patent/JP2544126Y2/en
Publication of JPH0548372U publication Critical patent/JPH0548372U/en
Application granted granted Critical
Publication of JP2544126Y2 publication Critical patent/JP2544126Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 可撓性回路基板の所定の配線パタ−ンを接地
する為にこの可撓性回路基板に導電性金属部材を貼着
し、この導電性金属部材に形成したバリ部のカシメ圧着
手段でその配線パタ−ンと導電性金属部材との間に接地
接続構造を設けるようにした可撓性回路基板の接続構造
を提供する。 【構成】 接地させる導電性金属部材1にバリ部2を突
出形成させ、可撓性回路基板の接地すべき配線パタ−ン
6のランド部6Aのランド穴7に上記突出バリ部2を挿
入するように可撓性回路基板を導電性金属部材1の上面
に貼着した状態でバリ部2をカシメてランド部6Aに圧
着することにより配線パタ−ン6と導電性金属部材1と
の間の接地接続構造を形成する。
(57) [Abstract] [Purpose] A conductive metal member is adhered to the flexible circuit board in order to ground a predetermined wiring pattern of the flexible circuit board, and is formed on the conductive metal member. Provided is a flexible circuit board connection structure in which a ground connection structure is provided between the wiring pattern and a conductive metal member by crimping and crimping means of a burr portion. A burr portion 2 is formed to project on a conductive metal member 1 to be grounded, and the projecting burr portion 2 is inserted into a land hole 7 of a land portion 6A of a wiring pattern 6 to be grounded on a flexible circuit board. As described above, the burr portion 2 is crimped and crimped to the land portion 6A in a state where the flexible circuit board is adhered to the upper surface of the conductive metal member 1, so that the wiring pattern 6 and the conductive metal member 1 are separated from each other. Form a ground connection structure.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、可撓性回路基板に形成した所定の配線パタ−ンを接地する為に導電 性金属部材をカシメて上記配線パタ−ンとその導電性金属部材と電気的に接続す るように案出した可撓性回路基板の接続構造に関する。 According to the present invention, a conductive metal member is caulked to ground a predetermined wiring pattern formed on a flexible circuit board to electrically connect the wiring pattern and the conductive metal member. The present invention relates to a connection structure for a flexible circuit board.

【0002】[0002]

【従来の技術】[Prior Art]

この種の可撓性回路基板は、図4に示すように、例えばポリイミドフィルム等 の可撓性絶縁基材4の一方面に銅箔等に対するエッチング手段で所望の配線パタ −ン6を形成し、一般にはその配線パタ−ン6を絶縁被覆する為に適当な樹脂製 フィルム部材からなる表面保護層3を配線パタ−ン6の上面に被着して構成され ている。 In this type of flexible circuit board, as shown in FIG. 4, a desired wiring pattern 6 is formed on one surface of a flexible insulating substrate 4 such as a polyimide film by etching means for copper foil or the like. Generally, a surface protective layer 3 made of a resin film member suitable for insulating the wiring pattern 6 is applied to the upper surface of the wiring pattern 6.

【0003】 このような可撓性回路基板は、配線パタ−ン6の高い形成自由度に加え、全体 を薄く且つ軽量に構成できるという利点を有するので、例えば小型且つ高密度に 装置構成する必要のある電子機器等の配線手段として極めて好適である。Such a flexible circuit board has an advantage that the wiring pattern 6 can be formed with a high degree of freedom and that the entire structure can be made thin and lightweight. It is extremely suitable as a wiring means for some electronic devices.

