JPH0547517Y2 - - Google Patents
Info
- Publication number
- JPH0547517Y2 JPH0547517Y2 JP1988057147U JP5714788U JPH0547517Y2 JP H0547517 Y2 JPH0547517 Y2 JP H0547517Y2 JP 1988057147 U JP1988057147 U JP 1988057147U JP 5714788 U JP5714788 U JP 5714788U JP H0547517 Y2 JPH0547517 Y2 JP H0547517Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- solder
- circuit board
- partition plate
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 46
- 238000005192 partition Methods 0.000 claims description 44
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000001351 cycling effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Receivers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988057147U JPH0547517Y2 (US20020128544A1-20020912-P00008.png) | 1988-04-26 | 1988-04-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988057147U JPH0547517Y2 (US20020128544A1-20020912-P00008.png) | 1988-04-26 | 1988-04-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01161395U JPH01161395U (US20020128544A1-20020912-P00008.png) | 1989-11-09 |
JPH0547517Y2 true JPH0547517Y2 (US20020128544A1-20020912-P00008.png) | 1993-12-14 |
Family
ID=31283002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988057147U Expired - Lifetime JPH0547517Y2 (US20020128544A1-20020912-P00008.png) | 1988-04-26 | 1988-04-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0547517Y2 (US20020128544A1-20020912-P00008.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2504985Y2 (ja) * | 1989-07-27 | 1996-07-24 | 株式会社村田製作所 | 高周波回路装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58135997U (ja) * | 1982-03-09 | 1983-09-13 | 株式会社村田製作所 | シ−ルド板 |
-
1988
- 1988-04-26 JP JP1988057147U patent/JPH0547517Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01161395U (US20020128544A1-20020912-P00008.png) | 1989-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4836435A (en) | Component self alignment | |
JPS631099A (ja) | シ−ルド装置 | |
US2825010A (en) | Method and means for mounting printed circuits | |
JPH08125379A (ja) | シールド装置 | |
JPH0547517Y2 (US20020128544A1-20020912-P00008.png) | ||
EP0957665B1 (en) | Electronic device | |
JP2001024375A (ja) | シールド構造 | |
JPH07147495A (ja) | プリント基板表面実装用シールドケース | |
JP3067326B2 (ja) | 半田付け方法 | |
JP2529605Y2 (ja) | 高周波機器 | |
JPH07240591A (ja) | シールドケースを有するプリント基板及びその製造方法 | |
JP2000244080A (ja) | プリント配線板 | |
JPS631098A (ja) | シ−ルド装置 | |
JPH0217513Y2 (US20020128544A1-20020912-P00008.png) | ||
JPH071836Y2 (ja) | 回路基板のシールド装置 | |
JPH01158789A (ja) | アース構造 | |
KR890004673B1 (ko) | 튜너의 실드 케이스 | |
JPH027512Y2 (US20020128544A1-20020912-P00008.png) | ||
JPH0219996Y2 (US20020128544A1-20020912-P00008.png) | ||
KR900007328Y1 (ko) | 고주파장치 | |
JPH01125897A (ja) | 高周波回路のシールド装置 | |
JPH03104198A (ja) | 表面実装型シールドケース | |
JPH021907Y2 (US20020128544A1-20020912-P00008.png) | ||
US4857375A (en) | Shielding of semiconductor module | |
JPH0310690Y2 (US20020128544A1-20020912-P00008.png) |