JPH0545986Y2 - - Google Patents
Info
- Publication number
- JPH0545986Y2 JPH0545986Y2 JP5521886U JP5521886U JPH0545986Y2 JP H0545986 Y2 JPH0545986 Y2 JP H0545986Y2 JP 5521886 U JP5521886 U JP 5521886U JP 5521886 U JP5521886 U JP 5521886U JP H0545986 Y2 JPH0545986 Y2 JP H0545986Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- electronic components
- cover member
- measurement
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000005259 measurement Methods 0.000 description 19
- 238000012360 testing method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5521886U JPH0545986Y2 (enrdf_load_html_response) | 1986-04-11 | 1986-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5521886U JPH0545986Y2 (enrdf_load_html_response) | 1986-04-11 | 1986-04-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62167175U JPS62167175U (enrdf_load_html_response) | 1987-10-23 |
| JPH0545986Y2 true JPH0545986Y2 (enrdf_load_html_response) | 1993-11-30 |
Family
ID=30882922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5521886U Expired - Lifetime JPH0545986Y2 (enrdf_load_html_response) | 1986-04-11 | 1986-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0545986Y2 (enrdf_load_html_response) |
-
1986
- 1986-04-11 JP JP5521886U patent/JPH0545986Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62167175U (enrdf_load_html_response) | 1987-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0513913A (ja) | 回路基板に対するフレキシブルケーブルの接続装置 | |
| US3136591A (en) | Printed circuit board assembly | |
| JPH0545986Y2 (enrdf_load_html_response) | ||
| US6664794B1 (en) | Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture | |
| US3755888A (en) | Method of testing modular electronic circuits | |
| JPH0755877A (ja) | 環境試験装置 | |
| EP0287274A2 (en) | Semiconductor hybrid device | |
| US3747046A (en) | Receptacle for large scale integrated circuit (l.s.i) package | |
| US3848947A (en) | Electrical circuit board terminal springclip | |
| ES2084589T3 (es) | Conector de pruebas para circuitos en tecnica smd y su procedimiento de fabricacion. | |
| JPS5817337Y2 (ja) | プリント基板用端子装置 | |
| JPS6313506Y2 (enrdf_load_html_response) | ||
| JPS6134701Y2 (enrdf_load_html_response) | ||
| JPH0124944Y2 (enrdf_load_html_response) | ||
| JPH0132295Y2 (enrdf_load_html_response) | ||
| JPS5822136Y2 (ja) | 端子チエツク装置 | |
| JPH04294080A (ja) | 回路基板とピングリットアレイとの接続方法，及びその方法に使用される接続器 | |
| JPH0555573U (ja) | 電子機器のプリント板 | |
| EP0303370A3 (en) | Circuit board component spacer | |
| JPH04166772A (ja) | 電圧印加試験用治具 | |
| JPS5914394U (ja) | 混成集積回路基板 | |
| JPH04181793A (ja) | バーンイン用プリント板 | |
| JPH1064637A (ja) | 表面実装コネクタ | |
| JPH05211282A (ja) | ハイブリッドｉｃ | |
| JPH0529748A (ja) | 印刷配線板の高密度実装方法 |