【0004】 ところで、上記のような可撓性回路基板を機器に実装する場合、所定の配線パ タ−ン6を接地させると共に実装時の補強機能を持たせる手段として、図4の如 くその可撓性回路基板を適当な導電性金属部材7に貼着させ、配線パタ−ン6の ランド部6Aに設けたランド穴7に半田10を付着させて導電性金属部材9及び 配線パタ−ン6間の電気的導通を図る構造の他、図5のように可撓性回路基板を 貼着した導電性金属部材9の裏面を機器の金属シャ−シ12に載置させ、配線パ タ−ン6に於けるランド部6Aの箇所に共通に穿設した穴11にネジ13を装着 して金属シャ−シ12に締結することにより配線パタ−ン6と導電性金属部材9 とを電気的に接続する手法がある。By the way, when a flexible circuit board as described above is mounted on a device, as a means for grounding a predetermined wiring pattern 6 and providing a reinforcing function at the time of mounting, it is shown in FIG. The flexible circuit board is adhered to an appropriate conductive metal member 7, and the solder 10 is attached to the land hole 7 formed in the land portion 6A of the wiring pattern 6 so that the conductive metal member 9 and the wiring pattern are formed. In addition to the structure for achieving electrical continuity between the wirings 6, the back surface of the conductive metal member 9 to which the flexible circuit board is attached as shown in FIG. 5 is placed on the metal chassis 12 of the device, and the wiring pattern is formed. The wiring pattern 6 and the conductive metal member 9 are electrically connected to each other by mounting the screw 13 in the hole 11 commonly formed at the land portion 6A of the connector 6 and fastening the screw 13 to the metal chassis 12. There is a method to connect to.

【0005】[0005]

【考案が解決しようとする課題】 しかし、図4のような半田10による接地接続構造によれば、その為の半田付 け工程を要し、また、導電性金属部材9に可撓性回路基板を貼り合わせる場合に 使用する接着剤等がランド穴7に残ると、半田10は導電性金属部材9に十分に 付着せず導通不良となる。However, according to the ground connection structure with the solder 10 as shown in FIG. 4, a soldering step for that is required, and the conductive metal member 9 has a flexible circuit board. If the adhesive or the like used when bonding is adhered to the land hole 7, the solder 10 does not sufficiently adhere to the conductive metal member 9 and a conduction failure occurs.

【0006】 また、図5のようなネジ13を用いた接地接続構造では、部品点数の増加及び 工程増を招くので、コスト高の手法となる。Further, the ground connection structure using the screw 13 as shown in FIG. 5 causes an increase in the number of parts and an increase in the number of steps, which is a costly method.

【0007】[0007]

【課題を解決するための手段】[Means for Solving the Problems]

本考案はそこで、接地させる導電性金属部材の側に透孔を形成する際に該透孔 の周囲にバリ部を突出形成させ、可撓性回路基板に於ける接地すべき配線パタ− ンのランド部のランド穴に上記突出バリ部を挿入するようにこの可撓性回路基板 を上記導電性金属部材の上面に貼着した状態でそのバリ部をカシメて上記ランド 部に圧着することにより所定の配線パタ−ンと上記導電性金属部材との間の接地 接続を図るように構成した可撓性回路基板の接続構造を提供するものである。 Therefore, in the present invention, when a through hole is formed on the side of a conductive metal member to be grounded, a burr portion is formed so as to project around the through hole so that a wiring pattern of a flexible circuit board to be grounded can be formed. The flexible circuit board is attached to the upper surface of the conductive metal member so that the protruding burr portion is inserted into the land hole of the land portion. The present invention provides a connection structure for a flexible circuit board configured to establish a ground connection between the wiring pattern and the conductive metal member.

【0008】[0008]

【実施例】【Example】

以下、図示の実施例を参照しながら本考案を更に説明する。図1は本考案によ る可撓性回路基板の接続構造の概念的な要部断面構成図を示し、可撓性回路基板 は、既述の如く、可撓性絶縁基材4の一方面に形成された配線パタ−ン6とこの 配線パタ−ン6の上面に被覆した表面保護層3とを有し、上記配線パタ−ン6の 露出したランド部6Aにはランド穴7を形成してある。 Hereinafter, the present invention will be further described with reference to the illustrated embodiments. FIG. 1 is a conceptual cross-sectional configuration diagram of a flexible circuit board connection structure according to the present invention. The flexible circuit board is, as described above, one side of the flexible insulating substrate 4. The wiring pattern 6 formed on the wiring pattern 6 and the surface protection layer 3 covering the upper surface of the wiring pattern 6 are formed, and the land hole 7 is formed in the exposed land portion 6A of the wiring pattern 6. There is.

