JPH054703Y2 - - Google Patents
Info
- Publication number
- JPH054703Y2 JPH054703Y2 JP1988011583U JP1158388U JPH054703Y2 JP H054703 Y2 JPH054703 Y2 JP H054703Y2 JP 1988011583 U JP1988011583 U JP 1988011583U JP 1158388 U JP1158388 U JP 1158388U JP H054703 Y2 JPH054703 Y2 JP H054703Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- case
- reinforcing body
- fpc
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 33
- 238000005452 bending Methods 0.000 claims description 25
- 230000001681 protective effect Effects 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011583U JPH054703Y2 (US20100223739A1-20100909-C00005.png) | 1988-01-30 | 1988-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011583U JPH054703Y2 (US20100223739A1-20100909-C00005.png) | 1988-01-30 | 1988-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01117087U JPH01117087U (US20100223739A1-20100909-C00005.png) | 1989-08-08 |
| JPH054703Y2 true JPH054703Y2 (US20100223739A1-20100909-C00005.png) | 1993-02-05 |
Family
ID=31220267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988011583U Expired - Lifetime JPH054703Y2 (US20100223739A1-20100909-C00005.png) | 1988-01-30 | 1988-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054703Y2 (US20100223739A1-20100909-C00005.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000331734A (ja) * | 1999-03-16 | 2000-11-30 | Denso Corp | 表面実装型コネクタ及び回路装置の製造方法 |
-
1988
- 1988-01-30 JP JP1988011583U patent/JPH054703Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01117087U (US20100223739A1-20100909-C00005.png) | 1989-08-08 |