【0009】 1はアルミニウム板等の適当な導電性金属部材であって、上記可撓性回路基板 はその可撓性絶縁基材4の側を導電性金属部材1に接着剤を用いて貼着し、且つ 導電性金属部材1に透孔5を設ける際に形成されたバリ部2を可撓性回路基板の ランド穴7に装着し、そのバリ部2をカシメてランド部6Aに圧着することによ り所定の配線パタ−ン6をそのランド部6A及びカシメ圧着したバリ部2を通し て導電性金属部材1に接地接続するように構成してある。Reference numeral 1 is a suitable conductive metal member such as an aluminum plate, and the flexible circuit board is attached to the conductive metal member 1 with an adhesive agent on the flexible insulating substrate 4 side. And, the burr portion 2 formed when the through hole 5 is provided in the conductive metal member 1 is mounted in the land hole 7 of the flexible circuit board, and the burr portion 2 is crimped to the land portion 6A. Thus, the predetermined wiring pattern 6 is grounded to the conductive metal member 1 through the land portion 6A and the burr portion 2 crimped and crimped.

【0010】 上記の如き接地接続構造を得る為の導電性金属部材1にバリ部2を形成するに は、図2のように適当な打抜き具8を用いて導電性金属部材1に於ける一方面の 所定箇所から透孔5を形成すると、その際の貫通方向に沿ってバリ部2が透孔5 の周囲に突出形成される。そこで、図3の如く、この突出バリ部2を可撓性回路 基板に於けるランド穴7に挿入した状態で可撓性回路基板と導電性金属部材1と を相互に貼着し、次いでランド穴7から突出しているバリ部2をカシメてランド 部6Aの表面に圧着することによって、図1の如き可撓性回路基板と導電性金属 部材1との間の接地接続構造を簡便に得ることができる。To form the burr portion 2 on the conductive metal member 1 for obtaining the ground connection structure as described above, an appropriate punching tool 8 is used as shown in FIG. When the through hole 5 is formed from a predetermined position on the direction surface, the burr portion 2 is formed so as to project around the through hole 5 along the penetrating direction at that time. Therefore, as shown in FIG. 3, the flexible circuit board and the conductive metal member 1 are adhered to each other with the protruding burr portion 2 inserted in the land hole 7 in the flexible circuit board, and then the land is formed. By simply crimping the burr portion 2 protruding from the hole 7 onto the surface of the land portion 6A, a ground connection structure between the flexible circuit board and the conductive metal member 1 as shown in FIG. 1 can be easily obtained. You can

【0011】 上記のような可撓性回路基板の接続構造に於いて、導電性金属部材1は可撓性 回路基板の所定の配線パタ−ン6を接地させる相手方部材となり、また、可撓性 回路基板を部分的に補強する機能をも果たす。In the above-mentioned flexible circuit board connection structure, the conductive metal member 1 serves as a counterpart member for grounding a predetermined wiring pattern 6 of the flexible circuit board, and also has flexibility. It also functions to partially reinforce the circuit board.

【0012】[0012]

【考案の効果】[Effect of the device]

本考案に係る可撓性回路基板の接続構造によれば、接地させる為の導電性金属 部材にバリ部を突出形成し、そのバリ部をカシメて可撓性回路基板に於ける所定 の配線パタ−ンのランド部に圧着させるので、その所定の配線パタ−ンと導電性 金属部材との間に電気・機械的に確実な接地接続構造を簡便に形成できる。 According to the flexible circuit board connection structure of the present invention, a burr portion is formed on a conductive metal member for grounding, and the burr portion is caulked to form a predetermined wiring pattern on the flexible circuit board. Since it is pressure-bonded to the land portion of the mold, an electrically and mechanically reliable ground connection structure can be easily formed between the predetermined wiring pattern and the conductive metal member.

【0013】 可撓性回路基板と導電性金属部材とを貼着する為に用いる接着剤が可撓性回路 基板のランド穴に染み出た場合でも接続不良等を発生させることなくカシメ圧着 手段で上記の如き接地接続構造を確実に得ることができる。Even if the adhesive used for attaching the flexible circuit board and the conductive metal member to the land hole of the flexible circuit board seeps out, the caulking crimping means does not cause connection failure or the like. It is possible to reliably obtain the ground connection structure as described above.

【0014】 導電性金属部材は所定の配線パタ−ンを接地させる為の相手方部材として機能 する他、可撓性回路基板を部分的に補強するという利点も有する。The conductive metal member functions as a counterpart member for grounding a predetermined wiring pattern, and also has an advantage of partially reinforcing the flexible circuit board.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本考案による可撓性回路基板の接続構造の要
部断面構成図。
FIG. 1 is a cross-sectional view of a main part of a flexible circuit board connection structure according to the present invention.

【図2】 本考案で用いる導電性金属部材の製作説明
図。
FIG. 2 is an explanatory view of manufacturing a conductive metal member used in the present invention.

【図3】 本考案により可撓性回路基板を導電性金属部
材に貼着した図。
FIG. 3 is a view in which a flexible circuit board is attached to a conductive metal member according to the present invention.

【図4】 従来の可撓性回路基板の接続構造の要部断面
構成図。
FIG. 4 is a cross-sectional configuration diagram of a main part of a conventional flexible circuit board connection structure.

【図5】 従来の他の可撓性回路基板の接続構造の要部
断面構成図。
FIG. 5 is a cross-sectional configuration diagram of a main part of another conventional connection structure for a flexible circuit board.

【符号の説明】[Explanation of symbols]

1 導電性金属部材 6A ランド部 2 バリ部 7 ランド穴 3 表面保護層 8 打抜き具 4 可撓性絶縁基材 9 導電性金属部材 5 透孔 10 半田 6 配線パタ−ン 12 金属シャ−シ DESCRIPTION OF SYMBOLS 1 Conductive metal member 6A Land part 2 Burr part 7 Land hole 3 Surface protective layer 8 Punching tool 4 Flexible insulating base material 9 Conductive metal member 5 Through hole 10 Solder 6 Wiring pattern 12 Metal chassis

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 可撓性回路基板の所定の配線パタ−ンを
接地する為に導電性金属部材と電気的に接続する為の構
造に於いて、上記導電性金属部材にバリ部を突出形成し
た透孔を設け、上記配線パタ−ンのランド部に上記バリ
部を挿入させる為のランド穴を設け、このランド穴に上
記バリ部を挿入させて上記導電性金属部材の上面に上記
可撓性回路基板を装着した状態で上記バリ部をカシメて
上記ランド部に圧着させることにより上記配線パタ−ン
と上記導電性金属部材とを電気的に接続するように構成
したことを特徴とする可撓性回路基板の接続構造。
1. A structure for electrically connecting a predetermined wiring pattern of a flexible circuit board to a conductive metal member for grounding, wherein a burr portion is projectingly formed on the conductive metal member. Through holes, land holes for inserting the burrs into the lands of the wiring pattern, the burrs into the lands, and the flexible surface on the upper surface of the conductive metal member. It is characterized in that the wiring pattern and the conductive metal member are electrically connected by crimping the burr portion and crimping it to the land portion with the flexible circuit board mounted. Flexible circuit board connection structure.
JP1991105210U 1991-11-27 1991-11-27 Flexible circuit board connection structure Expired - Fee Related JP2544126Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991105210U JP2544126Y2 (en) 1991-11-27 1991-11-27 Flexible circuit board connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991105210U JP2544126Y2 (en) 1991-11-27 1991-11-27 Flexible circuit board connection structure

Publications (2)

Publication Number Publication Date
JPH0548372U true JPH0548372U (en) 1993-06-25
JP2544126Y2 JP2544126Y2 (en) 1997-08-13

Family

ID=14401307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991105210U Expired - Fee Related JP2544126Y2 (en) 1991-11-27 1991-11-27 Flexible circuit board connection structure

Country Status (1)

Country Link
JP (1) JP2544126Y2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5880896A (en) * 1981-11-09 1983-05-16 新藤電子工業株式会社 Method of producing through hole lint circuit board
JPS60193404A (en) * 1984-03-15 1985-10-01 ワイケイケイ株式会社 Slide fastener with openable and separable inlay and insert tool
JPH01173694A (en) * 1987-12-26 1989-07-10 Shindo Denshi Kogyo Kk Manufacture of double-faced through-hole film carrier
JPH0327588A (en) * 1989-06-23 1991-02-05 Toshiba Corp Manufacture of circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5880896A (en) * 1981-11-09 1983-05-16 新藤電子工業株式会社 Method of producing through hole lint circuit board
JPS60193404A (en) * 1984-03-15 1985-10-01 ワイケイケイ株式会社 Slide fastener with openable and separable inlay and insert tool
JPH01173694A (en) * 1987-12-26 1989-07-10 Shindo Denshi Kogyo Kk Manufacture of double-faced through-hole film carrier
JPH0327588A (en) * 1989-06-23 1991-02-05 Toshiba Corp Manufacture of circuit board

Also Published As

Publication number Publication date
JP2544126Y2 (en) 1997-08-13

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